SENSOR DEVICE AND VALVE ASSEMBLY WITH IMPROVED SEALING FEATURES

    公开(公告)号:US20230345657A1

    公开(公告)日:2023-10-26

    申请号:US18217509

    申请日:2023-06-30

    IPC分类号: H05K5/06 H05K5/02

    摘要: A sensor device includes a housing, a circuit substrate, a sensing element, and a sleeve. The sensor device further includes an inner cavity and a channel located on different sides of the circuit substrate, respectively. The sleeve has a cylinder wall located on a periphery of the channel. A tail end of the cylinder wall in an axial direction of the channel is sealably connected to the circuit substrate. The housing is provided with a matching part including an accommodation part and a first peripheral wall part forming the accommodation part. The sleeve is at least partially accommodated in the accommodation part. The first peripheral wall part is sealably connected to the cylinder wall. The inner cavity is not communicated with the channel. The sealing performance between the inner cavity of the sensor device and the channel is good. Also provided is a valve assembly having the sensor device.

    HEAT EXCHANGER
    66.
    发明申请

    公开(公告)号:US20220325956A1

    公开(公告)日:2022-10-13

    申请号:US17256627

    申请日:2020-09-25

    摘要: The present disclosure discloses a heat exchanger including a group of collecting pipes and a number of heat exchange assemblies. Each heat exchange assembly includes a fin plate and at least one heat exchange tube. The heat exchange assembly includes a main heat exchange area. The heat exchange tube is connected with the fin plate. The heat exchange tube at least partially protrudes from at least one side of the fin plate. In addition, in the main heat exchange area corresponding to two adjacent heat exchange assemblies, at least two adjacent heat exchange tubes are staggered along an array direction of the heat exchange assemblies. The two heat exchange tubes respectively belong to the two adjacent heat exchange assemblies. The present disclosure is beneficial to improve the performance of the heat exchanger.

    SENSOR AND HEAT EXCHANGER
    67.
    发明申请

    公开(公告)号:US20220120592A1

    公开(公告)日:2022-04-21

    申请号:US17566043

    申请日:2021-12-30

    IPC分类号: G01D11/24 G01D11/30 F28F27/00

    摘要: A sensor includes a housing, a circuit board, and a sensor chip fixed on the circuit board. The housing defines a receiving cavity and a first channel extending through the housing. The first channel communicates with the receiving cavity and an outside of the sensor. The circuit board is at least partially received in the receiving cavity. At least a part of the circuit board is bonded and fixed to the housing by a thermal conductive glue. The sensor chip is adapted for sensing at least one of a humidity signal and a temperature signal of an environment in the receiving cavity. As a result, the monitoring accuracy is relatively improved.

    HEAT EXCHANGER AND HEAT EXCHANGE SYSTEM

    公开(公告)号:US20220107146A1

    公开(公告)日:2022-04-07

    申请号:US17552888

    申请日:2021-12-16

    摘要: A heat exchanger includes a first collecting pipe, a number of heat exchange tubes and a partition plate. The heat exchange tubes are inserted into the first collecting pipe. By means of the partition plate, a first inner cavity of the first collecting pipe is divided into a first sub-cavity and a second sub-cavity. One end of each heat exchange tube is in communication with the first sub-cavity. In the process of a refrigerant entering the first collecting pipe, the refrigerant flows into the second sub-cavity firstly, and forms a severe turbulence effect after interacting with the heat exchange tubes inserted into the second sub-cavity. Then, the refrigerant flows into the first sub-cavity through holes provided in the partition plate, and then flows into the heat exchange tubes. As a result, the uniformity of the two-phase refrigerant distribution can be relatively improved.

    THERMAL MANAGEMENT SYSTEM
    69.
    发明申请

    公开(公告)号:US20220072927A1

    公开(公告)日:2022-03-10

    申请号:US17419284

    申请日:2020-09-16

    摘要: A thermal management system includes a cooling liquid circulation flow path, a refrigerant circulation flow path and a first heat exchanger. The first heat exchanger includes a first heat exchange portion and a second heat exchange portion. The cooling liquid circulation flow path includes a first heat exchange assembly, a second heat exchange assembly and a first branch. The thermal management system has a heating mode. After passing through the first heat exchange assembly, one path of the cooling liquid flows to the first branch, and another path of the cooling liquid flows to the second heat exchange assembly. The cooling liquid after flowing through the first branch and after flowing through the second heat exchange assembly merge and then flow to the first heat exchange portion. As a result, the number of heat exchangers used by the thermal management system to recover waste heat is reduced.