公开(公告)号：US20080122560A1

公开(公告)日：2008-05-29

申请号：US11593896

申请日：2006-11-07

申请人： Lianjun Liu

发明人： Lianjun Liu

IPC分类号： H01P1/00 ,  H01L21/50

CPC分类号： B81B7/0077 ,  B81B2207/092

摘要： An integrated passive device (20) includes a first wafer (22), a first integrated device (28) formed on a first surface (24) of the wafer (22), and a second integrated device (30) formed on a second surface (26) of the wafer (22), the second surface (26) opposing the first surface (24). A microelectromechanical (MEMS) device (72) includes a second wafer (74) having a MEMS component (76) formed thereon. The integrated passive device (20) and the MEMS device (72) are coupled to form an IPD/MEMS stacked device (70) in accordance with a fabrication process (90). The fabrication process (90) calls for forming (94) the second integrated device (30) on the second surface (26) of the wafer (22), constructing (100) the MEMS component (76) on the wafer (74), coupling (104) the wafers (22, 74), then creating the first integrated device (28) on the first surface (24) of the first wafer (22).

摘要翻译： 集成无源器件（20）包括第一晶片（22），形成在晶片（22）的第一表面（24）上的第一集成器件（28）和形成在晶片（22）的第二表面 （22）的第二表面（26），与第一表面（24）相对的第二表面（26）。 微机电（MEMS）装置（72）包括其上形成有MEMS部件（76）的第二晶片（74）。 集成无源器件（20）和MEMS器件（72）根据制造工艺（90）耦合以形成IPD / MEMS堆叠器件（70）。 制造工艺（90）要求在晶片（22）的第二表面（26）上形成（94）第二集成器件（30），在晶片（74）上构造（100）MEMS部件（76） 耦合（104）晶片（22,74），然后在第一晶片（22）的第一表面（24）上产生第一集成器件（28）。

公开(公告)号：US07280011B2

公开(公告)日：2007-10-09

申请号：US10501889

申请日：2002-11-25

申请人： Esen Bayar ,  Antony James Booth

发明人： Esen Bayar ,  Antony James Booth

IPC分类号： H01P1/00

CPC分类号： H01P1/207 ,  H01P1/211 ,  H01P11/007

摘要： A hollow waveguide (1) has a wall (3) having plural pegs (16) thereon. The pegs (16) which project into the hollow interior of the waveguide (1) such that the waveguide (1) propagates electromagnetic waves only below a certain frequency. The surface of each of the pegs (16) is substantially free of discontinuity and concavities. The waveguide (1) may be manufactured by a moulding process.

摘要翻译： 中空波导（1）具有在其上具有多个钉（16）的壁（3）。 突出到波导（1）的中空内部的钉（16），使得波导（1）仅在一定频率下传播电磁波。 每个钉（16）的表面基本上没有不连续和凹陷。 波导（1）可以通过模制工艺制造。

公开(公告)号：US07280010B2

公开(公告)日：2007-10-09

申请号：US10907425

申请日：2005-03-31

申请人： Kenneth V. Buer ,  David Laidig

发明人： Kenneth V. Buer ,  David Laidig

IPC分类号： H01P7/10 ,  H01P1/00

CPC分类号： H01P7/10

摘要： A RF interconnect comprising a dielectric resonator is disclosed. The dielectric resonator may be included in an interconnect housing. The dielectric resonator includes metalized side surfaces useful for securing the dielectric resonator in an aperture formed in the interconnect housing. The dimensions or material selected for the dielectric resonator may be predetermined to enable the dielectric resonator to operate as a filter or waveguide, as desired.

摘要翻译： 公开了一种包括介质谐振器的RF互连。 介质谐振器可以包括在互连壳体中。 介质谐振器包括用于将介质谐振器固定在互连壳体中形成的孔中的金属化侧表面。 选择用于介质谐振器的尺寸或材料可以是预定的，以使介电谐振器能够根据需要作为滤波器或波导进行操作。

公开(公告)号：US20060267713A1

公开(公告)日：2006-11-30

申请号：US11499162

申请日：2006-08-03

申请人： Richard Sweeney ,  Jason Snodgress

发明人： Richard Sweeney ,  Jason Snodgress

IPC分类号： H01P3/08 ,  H01P1/00

CPC分类号： H01P5/185 ,  H05K1/0218 ,  H05K1/144

摘要： Methods of assembling a coupler are provided in which a first printed circuit board is provided, and a second printed circuit board is then surface mounted on the first printed circuit board. The first printed circuit board and the second printed circuit board are then electrically and mechanically connected to provide a coupler having a shielded region defined between the first printed circuit board and the second printed circuit board. The shielded region at least partly surrounds a coupler circuit disposed therein.

摘要翻译： 提供组装耦合器的方法，其中提供第一印刷电路板，然后将第二印刷电路板表面安装在第一印刷电路板上。 然后将第一印刷电路板和第二印刷电路板电连接和机械连接，以提供具有限定在第一印刷电路板和第二印刷电路板之间的屏蔽区域的耦合器。 屏蔽区域至少部分地围绕设置在其中的耦合器电路。

公开(公告)号：US07132909B2

公开(公告)日：2006-11-07

申请号：US11108791

申请日：2005-04-19

申请人： Paul Mack

发明人： Paul Mack

IPC分类号： H01P1/00

CPC分类号： H01P3/123 ,  H01P1/207 ,  H01P3/12

摘要： A microwave component has a cavity including a plurality of geometrically shaped elements therein wherein the shape profile and position of the elements in relation to the cavity act to define the guiding properties of the cavity and therefore to define operational characteristics of the component.

公开(公告)号：US07064626B2

公开(公告)日：2006-06-20

申请号：US10093147

申请日：2002-03-07

申请人： Hiroaki Kukita ,  Hirofumi Yamagata

发明人： Hiroaki Kukita ,  Hirofumi Yamagata

IPC分类号： H01P1/00 ,  H01R33/00

CPC分类号： H01R13/719 ,  H01R12/52 ,  H01R12/716 ,  H01R13/7195

摘要： A board-to-board electrical connector is so constructed that when connectors 2 and 3 are fitted to each other, capacitive coupling plates 24 and 34 are brought into the state in which they partly confront each other, with a space between each other, and also a coupling capacitance between the capacitive coupling plates 24 and 34 is adjusted by adjusting an area formed by partly confronting portions of the capacitive coupling plates 24 and 34 and a distance between the partly confronting portions of the capacitive coupling plates 24 and 34. With this construction, the board-to-board electrical connector having a specified band-pass characteristic is achieved.

摘要翻译： 板对板电连接器被构造成使得当连接器2和3彼此配合时，电容耦合板24和34进入它们彼此部分相对的状态，彼此之间具有空间，并且 电容耦合板24和34之间的耦合电容也通过调节由电容耦合板24和34的部分面对部分形成的区域以及电容耦合板24和34的部分面对部分之间的距离来调节。 通过这种结构，实现了具有特定带通特性的板对板电连接器。

公开(公告)号：US20050272609A1

公开(公告)日：2005-12-08

申请号：US11203956

申请日：2005-08-16

申请人： Akihiko Akasegawa ,  Kazunori Yamanaka ,  Teru Nakanishi

发明人： Akihiko Akasegawa ,  Kazunori Yamanaka ,  Teru Nakanishi

IPC分类号： H01B12/02 ,  H01P1/00 ,  H01P1/202 ,  H01P3/06

CPC分类号： H01P3/06 ,  Y10T29/49014

摘要： A transmission line is provided which has a low loss and can flow large current. A superconductor transmission line has: an internal conductor; and an external conductor surrounding the internal conductor, made of oxide superconductor and having four planes, which four planes have a cross section of a hollow quadrilateral with each corner portion being removed, and adjacent planes of which define a slit narrower than λ/4 (λ being a wavelength of a high frequency wave to be transmitted).

摘要翻译： 提供了具有低损耗并且可能流过大电流的传输线。 超导体传输线具有：内部导体; 以及围绕内部导体的外部导体，由氧化物超导体构成，并且具有四个平面，该四个平面具有中空四边形的横截面，每个角部被去除，并且其相邻平面限定窄于λ/ 4 λ是待传输的高频波的波长）。

公开(公告)号：US20050253662A1

公开(公告)日：2005-11-17

申请号：US10847216

申请日：2004-05-17

申请人： Jeffrey Seefried

发明人： Jeffrey Seefried

IPC分类号： H01P1/00 ,  H01P5/02 ,  H01R4/24 ,  H01R24/00 ,  H05K1/00 ,  H05K1/02 ,  H05K1/16

CPC分类号： H01R13/6466 ,  H01R4/2429 ,  H01R24/64 ,  H05K1/0228 ,  H05K1/0298 ,  H05K1/162 ,  H05K2201/09236 ,  H05K2201/10189

摘要： A insulation displacement connector (IDC) patch panel includes a circuit (PC) board with interdigitated capacitance for balancing out inherent capacitance found within IDCs of the panel and conventional plug connectors coupled to the panel. Unwanted cross-talk signals are reduced as a consequence.

摘要翻译： 绝缘位移连接器（IDC）接线板包括具有交叉电容的电路（PC）板，用于平衡面板IDC内发现的固有电容和耦合到面板的常规插头连接器。 因此，不希望的串扰信号被减少。

公开(公告)号：US06949992B2

公开(公告)日：2005-09-27

申请号：US10103277

申请日：2002-03-20

申请人： Richard Sweeney ,  Jason Snodgress

发明人： Richard Sweeney ,  Jason Snodgress

IPC分类号： H01P1/04 ,  H01P3/08 ,  H01P5/08 ,  H05K1/02 ,  H05K3/22 ,  H01P1/00

CPC分类号： H01P3/085 ,  H01P1/047 ,  H01P3/081 ,  H01P5/08 ,  H05K1/0219 ,  H05K1/0243 ,  H05K3/222 ,  H05K2201/0715 ,  H05K2201/09618 ,  H05K2201/09727

摘要： A surface mount technology (“SMT”) apparatus for use in routing radio frequencies (“RF”) between cavities that require a high level of isolation on a single printed circuit board (“PCB”). The SMT part is attached to the PCB over a stripline-ready trace which transitions to microstrip before and after the SMT stripline part to maintain consistent characteristic impedance. When presented with a high isolation need between two cavities using microstrip transmission lines, the proposed stripline SMT apparatus under the isolation wall will tend to provide the necessary isolation. The present invention provides a repeatable and reliable interconnect while improving the electrical match between the two cavities. Furthermore, the invention removes the costs associated with manually forming and soldering cables between PCBs.

摘要翻译： 用于在单个印刷电路板（“PCB”）上需要高水平隔离的空腔之间路由射频（“RF”）的表面贴装技术（“SMT”）装置。 SMT部件通过带状线准备的跟踪连接到PCB，在SMT带状线部件之前和之后转换到微带线，以保持一致的特性阻抗。 当使用微带传输线在两个空腔之间呈现高隔离需求时，在隔离壁下方的所提出的带状线SMT装置将倾向于提供必要的隔离。 本发明提供可重复且可靠的互连，同时改善两个腔之间的电气匹配。 此外，本发明消除了在PCB之间手动形成和焊接电缆的成本。

公开(公告)号：US20050196126A1

公开(公告)日：2005-09-08

申请号：US11067832

申请日：2005-02-28

申请人： Yuichi Sugiyama

发明人： Yuichi Sugiyama

IPC分类号： H01P1/213 ,  G02B6/00 ,  H01P1/00 ,  H01P3/08 ,  H01P3/12 ,  H01Q1/00 ,  H04Q1/02 ,  H04Q1/14 ,  H05K7/18

CPC分类号： H04Q1/09 ,  G02B6/4452

摘要： A wireless communication system comprises a plurality of wireless communication apparatus, a plurality of sub-racks, and a rack. The wireless communication apparatus comprises a demultiplexing circuit, a cable to be connected to the demultiplexing circuit, a waveguide interface to be connected to the cable, and a waveguide to connect the waveguide interface and the antenna. A plurality of sub-racks for each housing the wireless communication apparatus to be connected to an antenna are installed in the rack. Among a plurality of the wireless communication apparatus which are different from one another, a pair of the waveguide interface and waveguide is disposed at a different position from other pair/pairs of waveguide interface and waveguide on a predetermined projectional plane. The waveguide assigned to each of the wireless communication apparatus extends along an outside of the sub-rack.

摘要翻译： 无线通信系统包括多个无线通信装置，多个子机架和机架。 无线通信装置包括解复用电路，要连接到解复用电路的电缆，要连接到电缆的波导接口以及用于连接波导接口和天线的波导。 用于每个容纳要连接到天线的无线通信装置的多个子机架安装在机架中。 在彼此不同的多个无线通信装置中，一对波导接口和波导设置在与预定的投影面上的其他对/波导对接口和波导的不同位置。 分配给每个无线通信装置的波导沿着子机架的外部延伸。