Positive Resist Material And Patterning Process

    公开(公告)号:US20240168379A1

    公开(公告)日:2024-05-23

    申请号:US18380475

    申请日:2023-10-16

    发明人: Jun HATAKEYAMA

    IPC分类号: G03F7/004 G03F7/039

    CPC分类号: G03F7/0045 G03F7/0392

    摘要: The present invention is a positive resist material containing a compound having two or more urethane groups and having two or more carboxy groups that are each substituted with an acid-labile group and are bonded to the urethane groups via a linking group. This provides: a positive resist material that has higher sensitivity and higher resolution than conventional positive resist materials and smaller edge roughness and CDU, and allows excellent pattern profile after exposure to light; and a patterning process.

    SELECTIVE HARDMASK ON HARDMASK
    57.
    发明公开

    公开(公告)号:US20240168371A1

    公开(公告)日:2024-05-23

    申请号:US18165759

    申请日:2023-02-07

    摘要: Disclosed is a method of manufacturing a semiconductor device. The method includes forming a patterned hardmask over an underlying target layer on a substrate; and performing plasma fabrication operations in parallel on the patterned hardmask and underlying target layer in a plasma etching chamber using a plasma etch gas and a selective source gas. The plasma operations include forming a protective cap on the patterned hardmask; and removing portions of the underlying layer that are not covered by the patterned hardmask. In various embodiments, the selective source gas includes a chemical compound that includes a halogen gas that can be dissociated into a metal and a halogen, and the plasma operations include dissociating the metal and the halogen in the selective source gas and forming a protective cap on the patterned hardmask using the metal that has been dissociated.