Beamforming antenna module comprising lens

    公开(公告)号:US11641063B2

    公开(公告)日:2023-05-02

    申请号:US16767860

    申请日:2018-11-19

    Abstract: The present invention relates to a communication technique for fusing a 5G communication system to support a higher data transmission rate than a 4G system, with IoT technology, and a system thereof. This disclosure is based on 5G communication technology and the IoT related technology and can be applied to intelligent services (for example, smart home, smart building, smart city, smart car or connected car, healthcare, digital education, retail, security, safety-related services, or the like). In addition, the present invention provides an antenna module comprising an antenna and a lens, wherein the antenna comprises a first antenna array which deflects and radiates a radio wave from a vertical plane of the antenna by a predetermined first angle, and the lens can be spaced apart from the antenna by a first determined distance to change the phase of the radio wave radiated from the antenna.

    INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME

    公开(公告)号:US20220262728A1

    公开(公告)日:2022-08-18

    申请号:US17739574

    申请日:2022-05-09

    Abstract: An integrated circuit device includes a conductive line including a metal layer and an insulation capping structure covering the conductive line. The first insulation capping structure includes a first insulation capping pattern that is adjacent to the metal layer in the insulation capping structure and has a first density, and a second insulation capping pattern spaced apart from the metal layer with the first insulation capping pattern therebetween and having a second density that is greater than the first density. In order to manufacture the integrated circuit device, the conductive line having a metal layer is formed on a substrate, a first insulation capping layer having the first density is formed directly on the metal layer, and a second insulation capping layer having the second density that is greater than the first density is formed on the first insulation capping layer.

    Module comprising antenna and RF element, and base station including same

    公开(公告)号:US11063371B2

    公开(公告)日:2021-07-13

    申请号:US17063929

    申请日:2020-10-06

    Abstract: A communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT) are provided. The disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. According to the disclosure, an antenna module includes a first substrate layer on which at least one substrate is stacked; an antenna coupled to an upper end surface of the first substrate layer; a second substrate layer having an upper end surface coupled to a lower end surface of the first substrate layer and on which at least one substrate is stacked; and a radio frequency (RF) element coupled to a lower end surface of the second substrate layer.

    Module comprising antenna and RF element, and base station including same

    公开(公告)号:US10797405B1

    公开(公告)日:2020-10-06

    申请号:US16906476

    申请日:2020-06-19

    Abstract: A communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT) are provided. The disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. According to the disclosure, an antenna module includes a first substrate layer on which at least one substrate is stacked; an antenna coupled to an upper end surface of the first substrate layer; a second substrate layer having an upper end surface coupled to a lower end surface of the first substrate layer and on which at least one substrate is stacked; and a radio frequency (RF) element coupled to a lower end surface of the second substrate layer.

Patent Agency Ranking