公开(公告)号：US20210375983A1

公开(公告)日：2021-12-02

申请号：US17400354

申请日：2021-08-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Junhee CHOI ,  Sungjin Kang ,  Kiho Kong ,  Junghun Park ,  Jinjoo Park ,  Joohun Han ,  Kyungwook Hwang

IPC: H01L27/15 ,  H01L33/00 ,  H01L33/14 ,  H01L33/22 ,  H01L33/40 ,  H01L33/42 ,  H01L33/50 ,  H01L33/60

Abstract: Provided are a display apparatus and a method of manufacturing the same. The display apparatus includes a support substrate, a driving layer provided on the support substrate and including a driving element configured to apply power to a pixel electrode, and a light-emitting layer provided on the driving layer.

公开(公告)号：US20210119079A1

公开(公告)日：2021-04-22

申请号：US16831194

申请日：2020-03-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Junsik HWANG ,  Sungjin Kang ,  Kyungwook Hwang ,  Junhee Choi

IPC: H01L33/20 ,  H01L33/38 ,  H01L33/62 ,  H01L25/075

Abstract: A light-emitting diode (LED) includes a first semiconductor layer, an active layer, and a second semiconductor layer that are sequentially stacked, and includes a first electrode pad, a second electrode pad and a third electrode pad disposed on the second semiconductor layer in a direction from a corner of the second semiconductor layer to an opposite corner of the second semiconductor layer. An LED includes a first electrode pad disposed at a center of the LED and in contact with a P-type semiconductor layer and a second electrode pad in contact with an N-type semiconductor layer, wherein the second electrode pad is disposed a maximum distance away from the first electrode pad on the same surface.

公开(公告)号：US12249673B2

公开(公告)日：2025-03-11

申请号：US17519754

申请日：2021-11-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seogwoo Hong ,  Hyunjoon Kim ,  Joonyong Park ,  Kyungwook Hwang ,  Junsik Hwang

IPC: H01L25/075 ,  H01L25/16 ,  H01L27/15 ,  H01L33/06 ,  H01L33/38

Abstract: Provided is a light-emitting device including a body including a first semiconductor layer, an active layer, and a second semiconductor layer, a first electrode and a second electrode provided on a first surface of the body, the first electrode and the second electrode being in contact with the first semiconductor layer and the second semiconductor layer, respectively, and a third electrode and a fourth electrode provided on a second surface of the body, the third electrode and the fourth electrode being in contact with the first semiconductor layer and the second semiconductor layer, respectively.

公开(公告)号：US12230525B2

公开(公告)日：2025-02-18

申请号：US17383012

申请日：2021-07-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyungwook Hwang ,  Hyunjoon Kim ,  Joonyong Park ,  Seogwoo Hong ,  Junsik Hwang

IPC: H01L21/68 ,  H01L21/683 ,  H01L25/075 ,  H01L33/00

Abstract: A micro-semiconductor chip wet alignment apparatus is provided. The micro-semiconductor chip wet alignment apparatus includes a semiconductor chip wet supply module configured to supply the plurality of micro-semiconductor chips and a liquid onto the transfer substrate so that the plurality of micro-semiconductor chips are flowable on the transfer substrate; and a chip alignment module including an absorber capable of relative movement along a surface of the transfer substrate and configured to absorb the liquid so that the plurality of micro-semiconductor chips are aligned in the plurality of grooves.

公开(公告)号：US12166021B2

公开(公告)日：2024-12-10

申请号：US17990953

申请日：2022-11-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyungwook Hwang ,  Junsik Hwang ,  Hyunjoon Kim ,  Joonyong Park ,  Seogwoo Hong

IPC: H01L25/13 ,  H01L23/00

Abstract: Provided is a method of manufacturing a micro light emitting device array. The method includes forming a display transfer structure including a transfer substrate and a plurality of micro light emitting devices, where the transfer substrate includes at least two first alignment marks; preparing a driving circuit board, the driving circuit board including a plurality of driving circuits and at least two second alignment marks, arranging the display transfer structure and the driving circuit board to face each other so that the at least two first alignment marks and the at least two second alignment marks face one another and bonding the plurality of micro light emitting devices of the display transfer structure to the plurality of driving circuits.

公开(公告)号：US12165890B2

公开(公告)日：2024-12-10

申请号：US17469390

申请日：2021-09-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Joonyong Park ,  Dongho Kim ,  Hyunjoon Kim ,  Seogwoo Hong ,  Kyungwook Hwang ,  Junsik Hwang

IPC: H01L21/67 ,  H01L21/673 ,  H01L33/00

Abstract: Provided is a dispenser for a solution including a reservoir configured to hold a suspension of micro light-emitting diodes (LEDs) suspended in a solvent; a stirrer configured to stir the suspension in the reservoir; a discharge path including a first valve configured to control outflow of the suspension from the reservoir; a filling path including a second valve configured to control inflow of the suspension into the reservoir; a hydraulic path including a third valve configured to control a pressure inside the reservoir; and a washing path connected to the first valve and configured to input a washing fluid for washing the discharge path into the discharge path, wherein the first valve includes a multi-way valve configured to selectively connect the discharge path to one of the reservoir and the washing path.

公开(公告)号：US12087754B2

公开(公告)日：2024-09-10

申请号：US17667241

申请日：2022-02-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyungwook Hwang ,  Junsik Hwang ,  Dongho Kim ,  Hyunjoon Kim ,  Joonyong Park ,  Seogwoo Hong

IPC: H01L25/00 ,  H01L25/16 ,  H01L27/15

CPC classification number: H01L25/50 ,  H01L25/167 ,  H01L27/15

Abstract: Provided is a method of fabricating a hybrid element, the method including forming a plurality of first elements on a first substrate, separating a plurality of second elements grown on a second substrate from the second substrate, a material of the second substrate being different from a material of the first substrate, and transferring the plurality of second elements, separated from the second substrate, onto the first substrate, wherein, in the transferring, the plurality of second elements are spaced apart from each other by a fluidic self-assembly method, and wherein each of the plurality of second elements includes a shuttle layer grown on the second substrate, an element layer grown on the shuttle layer, and an electrode layer on the element layer.

公开(公告)号：US12068178B2

公开(公告)日：2024-08-20

申请号：US17736352

申请日：2022-05-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dongkyun Kim ,  Hyunjoon Kim ,  Joonyong Park ,  Seogwoo Hong ,  Kyungwook Hwang

IPC: H01L21/67 ,  B65G51/02 ,  H01L21/673

CPC classification number: H01L21/67121 ,  B65G51/02 ,  H01L21/67333

Abstract: A chip transfer apparatus includes: a chip storage module in which a plurality of micro-semiconductor chips and a suspension including impurities are stored; a chip filtration module separating a first suspension including the plurality of micro-semiconductor chips and a second suspension including the impurities in the suspension; and a chip supply module configured to supply the first suspension onto the transfer substrate such that the first suspension is introduced from the chip filtration module and the plurality of micro-semiconductor chips are flowable on the transfer substrate.

公开(公告)号：US11978728B2

公开(公告)日：2024-05-07

申请号：US17883160

申请日：2022-08-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hoyoung Ahn ,  Junhee Choi ,  Kyungwook Hwang ,  Jinjoo Park

IPC: H01L25/13 ,  H01L33/10 ,  H01L33/22 ,  H01L33/38 ,  H01L33/50

CPC classification number: H01L25/13 ,  H01L33/10 ,  H01L33/22 ,  H01L33/38 ,  H01L33/382 ,  H01L33/505

Abstract: A display device includes a substrate, an emission layer provided on the substrate and a reflective layer provided on the emission layer. The emission layer has an emission region that emits light, the reflective layer has a first opening, the emission region overlaps the first opening in a direction perpendicular to an upper surface of the substrate and a first width of the emission region is smaller than a second width of the first opening.

公开(公告)号：US20230420604A1

公开(公告)日：2023-12-28

申请号：US18214808

申请日：2023-06-27

Applicant: Samsung Electronics Co., Ltd. ,  Seoul National University R&DB Foundation

Inventor： Dongho KIM ,  Howon Jang ,  Jehong OH ,  Kyungwook Hwang ,  Junsik Hwang

IPC: H01L33/00 ,  H01L33/62 ,  H01L33/16

CPC classification number: H01L33/0093 ,  H01L33/007 ,  H01L33/62 ,  H01L33/16

Abstract: Provided are a method of manufacturing a micro-LED and a method of manufacturing a display apparatus to which the method is applied. In the method of manufacturing a micro-LED, a membrane formed to include a cavity is formed on a substrate, and then, a sacrificial layer that may be selectively removed by wet etching is formed on the membrane. Next, a light-emitting device is formed on the sacrificial layer, and the light-emitting device is separated from the membrane by the wet etching. In an example, an undoped semiconductor layer may further be formed between the membrane and the sacrificial layer. The sacrificial layer may include an oxide layer having the same crystal lattice structure as that of the undoped semiconductor layer. In an example, another undoped semiconductor layer may further be formed between the sacrificial layer and the light-emitting device.