公开(公告)号：US20220009038A1

公开(公告)日：2022-01-13

申请号：US17288620

申请日：2019-10-30

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takeshi SAKAMOTO ,  Junji OKUMA

IPC: B23K26/53 ,  B23K26/08 ,  B23K26/04 ,  B23K26/06

Abstract: A laser processing apparatus includes a support portion, a first laser processing head, a second laser processing head, a first vertical movement mechanism, a second vertical movement mechanism, a first horizontal movement mechanism, a second horizontal movement mechanism, and a controller configured to control rotation of the support portion, emission of a first and a second laser lights from the first and the second laser processing heads, and movement of a first and a second focusing points.

公开(公告)号：US20220005737A1

公开(公告)日：2022-01-06

申请号：US17281458

申请日：2019-10-02

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takeshi SAKAMOTO ,  Yasutaka SUZUKI ,  Iku SANO

IPC: H01L21/66 ,  H01L21/268

Abstract: An inspecting device includes a stage configured to support a wafer in which a plurality of rows of modified regions are formed in a semiconductor substrate, a light source configured to output light, an objective lens configured to pass light propagated through the semiconductor substrate, a light detection part configured to detect light passing through the objective lens, and an inspection part configured to inspect whether or not there is a tip of a fracture in an inspection region between a front surface and the modified region closest to the front surface of the semiconductor substrate. The objective lens positions a virtual focus symmetrical with a focus with respect to the front surface in the inspection region. The light detection part detects light propagating from the back surface side of the semiconductor substrate to the back surface side via the front surface.

公开(公告)号：US20210398855A1

公开(公告)日：2021-12-23

申请号：US17281505

申请日：2019-10-02

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takeshi SAKAMOTO ,  Yasutaka SUZUKI ,  Iku SANO

IPC: H01L21/78 ,  H01L21/66 ,  B23K26/53 ,  B23K26/00 ,  B23K26/03

Abstract: An inspecting device includes a stage configured to support a wafer in which a plurality of rows of modified regions are formed in a semiconductor substrate, a light source configured to output, an objective lens configured to pass light propagated through the semiconductor substrate, a light detection part configured to detect light passing through the objective lens, and an inspection part configured to inspect a tip position of a fracture in an inspection region between a back surface and the modified region closest to the back surface of the semiconductor substrate. The objective lens aligns a focus from the back surface side in an inspection region. The light detection part detects light propagating from the front surface side of the semiconductor substrate to the back surface side.

公开(公告)号：US20210060705A1

公开(公告)日：2021-03-04

申请号：US16605028

申请日：2018-04-12

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takeshi SAKAMOTO

IPC: B23K26/38 ,  B23K26/40

Abstract: An object cutting method includes: a first step of preparing an object; a second step of irradiating the object with a laser light to form at least one row of modified regions in a single crystal silicon substrate of the object along each of a plurality of lines to cut and to form a fracture so as to extend between the at least one row of modified regions and a second main surface of the object; and a third step of, after the second step, performing reactive ion etching on the object from the second main surface side to form a groove opening to the second main surface, along each of the plurality of lines to cut. In the third step, a black silicon layer is fowled on the second main surface of the object and an inner surface of the groove while the reactive ion etching is performed.

公开(公告)号：US20200180075A1

公开(公告)日：2020-06-11

申请号：US16614882

申请日：2018-05-17

Applicant: Kyoritsu Chemical & Co., Ltd. ,  HAMAMATSU PHOTONICS K.K.

Inventor： Mikiharu KUCHIKI ,  Hidefumi KINDA ,  Daisuke KURITA ,  Takeshi SAKAMOTO ,  Takafumi OGIWARA ,  Yuta KONDOH ,  Naoki UCHIYAMA

IPC: B23K26/16 ,  B23K26/40 ,  B23K26/53 ,  H01L21/50 ,  H01L21/67 ,  H01L21/78

Abstract: A object cutting method includes a first step of attaching an expandable sheet to a front surface or a back surface of a object, a second step of irradiating the object with a laser light along a line to cut to form a modified region, and expanding the expandable sheet to divide at least a part of the object into a plurality of chips and to form a gap that exists between the chips and extends to a side surface crossing the front surface and the back surface of the object, a third step of, after the second step, filling the gap with a resin from an outer edge portion including the side surface of the object, a fourth step of, after the third step, curing and shrinking the resin, and a fifth step of, after the fourth step, taking out the chips from the expandable sheet.

公开(公告)号：US20170113301A1

公开(公告)日：2017-04-27

申请号：US15314170

申请日：2015-03-30

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takeshi SAKAMOTO ,  Yasunori IGASAKI ,  Mamiko MATSUNAGA

IPC: B23K26/067 ,  B23K26/53 ,  B23K26/06

CPC classification number: B23K26/0676 ,  B23K26/064 ,  B23K26/0643 ,  B23K26/53 ,  B23K2101/40 ,  B23K2103/56

Abstract: A laser processing device includes: a laser light source; a converging optical system; and a reflective spatial light modulator modulating the laser light such that the laser light is caused to branch into at least first processing light and second processing light, and the first processing light is converged at a first converging point and the second processing light is converged at a second converging point. In a case in which W1 is a radius of the first processing light at a front face of the object, W2 is a radius of the second processing light at the front face, and D is a distance between the first converging point and the second converging point when viewed from a direction orthogonal to the front face, the reflective spatial light modulator modulates the laser light such that D>W1+W2 is satisfied.