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公开(公告)号：US20230208103A1
公开(公告)日：2023-06-29
申请号：US18110120
申请日：2023-02-15
申请人： II-VI Delaware, Inc.
IPC分类号： H01S5/0683 , H01S5/183 , H01S5/42
CPC分类号： H01S5/0683 , H01S5/18311 , H01S5/423
摘要： Modification of the topology of selected regions of individual VCSEL devices during fabrication is utilized to provide an array output beam with specific characteristics (e.g., “uniform” output power across the array). These physical features include at least the width of the metal aperture, the width of the oxide aperture, and/or the geometry of the contact ring structure on the top of the VCSEL device. The modifications may also function to adjust the numerical apertures (NAs) of the devices, the beam waist, wallplug efficiency, and the like.
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公开(公告)号：US11656515B2
公开(公告)日：2023-05-23
申请号：US17304824
申请日：2021-06-25
申请人： II-VI Delaware, Inc
IPC分类号： G02F1/1362 , G02B6/35
CPC分类号： G02F1/136277 , G02F1/13624 , G02B6/356
摘要： A liquid crystal on silicon (LCOS) device includes a silicon substrate and a pair of electrodes including an upper and a lower electrode. The lower electrode is mounted to the silicon substrate and includes a two dimensional array of pixels extending in both a first and second dimension. LCOS device also includes a liquid crystal layer disposed between the upper and lower electrodes and configured to be driveable into a plurality of electrical states by drive signals provided to the pixels of the lower electrode. The pixels are rectangular in profile having longer sides in the first dimension than in the second dimension. Further, the two dimensional array includes a pixel pitch that is greater in the first dimension than in the second dimension.
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公开(公告)号：US20230150885A1
公开(公告)日：2023-05-18
申请号：US18156246
申请日：2023-01-18
申请人： II-VI Delaware, Inc.
IPC分类号： C04B35/565 , C04B41/45 , C04B41/50 , H01L21/687 , C04B35/563
CPC分类号： C04B35/565 , C04B41/4584 , C04B41/4523 , C04B41/5096 , H01L21/687 , C04B35/563 , C04B2235/428 , C04B2235/427
摘要： A reaction-bonded silicon carbide (SiC) body is produced by: providing a preform including ceramic elements and carbon, and one or more surface features; providing a powder which includes diamond particles and carbon; locating the powder in the surface feature(s); and infiltrating the preform and the powder with molten silicon (Si) to form reaction-bonded SiC in the preform, and to form reaction-bonded SiC coatings on the diamond particles. The present disclosure also relates to a device/component which includes: a main body portion and discrete elements located at least partially within the main body portion. The main body portion may include reaction-bonded SiC and Si, but not diamond, while the discrete elements include diamond particles, reaction-bonded SiC coatings surrounding the diamond particles, and Si. According to the present disclosure, diamond may be advantageously located only where it is needed.
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公开(公告)号：US11652465B2
公开(公告)日：2023-05-16
申请号：US17444736
申请日：2021-08-09
申请人： II-VI Delaware, Inc
发明人： Di Lan , Wen-Qing Xu , Giovanni Barbarossa
CPC分类号： H03H9/0547 , H03H9/02102 , H03H9/02228 , H03H9/13 , H03H9/176
摘要： A bulk acoustic resonator operable in a bulk acoustic mode includes a resonator body mounted to a separate carrier that is not part of the resonator body. The resonator body includes a piezoelectric layer, a device layer, and a top conductive layer on the piezoelectric layer opposite the device layer. A surface of the device layer opposite the piezoelectric layer is for mounting the resonator body to the carrier.
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公开(公告)号：US11650436B2
公开(公告)日：2023-05-16
申请号：US17004677
申请日：2020-08-27
申请人： II-VI DELAWARE, INC.
发明人： Andrei Kaikkonen , Simon Chen , Robert Lewén , Osamu Mizuhara
IPC分类号： G02F1/21 , G02F1/01 , H04B10/516
CPC分类号： G02F1/0121 , G02F1/21 , H04B10/516 , G02F1/212
摘要： An optical communication device may include a driver component, arranged to achieve a driving voltage, and a modulator component, including a laser or arranged to receive light from a laser. The modulator component may be arranged to achieve a modulated light signal modulated based on the driving voltage. The device may include a transmission line arranged to transfer the driving voltage between the driver component and the modulator component. The transmission line may not impedance matched to the driver component, the transmission line may have an impedance which is at least 20% lower than an output impedance of the driver component, and the transmission line may be impedance matched with respect to signal reflections to the modulator component.
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公开(公告)号：US20230116691A1
公开(公告)日：2023-04-13
申请号：US17450368
申请日：2021-10-08
申请人： II-VI Delaware, Inc.
IPC分类号： F21K9/69
摘要： A shared optic assembly for combined flood and dot illumination modules is disclosed. The shared optic assembly includes a first high-powered VCSEL element for providing a flood beam and a second high-powered VCSEL element for providing a dot beam, where both the first and second VCSEL elements share the same optics and are incorporated onto the same module for space savings.
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公开(公告)号：US20230088198A1
公开(公告)日：2023-03-23
申请号：US17991262
申请日：2022-11-21
申请人： II-VI Delaware, Inc.
发明人： Po DONG , Juthika BASAK , Jiashu CHEN
摘要： A modular assembly for opto-electronic systems has a substrate on which various photonic integrated circuit (PIC) chips and electronic integrated circuit (EIC) chips are mounted. One or more waveguide (WG) chips mounted on the substrate align the optical communication between the PIC chips and fiber blocks for optical fibers. Preconfigured electrical connections in the substrate allow the PIC and EIC chips to communicate with one another and to communicate with solder bumps on the substrate for integration of the modular assembly with other electronic components.
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公开(公告)号：US20230042910A1
公开(公告)日：2023-02-09
申请号：US17444521
申请日：2021-08-05
申请人： II-VI Delaware, Inc.
IPC分类号： H01S5/183
摘要： A vertical cavity surface emitting laser (VCSEL) may include an active region (e.g., one or more quantum wells) and a chirped pattern reflector. The active region may be configured to be electrically pumped such that the active region generates light having a fundamental mode and a higher order mode. The chirped pattern reflector may include a first portion presenting to the active region as a first portion of an effective mirror having a concave shape and a second portion presenting to the active region as a second portion of the effective mirror having a convex shape.
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公开(公告)号：US11575007B2
公开(公告)日：2023-02-07
申请号：US17448790
申请日：2021-09-24
申请人： II-VI Delaware, Inc
IPC分类号： H01L29/06 , H01L29/16 , H01L29/66 , H01L29/868
摘要： A feeder design is manufactured as a structure in a SIC semiconductor material comprising at least two p-type grids in an n-type SiC material (3), comprising at least one epitaxially grown p-type region, wherein an Ohmic contact is applied on the at least one epitaxially grown p-type region, wherein an epitaxially grown n-type layer is applied on at least a part of the at least two p-type grids and the n-type SiC material (3) wherein the at least two p-type grids (4, 5) are applied in at least a first and a second regions at least close to the at least first and second corners respectively and that there is a region in the n-type SiC material (3) between the first and a second regions without any grids.
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公开(公告)号：US11543592B2
公开(公告)日：2023-01-03
申请号：US17097250
申请日：2020-11-13
申请人： II-VI Delaware, Inc.
发明人： Po Dong , Juthika Basak , Jiashu Chen
摘要： A modular assembly for opto-electronic systems has a substrate on which various photonic integrated circuit (PIC) chips and electronic integrated circuit (EIC) chips are mounted. One or more waveguide (WG) chips mounted on the substrate align the optical communication between the PIC chips and fiber blocks for optical fibers. Preconfigured electrical connections in the substrate allow the PIC and EIC chips to communicate with one another and to communicate with solder bumps on the substrate for integration of the modular assembly with other electronic components.
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