公开(公告)号：US20040011949A1

公开(公告)日：2004-01-22

申请号：US10133204

申请日：2002-04-26

Inventor： Thomas Bluemcke ,  Ingolf Hoersch

IPC: H01J005/02

CPC classification number: G01V8/10 ,  G01J1/02

Abstract: An optical sensor for use in high vacuum plants and/or in ultrahigh vacuum plants has a metal housing surrounding an interior space in a manner substantially impermeable to gas in which a window which transmits light to be detected is provided and an optical sensor element arranged in the interior space for the detection of light to be detected which is incident through the window.

Abstract translation: 用于高真空设备和/或超高真空设备的光学传感器具有金属壳体，其以基本上不透气的方式围绕内部空间，其中提供透射要检测的光的窗口，并且光学传感器元件布置在 用于检测通过窗口入射的待检测光的内部空间。

公开(公告)号：US20030234353A1

公开(公告)日：2003-12-25

申请号：US10449763

申请日：2003-05-30

Applicant: JDS UNIPHASE CORPORATION

Inventor： Lynn Karl Wiese ,  Matthew Glenn Peters ,  Jo S. Major JR.

IPC: H01J005/02 ,  H01J040/14

CPC classification number: H01S5/02248 ,  H01L23/047 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2924/1433 ,  H01S5/02216 ,  H01S5/02276 ,  H01S5/02284 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A storage information system is disclosed for keeping archival information on the individual active optoelectronic components that are used in telecommunication equipment. The system involves enclosing a nonvolatile memory chip inside the hermetic package of the active optoelectronic component. A memory chip is used to keep the relevant information about the active optoelectronic component such as serial number, part number and specifications. Sensors can also be included inside the hermetic package to monitor the operating conditions of the optoelectronic component. The information system is capable of storing information that is relevant to the component reliability such as: hours of operation, maximum current or voltage, and maximum temperature. The information storage system has the advantage that the archived information is intimately associated with the optoelectronic component thereby lessening the likelihood that information is lost or tampered with. The information system eliminates need for keeping paper records on individual optoelectronic components. It also provides a means for determining if the optoelectronic component was operated outside its specified operating limits. The users of optoelectronic components can also access the information system as needed for the purposes of repair or maintenance of telecommunications equipment.

Abstract translation: 公开了一种存储信息系统，用于保存在电信设备中使用的各个有源光电子部件上的归档信息。 该系统包括将非易失性存储器芯片封装在有源光电子部件的密封封装内。 存储芯片用于保存有源光电子元件的相关信息，如序列号，部件号和规格。 传感器也可以包括在密封包装内，以监测光电子部件的工作状态。 信息系统能够存储与组件可靠性相关的信息，例如：操作小时数，最大电流或电压以及最高温度。 信息存储系统具有的优点是归档信息与光电子部件密切相关，从而减少信息丢失或篡改的可能性。 信息系统消除了在各个光电子部件上保存纸张记录的需要。 它还提供了一种确定光电子元件是否在其规定的工作极限以外运行的方法。 光电组件的用户也可以根据需要访问信息系统，以便维护或维护电信设备。

公开(公告)号：US20030209661A1

公开(公告)日：2003-11-13

申请号：US10063738

申请日：2002-05-09

Inventor： Cheng-Kuei Chen ,  Chih-Chien Jen

IPC: H01J005/02

CPC classification number: G02B7/026

Abstract: A light-blocking structure on an optical lens mounting device for an optical scanning module. A circular flange is formed inside an engaging tube adjacent to one end of the optical lens for blocking any diffused light passing through the gap between the optical lens and the engaging tube so that an associated optical sensor may obtain a clearer image.

Abstract translation: 在光学扫描模块的光学透镜安装装置上的遮光结构。 在与光学透镜的一端相邻的接合管内形成圆形凸缘，用于阻挡通过光学透镜和接合管之间的间隙的任何漫射光，使得相关联的光学传感器可以获得更清晰的图像。

公开(公告)号：US20030178923A1

公开(公告)日：2003-09-25

申请号：US10377116

申请日：2003-03-03

Applicant: Sanyo Electric Co., Ltd.

Inventor： Tetsuji Omura ,  Toru Sasatani

IPC: H01J005/02

CPC classification number: H05B33/04 ,  H01L27/3244 ,  H01L51/5246

Abstract: A coating start point is altered to avoid flowing of a sealing resin to an EL element when the sealing resin is pressed and flattened on adhesion of a device substrate and a sealing substrate with the sealing resin interposed therebetween. In a manufacturing method of a display device of the invention which is formed by adhering the device substrate and the sealing substrate with the sealing resin interposed therebetween, when the sealing resin is coated along edges of the device substrate and the sealing substrate, the coating is started on a corner of the substrates as a coating start point and a coating end point is on the same corner as for the coating start point.

Abstract translation: 改变涂层起始点，以避免密封树脂在密封树脂被插入其间的密封树脂与装置基板和密封基板之间的粘合时被压扁并变平时，使密封树脂流向EL元件。 在本发明的显示装置的制造方法中，其特征在于，通过将所述装置基板和所述密封基板与所述密封树脂粘合而形成，当所述密封树脂沿着所述装置基板和所述密封基板的边缘被涂覆时， 作为涂层起始点在基材的角部开始，并且涂层终点位于与涂层开始点相同的角上。

公开(公告)号：US20030173510A1

公开(公告)日：2003-09-18

申请号：US10328749

申请日：2002-12-24

Inventor： Paul Bacchi ,  Paul S. Filipski

IPC: H01J005/02

CPC classification number: H01L21/67373 ,  H01J61/35 ,  H01J65/046 ,  H01L21/2026 ,  H01L21/67379 ,  H01L21/67772 ,  H01L21/67775 ,  H01L27/1274 ,  H01L27/1296 ,  H01L29/66757 ,  H01L29/66772 ,  H01L29/78654 ,  H01L29/78675

Abstract: One or more mounting registration points provide alignment between a FIMS system and a specimen handling system that delivers a specimen retrieved from a specimen transport box. The specimen handling system includes one or more mounting points, each cooperating with an alignment fixture to immovably secure the specimen handling system to the FIMS system at a corresponding mounting registration point. This mounting technique provides automatic alignment of the specimen handling system to each mounting registration point of the FIMS system.

Abstract translation: 一个或多个安装注册点提供FIMS系统和传送从样品运送箱取回的样本的样本处理系统之间的对准。 样本处理系统包括一个或多个安装点，每个安装点与对准夹具配合，以将样品处理系统固定到相应安装注册点处的FIMS系统。 该安装技术可将样品处理系统自动对准FIMS系统的每个安装注册点。

公开(公告)号：US20030168583A1

公开(公告)日：2003-09-11

申请号：US10385137

申请日：2003-03-10

Applicant: Honda Giken Kogyo Kabushiki Kaisha

Inventor： Koji Kawabe ,  Yoshiki Furukawa ,  Hiroki Yokoyama ,  Hiroyuki Oka ,  Daisuke Uchida ,  Kazunori Hirosawa ,  Kazuyoshi Hibiya

IPC: H01J005/02

CPC classification number: H04B10/1149 ,  H01L31/0203 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014 ,  H05K3/301 ,  H01L2224/45099

Abstract: An optical communication device having features such as: a simple structure, easily mountable, less restrictions in arrangement designing, easy to attain compact arrangement, a mechanical sturdiness and a stable wide directional angle, is constituted as follows. A plurality of LED lamps as photo-emitting elements are mounted on a base plane with a predetermined angle inclined around long axe of the respective LED lamps and the long axe of the LED lamps are arranged so as to dived a circle on the base plane equally.

Abstract translation: 具有以下特征的光通信装置：具有简单的结构，易于安装，布置设计的限制较少，易于实现紧凑的布置，机械坚固性和稳定的宽方向角。 作为光发射元件的多个LED灯以相对于LED灯的长轴倾斜的预定角度安装在基板上，并且LED灯的长轴被布置成在基座平面上划一个圆 。

公开(公告)号：US20030164448A1

公开(公告)日：2003-09-04

申请号：US10087877

申请日：2002-03-01

Inventor： David R. Ohm ,  Richard A. Booman

IPC: H01J005/02

CPC classification number: H01S5/02248 ,  H01S5/0071 ,  H01S5/02208 ,  H01S5/0683

Abstract: A photonic package includes a housing having a semiconductor light source disposed within the housing. The semiconductor light source has a first output and a second output. A reflective surface is disposed inside the housing to reflect the second output from the semiconductor light source. A photodetector is also disposed within the housing and is adapted to indirectly receive the second output of the semiconductor light source reflected off the reflective surface. As a result, interior surface of a housing of an optical transponder may be utilized to provide reflected light to a photodetector to monitor the semiconductor light source.

Abstract translation: 光子封装包括具有设置在壳体内的半导体光源的壳体。 半导体光源具有第一输出和第二输出。 反射表面设置在壳体内部以反射来自半导体光源的第二输出。 光电检测器还设置在壳体内并且适于间接地接收从反射表面反射的半导体光源的第二输出。 结果，可以利用光学应答器的壳体的内表面来向光电检测器提供反射光以监测半导体光源。

公开(公告)号：US20020074488A1

公开(公告)日：2002-06-20

申请号：US09738823

申请日：2000-12-15

Inventor： Theodore R. Strickland

IPC: H01J005/02 ,  H01J040/14

CPC classification number: F41J9/08 ,  F41J2/02

Abstract: The invention is an apparatus for producing an IR (infra-red) signature. In the method, the apparatus is mounted on a target to give the target an infra-red signature whereby the target can be acquired by an appropriate weapon sensor.

Abstract translation: 本发明是用于产生IR（红外）签名的装置。 在该方法中，该装置安装在目标上以向目标提供红外签名，由此目标可由适当的武器传感器获取。

公开(公告)号：US20020060287A1

公开(公告)日：2002-05-23

申请号：US09770051

申请日：2001-01-24

Inventor： Mon Nan Ho ,  Hsiu Wen Tu ,  Kuo Feng Peng ,  Li Huan Chen ,  Joe Liu ,  Jichen Wu ,  Wen Chuan Chen ,  Yung Sheng Chiu

IPC: H01J005/02

CPC classification number: H01L31/0203 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A structure of a photosensor for receiving optical signals and converting the optical signals into electrical signals to be transmitted to a circuit board, the structure of the photosensor includes a substrate, a photosensitive chip, and a transparent layer. The substrate has a first surface formed with signal input terminals, and a second surface opposite to the first surface and formed with signal output terminals for electrically connecting the substrate to the circuit board. The photosensitive chip is mounted on the first surface of the substrate and electrically connecting to the substrate. The transparent layer is adhered onto the first surface of the substrate. A cavity is formed at a central portion of the transparent layer. The photosensitive chip on the substrate is located within the cavity of the transparent layer, and the photosensitive chip is capable of receiving the optical signals via the transparent layer. According to this structure of the photosensor, the optical signals can be received more effectively, the quantity of the material can be save, and thus, the manufacturing costs can also be lowered. A method for packaging the photosensor is also disclosed.

Abstract translation: 用于接收光信号并将光信号转换成要发送到电路板的电信号的光传感器的结构，光传感器的结构包括基板，感光芯片和透明层。 基板具有形成有信号输入端子的第一表面和与第一表面相对的第二表面，并且形成有用于将基板电连接到电路板的信号输出端子。 感光芯片安装在基板的第一表面上并与基板电连接。 透明层附着在基板的第一表面上。 在透明层的中心部分处形成空腔。 基板上的感光芯片位于透明层的空腔内，感光芯片能够通过透明层接收光信号。 根据光传感器的这种结构，可以更有效地接收光信号，可以节省材料的数量，从而也可以降低制造成本。 还公开了一种用于封装光电传感器的方法。