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64 条记录 (耗时 0.012 秒)

    POLYMER-SAND NANOCOMPOSITE FOR WATER SHUTOFF
    48.
    发明申请
    POLYMER-SAND NANOCOMPOSITE FOR WATER SHUTOFF 有权

    公开(公告)号：US20220106517A1

    公开(公告)日：2022-04-07

    申请号：US17551944

    申请日：2021-12-15

    申请人： Saudi Arabian Oil Company ,  Alfaisal University

    发明人： Ayman Almohsin ,  Edreese Alsharaeh ,  Mohammed Abdullah Bataweel

    IPC分类号： C09K8/512 ,  E21B33/138 ,  C08K3/04 ,  B29C35/18 ,  C08K3/11 ,  C09K8/516

    摘要： A method of preparing a polymer-sand nanocomposite for water shutoff. The method includes applying a surface polymerization to sand particles. The surfaced polymerization formed by combining a polymerization initiator dissolved in a solvent with the sand particles to form a precursor sand mixture, combining a co-monomer and additional polymerization initiator in the presence of graphene, where the graphene is not functionalized, to form a precursor polymer mixture, and combining the precursor sand mixture and the precursor polymer mixture to form a sand-copolymer-graphene nanocomposite. The method further includes drying the sand-copolymer-graphene nanocomposite, preparing a polymer hydrogel, and combining the polymer hydrogel and the sand-copolymer-graphene nanocomposite to crosslink the components and form the polymer-sand nanocomposite. The associated method of forming a barrier to shut off or reduce unwanted production of water in a subterranean formation utilizing the polymer-sand nanocomposite is also provided.

    Automatic post mold curing apparatus for use in providing encapsulated semiconductor chips and method therefor
    49.
    发明授权
    Automatic post mold curing apparatus for use in providing encapsulated semiconductor chips and method therefor 失效
    用于提供封装的半导体芯片的自动后模具固化装置及其方法

    公开(公告)号：US5622731A

    公开(公告)日：1997-04-22

    申请号：US118601

    申请日：1993-09-10

    申请人： Richard H. J. Fierkens

    发明人： Richard H. J. Fierkens

    IPC分类号： B29C35/02 ,  B29C35/16 ,  H01L21/56 ,  B29C35/18

    CPC分类号： B29C35/16 ,  B29C35/0222 ,  H01L21/56 ,  B29L2031/3406 ,  H01L2924/0002 ,  Y10T29/49121 ,  Y10T29/53178

    摘要： A post mold curing apparatus for use in association with a molding line system for providing plastic encapsulated semiconductor chips mounted on leadframes is disclosed which includes a leadframe carrier having a rotary, substantially cylindrical shaped assembly for containing and moving a plurality of semiconductor chips and their associated leadframe strips into both an elevated temperature post mold curing region and into a lower temperature cool-down region. Each of the leadframe strips with their associated semiconductor chips are sequentially inserted into cavity regions located in the cylindrical assembly to assist in moving each of the plurality of leadframe strips through the elevated temperature post mold curing region, and subsequently, each of the leadframe strips with their associated semiconductor chips are removed from the cavity regions after passing through the lower temperature cool-down region.

    摘要翻译： 公开了一种与用于提供安装在引线框架上的塑料封装的半导体芯片的成型线系统相关联的后模具固化装置，其包括具有用于容纳和移动多个半导体芯片的旋转大致圆柱形的组件的引线框架载体， 引线框条带进入高温后模具固化区域并进入较低温度的冷却区域。 具有其相关联的半导体芯片的每个引线框条被顺序地插入到位于圆柱形组件中的空腔区域中，以帮助移动多个引线框条中的每一个穿过高温后模具固化区域，随后，每个引线框条带 它们的相关半导体芯片在通过较低温度的冷却区域之后从空腔区域中去除。

    Method of making a cylindrical sleeve structure, particularly cover for an offset cylinder in a rotary printing machine
    50.
    发明授权
    Method of making a cylindrical sleeve structure, particularly cover for an offset cylinder in a rotary printing machine 失效
    制造圆柱形套筒结构的方法，特别是用于旋转印刷机中的偏移圆筒的盖

    公开(公告)号：US5316798A

    公开(公告)日：1994-05-31

    申请号：US864407

    申请日：1992-04-06

    申请人： Udo Tittgemeyer

    发明人： Udo Tittgemeyer

    IPC分类号： B29C35/18 ,  B29C44/12 ,  B41N10/02 ,  B05D1/36

    CPC分类号： B41N6/00 ,  B29C35/18 ,  B29C44/022 ,  B29C44/12 ,  B41N10/02 ,  B29K2075/00 ,  B29K2083/00 ,  B29K2105/16 ,  B29L2031/324 ,  B41N2210/04 ,  B41N2210/14

    摘要： A cover layer, for example applied to a carrier sleeve (3), is volume compressible by being formed as a unitary seamless cover layer (3) of foamed or expanded or blown material resulting in micropores or microcells of less than 0.01 mm, with a percentage of closed or individual cells to total cells being greater than 50%. This cover layer will have a bounce-back or rebound elasticity of greater than 95% and preferably has a thickness of between about 1 to 5 mm. It may be covered with a polyurethane or rubber based outer cover layer of, for example, about less than 0.5 mm thickness. The cover layer is applied by providing a base substance which is made thixotropic, stirring it and applying it in liquid form as a spiral stripe on a rotating and axially moving cylinder (5), the material being free foaming and curing as it is being applied, and when still in spreadable and somewhat flowable condition to form a uniform seamless cover layer which includes individual, unconnected micropores or microcells. Additives such as talcum, and suitable selection of curing agents or activators and inhibitors, as well as blowing agents can control the size and eventual density of the material.

    摘要翻译： 例如应用于载体套管（3）的覆盖层通过形成为发泡或膨胀或吹塑材料的整体无缝覆盖层（3）而体积可压缩，从而产生小于0.01mm的微孔或微孔，其中 封闭或单个细胞对总细胞的百分比大于50％。 该覆盖层将具有大于95％的反弹或回弹弹性，并且优选地具有约1至5mm之间的厚度。 它可以覆盖有例如大约小于0.5mm厚度的聚氨酯或橡胶基外层。 通过提供一种制成触变性的基础物质，将其搅拌并以旋转和轴向移动的圆柱体（5）上的螺旋状条形式将其作为螺旋状条应用于其上来施加覆盖层，该材料在被施加时是自由发泡和固化的 ，并且当仍然处于可展开和稍微可流动的状态以形成均匀的无缝覆盖层时，其包括单独的，未连接的微孔或微孔。 添加剂如滑石和合适的选择固化剂或活化剂和抑制剂以及发泡剂可以控制材料的尺寸和最终的密度。