发明授权
- 专利标题： Automatic post mold curing apparatus for use in providing encapsulated semiconductor chips and method therefor
- 专利标题（中）： 用于提供封装的半导体芯片的自动后模具固化装置及其方法
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申请号： US118601申请日： 1993-09-10
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公开(公告)号： US5622731A公开(公告)日： 1997-04-22
- 发明人: Richard H. J. Fierkens
- 申请人： Richard H. J. Fierkens
- 专利权人： Fierkens; Richard H. J.
- 当前专利权人： Fierkens; Richard H. J.
- 主分类号： B29C35/02
- IPC分类号： B29C35/02 ; B29C35/16 ; H01L21/56 ; B29C35/18
摘要：
A post mold curing apparatus for use in association with a molding line system for providing plastic encapsulated semiconductor chips mounted on leadframes is disclosed which includes a leadframe carrier having a rotary, substantially cylindrical shaped assembly for containing and moving a plurality of semiconductor chips and their associated leadframe strips into both an elevated temperature post mold curing region and into a lower temperature cool-down region. Each of the leadframe strips with their associated semiconductor chips are sequentially inserted into cavity regions located in the cylindrical assembly to assist in moving each of the plurality of leadframe strips through the elevated temperature post mold curing region, and subsequently, each of the leadframe strips with their associated semiconductor chips are removed from the cavity regions after passing through the lower temperature cool-down region.
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