公开(公告)号：US06662716B2

公开(公告)日：2003-12-16

申请号：US09858846

申请日：2001-05-16

Applicant: David Benderly

Inventor： David Benderly

IPC: B41P1700

CPC classification number: B41M5/26 ,  B41M5/262

Abstract: Diamonds are marked by applying apertured tapes bearing identifying indicia to the girdles, applying a flammable layer over the apertured tapes, and then igniting the flammable layer to burn the indicia into the girdles. Preferably, the flammable layer is prepackaged within the apertured tapes.

公开(公告)号：US06642475B2

公开(公告)日：2003-11-04

申请号：US09948246

申请日：2001-09-07

Applicant: David Benderly

Inventor： David Benderly

IPC: B23K2600

CPC classification number: B41M5/262 ,  B41M5/24 ,  B41M5/267

Abstract: A substrate is marked by applying a high melting point material over a lower surface of the substrate, and then heating the material layer. Indicia are formed by directing a source of radiant energy through the substrate for impingement on the material layer, and by moving the source and/or the substrate relative to each other.

Abstract translation: 通过在衬底的下表面上施加高熔点材料，然后加热材料层来标记衬底。 通过将辐射能源通过衬底以冲击材料层，以及通过相对于彼此移动源和/或衬底而形成标记。

公开(公告)号：US06635846B1

公开(公告)日：2003-10-21

申请号：US10211956

申请日：2002-08-02

Applicant: Albert S. Rieck

Inventor： Albert S. Rieck

IPC: B23K2600

CPC classification number: B41M5/26 ,  B41M5/262

Abstract: A laser such as a continuous wave Nd:Yag or carbon dioxide unit is configured for optimized virescence of a colorant carrier and an object placed in the path of the beam. The beam is steered via computer controlled motors attached to reflecting mirrors located in the path of the beam. Graphical characters and letters can be vitrified into the surface of objects which are placed in the working area of the beam by running computer software for controlling the beam steering mirrors. A laser with adequate vitrification power will then vitrify, or change to glass, the surface of clay-containing objects including the colorant carrier falling in the path of the laser beam. The width of the beam, temperature and moisture content of the clay-containing object, gaseous atmosphere at the work surface and speed of beam movement can be optimized to maximize the throughput of a laser marking system. Vitrification of porous non-vitrifiable objects is possible by adding clays to the carrier. The use of a sealed colorant package allows prepackaging colorants to be used eliminating the need for handling various pigments that can stain or are known carcinogenic.

Abstract translation: 诸如连续波Nd：Yag或二氧化碳单元的激光器被配置为优化着色剂载体和放置在光束路径中的物体的发光。 光束通过连接到位于光束路径中的反射镜的计算机控制的电机转向。 图形字符和字母可以通过运行用于控制光束转向镜的计算机软件而被玻璃化到放置在光束的工作区域中的物体的表面中。 具有足够的玻璃化功率的激光器将玻璃化或者变成玻璃，包括落在激光束路径中的着色剂载体的含粘土物体的表面。 可以优化含粘土物体的梁的宽度，温度和水分含量，工作表面的气体气氛和光束移动的速度，以最大限度地提高激光打标系统的吞吐量。 多孔非玻璃化物体的玻璃化是通过向载体添加粘土而实现的。 密封着色剂包装的使用允许使用预包装着色剂，从而不需要处理可以着色或已知致癌的各种颜料。

公开(公告)号：US06596967B2

公开(公告)日：2003-07-22

申请号：US09781934

申请日：2001-02-12

Applicant: Edward Miesak

Inventor： Edward Miesak

IPC: B23K2620

CPC classification number: C03C23/0025 ,  B23K26/0006 ,  B23K26/361 ,  B23K26/50 ,  B23K2103/42 ,  B41M5/24 ,  B41M5/262 ,  G03H1/0248 ,  G03H1/30 ,  G03H2001/0482 ,  G03H2001/0497 ,  G03H2224/06 ,  G03H2240/24 ,  G03H2270/11

Abstract: A system modifies the optical properties of an object by using a light beam from a light source that is focused at a first focal point within the object to optically change a first location within the object at the first focal point. The light beam is focused at a second focal point within the object to optically change a second location within the object at the second focal point. The light beam is focused at a third focal point within the object to optically change a third location within the object at the third focal point The object is moved relative to the light beam while creating the optical change at the second location.

公开(公告)号：US20030029849A1

公开(公告)日：2003-02-13

申请号：US10139622

申请日：2002-05-06

Inventor： Ulla Trinks ,  Andre Witzmann

IPC: B23K026/00 ,  B23K026/08

CPC classification number: G06K19/06046 ,  B41M5/262 ,  C03C23/0025

Abstract: In an apparatus and a method for marking glass with a laser, the glass is first brought to a temperature above the transformation temperature of the glass. The glass is then acted upon by a laser pulse which produces a mark on the surface of the glass. The peak power of the laser pulse is preferably selected so that it is merely a thermal interaction with the glass surface which occurs. This has the advantage that the material properties of the marked glass remain unchanged compared with the unmarked product.

Abstract translation: 在用激光玻璃标记的装置和方法中，首先使玻璃达到高于玻璃转变温度的温度。 然后通过在玻璃表面产生标记的激光脉冲对玻璃进行作用。 优选选择激光脉冲的峰值功率，使得其仅与发生的玻璃表面的热相互作用。 这样做的优点在于，标记玻璃的材料性能与未标记的产品相比保持不变。

公开(公告)号：US06342912B1

公开(公告)日：2002-01-29

申请号：US09618305

申请日：2000-07-18

Applicant: Tim J. Corbett

Inventor： Tim J. Corbett

IPC: B41J2435

CPC classification number: H01L21/67282 ,  B23K26/0823 ,  B41M5/262 ,  B41M5/265 ,  B41M5/267 ,  H01L23/544 ,  H01L2223/54473 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A laser marking apparatus and method for marking the surface of a semiconductor chip are described herein. A laser beam is directed to a location on the surface of the chip where a laser reactive material, such as a pigment containing epoxy is present. The heat associated with the laser beam causes the laser reactive material to fuse to the surface of the chip creating a visibly distinct mark in contrast to the rest of the surface of the chip. Only reactive material contacted by the laser fuses to the chip surface, and the remaining residue on the non-irradiated portion can be readily removed.

公开(公告)号：US20010006766A1

公开(公告)日：2001-07-05

申请号：US09759794

申请日：2001-01-12

Applicant: 3M Innovative Properties Company

Inventor： Dennis P. O'Brien ,  Jeffrey M. Florczak ,  Robert L. W. Smithson

IPC: G03C003/00 ,  G03C005/00

CPC classification number: H01Q1/2225 ,  B41M5/262 ,  G02B19/0014 ,  G02B19/0052 ,  G02B19/009 ,  G02B19/0095 ,  G02B27/09 ,  G02B27/0911 ,  G02B27/0966 ,  G03F1/68 ,  G03F7/30 ,  G03F7/3014 ,  G03F7/34 ,  H01Q1/22 ,  H01Q7/00 ,  H05K3/027

Abstract: Patterned articles, such as RFID antenna, are made by subablation, a process comprising the steps of: A. providing a substrate having a coating, such as a metal or metal oxide, and an interface comprising the thin region where the coating and the substrate are closest to each other; B. exposing at least one part of the total area of the coating to a flux of electromagnetic energy, Such as a focused excimer laser beam, sufficient to disrupt the interface but insufficient to ablate the coating, and C. removing the parts of the coating in registry with the portion of the interface area that was disrupted, by means such as ultrasonic agitation. The process has advantages over photo-resist processes in that there is no residual chemical resist left on the product and no undercutting of the pattern or image. It has advantages over laser ablation processes in that higher throughput is possible at the same energy level and there is no microscopic debris left on the product surface.

Abstract translation: 图案化的物品，例如RFID天线，通过消融来制造，一种方法包括以下步骤：A.提​​供具有涂层的基底，例如金属或金属氧化物，以及包含薄区域的界面，其中涂层和基底 彼此最接近; B.将涂层的总面积的至少一部分暴露于电磁能量通量，例如聚焦的准分子激光束，其足以破坏界面但不足以消除涂层，以及C.去除涂层的部分 通过诸如超声波搅动的方式与被破坏的界面区域的部分对准。 该方法具有优于光致抗蚀剂工艺的优点，因为在产品上没有残留的化学抗蚀剂，并且没有图案或图像的底切。 它具有优于激光烧蚀工艺的优点，因为在相同的能量水平下可以实现更高的产量，并且在产品表面上没有留下微观碎片。

公开(公告)号：US06248973B1

公开(公告)日：2001-06-19

申请号：US09266264

申请日：1999-03-11

Applicant: Yukinori Matsumura ,  Yukihiko Sugimoto ,  Kotaro Hori

Inventor： Yukinori Matsumura ,  Yukihiko Sugimoto ,  Kotaro Hori

IPC: B23K2600

CPC classification number: H01L21/67282 ,  B41M5/262 ,  B41M5/265 ,  B41M5/267 ,  H01L23/544 ,  H01L2223/54493 ,  H01L2924/0002 ,  H01L2924/00

Abstract: In a laser marking method for making a dot mark on a semiconductor wafer by using laser beam, molten splashes which arise at the laser marking are prevented from adhering to a surface of the wafer and a shape of the dot mark is kept in a stable posture with its visibility being ensured even after the marking made throughout various and multistage steps in a manufacturing process by the semiconductor apparatus. The method comprises forming a transparent thin film on at least a dot mark-formation area of a semiconductor wafer body of the wafer; irradiating the dot mark-formation area with laser beam having a wavelength selected in advance, on the transparent thin film; melting and deforming the wafer body by the laser beam transmitting the transparent thin film to form a dot mark; and by utilizing the heat generated when the wafer body is melted, deforming the transparent thin film, along with the deformation of the dot mark, into the same shape as the dot mark without a breakdown of the transparent thin films.

Abstract translation: 在通过使用激光束在半导体晶片上形成点标记的激光标记方法中，防止在激光标记处产生的熔融飞溅附着在晶片的表面上，并且点标的形状保持在稳定的姿势 即使在通过半导体装置的制造工艺中的各种和多级步骤中进行标记之后，其可见性也得到确保。 该方法包括在晶片的半导体晶片体的至少点形成区域上形成透明薄膜; 在透明薄膜上用具有预先选择的波长的激光束照射点标记形成区域; 通过透射透明薄膜的激光束使晶片体熔化和变形以形成点标记; 并且通过利用晶片体熔化时产生的热量，使透明薄膜与点标记的变形一起变形为与点标记相同的形状，而不会导致透明薄膜破裂。

公开(公告)号：US06211484B1

公开(公告)日：2001-04-03

申请号：US09309982

申请日：1999-05-11

Applicant: George R. Kaplan ,  Avigdor Shachrai ,  Oded Anner ,  Leonid Gurvich

Inventor： George R. Kaplan ,  Avigdor Shachrai ,  Oded Anner ,  Leonid Gurvich

IPC: B23K2638

CPC classification number: B23K26/032 ,  B23K26/04 ,  B23K26/042 ,  B23K26/043 ,  B23K26/06 ,  B23K26/064 ,  B23K26/0643 ,  B23K26/0648 ,  B23K26/0665 ,  B23K26/0861 ,  B23K26/361 ,  B23K2103/30 ,  B23K2103/50 ,  B41M5/262 ,  B44B3/009 ,  B44B7/007 ,  B44C1/228 ,  G01N21/87 ,  G06K1/126

Abstract: A laser energy microinscribing system, comprising a semiconductor excited Q-switched solid state laser energy source; a cut gemstone mounting system, allowing optical access to a mounted workpiece; an optical system for focusing laser energy from the laser energy source onto a cut gemstone; a displaceable stage for moving said gemstone mounting system with respect to said optical system so that said focused laser energy is presented to desired positions on said gemstone, having a control input; an imaging system for viewing the gemstone from a plurality of vantage points; and a rigid frame supporting said laser, said optical system and said stage in fixed relation, to resist differential movements of said laser, said optical system and said stage and increase immunity to vibrational misalignments. The laser energy source is preferably a semiconductor diode excited Q-switched Nd:YLF laser with a harmonic converter having an output of about 530 nm. The system may further comprise an input for receiving marking instructions; a processor for controlling said displaceable stage based on said marking instructions and said imaging system, to selectively generate a marking based on said instructions and a predetermined program; and a storage system for electronically storing information relating to images of a plurality of workpieces. A secure certificate of authenticity of a marked workpiece is also provided.

Abstract translation: 一种激光能量微分系统，包括半导体激发的Q开关固体激光能量源; 切割宝石安装系统，允许光学访问安装的工件; 用于将来自激光能量源的激光能量聚焦到切割的宝石上的光学系统; 可移动台，用于相对于所述光学系统移动所述宝石安装系统，使得所述聚焦的激光能量呈现在具有控制输入的所述宝石上的期望位置; 用于从多个有利位置观察宝石的成像系统; 以及刚性框架，其支撑所述激光器，所述光学系统和所述平台处于固定关系，以抵抗所述激光器，所述光学系统和所述平台的差动运动，并增加对振动失准的抵抗力。 激光能量源优选是具有输出约530nm的谐波转换器的半导体二极管激励的Q开关Nd：YLF激光器。 系统还可以包括用于接收标记指令的输入; 用于基于所述标记指令和所述成像系统控制所述可移位级的处理器，以基于所述指令和预定程序选择性地生成标记; 以及用于电子地存储与多个工件的图像有关的信息的存储系统。 还提供了标记工件的真实性的安全证书。

公开(公告)号：US5985377A

公开(公告)日：1999-11-16

申请号：US944684

申请日：1997-09-30

Applicant: Tim J. Corbett

Inventor： Tim J. Corbett

IPC: B23K26/00 ,  B23K26/08 ,  B41J2/455 ,  B41M5/26 ,  B41M5/382 ,  B41M7/00 ,  H01L21/00 ,  H01L23/544 ,  H05K13/02 ,  C08J7/04

CPC classification number: H01L21/67282 ,  B23K26/0823 ,  B41M5/262 ,  B41M5/267 ,  H01L23/544 ,  H05K13/021 ,  B41M5/265 ,  H01L2223/54473 ,  H01L2924/0002

Abstract: A laser marking apparatus and method for marking the surface of a semiconductor chip are described herein. A laser beam is directed to a location on the surface of the chip where a laser reactive material, such as a pigment containing epoxy, is present. The heat associated with the laser beam causes the laser reactive material to fuse to the surface of the chip, creating a visibly distinct mark in contrast to the rest of the surface of the chip. Only reactive material contacted by the laser fuses to the chip surface, and the remaining residue on the non-irradiated portion can be readily removed.