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41.
公开(公告)号:US10466813B2
公开(公告)日:2019-11-05
申请号:US15626303
申请日:2017-06-19
Applicant: Samsung Electronics Co., Ltd.
Inventor: Sungchul Park , Won-Wook Lee , Jung-Jae Lee
IPC: G06F3/0354 , G06F3/041 , G06F3/046
Abstract: An electronic device can include a housing including a first surface, a second surface, and a third surface, the first and second surface defining an electronic component mounting space and the second and third surface defining a pen mounting space adapted to receive an electronic pen; and a display and an ElectroMagnetic Resonance (EMR) sensor pad disposed in the electronic component mounting space. When the electronic pen is mounted in the pen mounting space, the EMR sensor pad may detect a resonance frequency of a coil body of the electronic pen.
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公开(公告)号:US10050332B2
公开(公告)日:2018-08-14
申请号:US15237608
申请日:2016-08-15
Applicant: Samsung Electronics Co., Ltd
Inventor: Min-Seok Kim , Hyuncheol Jin , Sung-Won Park , Sungchul Park
Abstract: According to various embodiments, there is provided an electronic device including: a housing; a first conductive member that forms a portion of the housing and is at least partially disposed within the housing; a second conductive member that forms another portion of the housing and includes a portion disposed adjacent to a portion of the first conductive member; a non-conductive member disposed between the portion of the first conductive member and a portion of the second conductive member; a capacitive coupling structure coupled between the first conductive member and the second conductive member; a communication circuit electrically coupled to the first conductive member; and a sensor electrically coupled to the first conductive member. Various other embodiments may be made.
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公开(公告)号:US09972371B2
公开(公告)日:2018-05-15
申请号:US15596558
申请日:2017-05-16
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Soo-Ho Cha , Chankyung Kim , Sungchul Park , Hoyoung Song , Kwangchol Choe
CPC classification number: G11C7/12 , G11C7/062 , G11C7/065 , G11C7/14 , G11C7/22 , G11C11/4091 , G11C11/4094 , G11C11/4099
Abstract: A memory device includes a first memory cell, a second memory cell, a third memory cell, a bitline sense amplifier, and a switch circuit. The first memory cell is connected to a first wordline and a first bitline. The second memory cell is connected to the first wordline and a second bitline. The third memory cell is connected to the first wordline and a third bitline. The bitline sense amplifier is connected to the third bitline. The switch circuit is connected to the first bitline, the second bitline, and the bitline sense amplifier. The switch circuit performs charge sharing between the first memory cell and the first bitline to generate a first reference voltage, and charge sharing between the second memory cell and the second bitline to generate a second reference voltage.
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公开(公告)号:US12027768B2
公开(公告)日:2024-07-02
申请号:US17643884
申请日:2021-12-13
Applicant: Samsung Electronics Co., Ltd.
Inventor: Sungchul Park
CPC classification number: H01Q17/004 , H01Q1/243
Abstract: According to various embodiments, an electronic device may comprise: a housing; an antenna structure disposed in an inner space of the housing, the antenna structure including a substrate having a first surface and a second surface oriented toward a direction opposite to the first surface, and at least one first antenna element disposed in a space between the first surface and the second surface and having a beam pattern formed toward a conductive part; an electric wave absorbing member disposed between the conductive part and the at least one first antenna element so as to be disposed in a path in which the beam pattern is formed; and a first wireless communication circuit disposed in the inner space of the housing and configured to transmit or receive a wireless signal of a first frequency band through the at least one first antenna element.
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公开(公告)号:US20240038288A1
公开(公告)日:2024-02-01
申请号:US18171121
申请日:2023-02-17
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Dongha Kim , Hyunki Kim , Sungchul Park , Ju-Seop Park , Dongsu Lee
IPC: G11C11/406
CPC classification number: G11C11/40622 , G11C11/40611 , G11C11/40603
Abstract: In a memory device, a control circuit detects determines an aggressor row address, indicating an aggressor row of a memory cell array, at a random time. The aggressor row address or a value derived from the aggressor row address is stored in a queue. The control circuit controls a refresh operation of one or more victim rows based on the aggressor row address in response to a targeted refresh command.
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公开(公告)号:US11716736B2
公开(公告)日:2023-08-01
申请号:US17836460
申请日:2022-06-09
Applicant: Samsung Electronics Co., Ltd.
Inventor: Suyoung Park , Suha Yoon , Euichang Jung , Mooyoung Kim , Sungchul Park
CPC classification number: H04W72/21 , G01K7/22 , H04B1/005 , H04W72/0453 , H04W72/51 , H01C1/16 , H04W88/02
Abstract: An electronic device and method for efficiently processing overheat in an electronic device are provided. The electronic device includes a transceiver and at least one processor configured to identify overheat inside the electronic device and transmit, to a base station, a first message containing overheat assistance information generated in response to identifying the overheat inside the electronic device.
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公开(公告)号:US11690179B2
公开(公告)日:2023-06-27
申请号:US17286519
申请日:2019-10-18
Applicant: Samsung Electronics Co., Ltd.
Inventor: Sungchul Park , Sangwon Ha , Chulwoo Park
CPC classification number: H05K3/4046 , H05K1/115 , H05K2201/096
Abstract: A substrate connection member according to various embodiments of the present invention can comprise a printed circuit board which has a plurality of layers that are stacked and which comprises a front surface, a rear surface, and a side surface encompassing the front surface and the rear surface. The printed circuit board can comprise: an opening part which encompasses a partial region of the printed circuit board and which is penetratingly formed from the front surface to the rear surface; at least one bridge connected between the partial region and the printed circuit board by crossing at least a portion of the opening part; and at least one through-hole wire formed in the partial region from the front surface to the rear surface, wherein the inner surface of the opening part and the side surface of the bridge can be formed from a conductive member. Other various embodiments, in addition to the embodiments disclosed in the present invention, are possible.
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公开(公告)号:US11522299B2
公开(公告)日:2022-12-06
申请号:US16654265
申请日:2019-10-16
Applicant: Samsung Electronics Co., Ltd.
Inventor: Sungchul Park , Sumin Yun
Abstract: Presented herein is an electronic device comprising a Printed Circuit Board (PCB) including a first circuit board plane including a plurality of first patch antenna elements and a second circuit board plane including a plurality of second patch antenna elements, a communication module that transmits and receives a signal of a first frequency band using the plurality of first patch antenna elements, and transmits and receives a signal of a second frequency band higher than the first frequency band using the plurality of second patch antenna elements, a processor connected to the communication module, wherein central points of the plurality of first patch antenna elements are spaced apart from one another to have a first distance and central points of the plurality of second patch antenna elements are spaced apart from one another to have a second distance shorter than the first distance, and wherein the plurality of second patch antenna elements are arranged such that the central points of the plurality of second patch antenna elements are disposed to be closer to a central axis connecting a first central point that is a center of gravity of the first circuit board plane and a second central point that is a center of gravity of the second circuit board plane in a direction passing through the printed circuit board from a first surface to a second surface of the printed circuit board, than central points of the plurality of first patch antenna elements.
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公开(公告)号:US11515619B2
公开(公告)日:2022-11-29
申请号:US17320884
申请日:2021-05-14
Applicant: Samsung Electronics Co., Ltd.
Inventor: Sungchul Park
Abstract: An inclined antenna assembly and an electronic device including the antenna assembly are provided. The inclined antenna assembly and an electronic device include a communication circuit and a Printed Circuit Board (PCB) including a front face, a back face on which the communication circuit is disposed, and at least one side face having an inclined manner between the front face and the back face. According to various embodiments, the PCB may include one or more antennas formed on a region corresponding to at least one side face.
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公开(公告)号:US11506754B2
公开(公告)日:2022-11-22
申请号:US16946350
申请日:2020-06-17
Applicant: Samsung Electronics Co., Ltd.
Inventor: Wenxun Qiu , Vutha Va , Kuldeep Gill , Boon Loong Ng , Junsu Choi , Sungchul Park
Abstract: A method for close-range detection, includes transmitting, via a radar transceiver, radar signals to detect an object. The method also includes determining whether the object includes a pattern code based on reflections of the radar signals received by the radar transceiver. In response to determining that the object includes the pattern code, the method includes identifying range information about a range between the electronic device and the pattern code. The method further includes selecting, based on the range information, one or more signals from the reflections of the radar signals that are reflected off of the pattern code. Additionally, the method includes identifying, based on the one or more signals, information about the pattern code.
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