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公开(公告)号：US20220069672A1
公开(公告)日：2022-03-03
申请号：US17390009
申请日：2021-07-30
Applicant: General Electric Company
Inventor： Joseph John Zierer , Brian Magann Rush , Karthik K. Bodla , Andrew Thomas Cross , Vandana Prabhakar Rallabandi , Konrad Roman Weeber , Anoop Kumar Jassal
Abstract: An electric motor may include a stator assembly comprising a stator housing, and one or more rotors coupled to the stator by a rotor shaft assembly. The stator housing may include a cooling structure that has a plurality of cooling body portions and a plurality of cooling conduits defined by the plurality of cooling body portions. A method of forming a stator housing for an electric machine may include additively manufacturing a stator housing that includes a cooling structure defining a fluid domain, coupling a working fluid source to the stator housing and introducing a working fluid into the fluid domain defined by the cooling structure, and sealing the cooling structure with the working fluid contained within the fluid domain of the cooling structure. A method of cooling an electric machine may include heating the working fluid in the fluid domain and flowing the working fluid through the fluid domain, and transferring heat from the cooling structure to a cooling fluid flowing along one or more cooling surfaces contacting a surface of the electric machine.
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公开(公告)号：US11260976B2
公开(公告)日：2022-03-01
申请号：US16685586
申请日：2019-11-15
Applicant: General Electric Company
Inventor： William Dwight Gerstler , Nicholas William Rathay , Brian Magann Rush , Pazhayannur R Subramanian
Abstract: A hypersonic aircraft includes one or more leading edge assemblies that are designed to manage thermal loads experienced at the leading edges during high speed or hypersonic operation. The leading edge assembly includes a plurality of structural layers and a plurality compliant layers alternately stacked with each other to facilitate thermal expansion and movement between the plurality of structural layers, while also providing a thermal break between the plurality of structural layers.
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公开(公告)号：US11122715B2
公开(公告)日：2021-09-14
申请号：US16203161
申请日：2018-11-28
Applicant: General Electric Company
Inventor： Karthik Bodla , Nathaniel Benedict Hawes , Brian Magann Rush , Weijun Yin , Andrew Thomas Cross
Abstract: A heat pipe assembly includes walls having porous wick linings, an insulating layer coupled with at least one of the walls, and an interior chamber sealed by the walls. The linings hold a liquid phase of a working fluid in the interior chamber. The insulating layer is directly against a conductive component of an electromagnetic power conversion device such that heat from the conductive component vaporizes the working fluid in the porous wick lining of the at least one wall and the working fluid condenses at or within the porous wick lining of at least one other wall to cool the conductive component of the electromagnetic power conversion device. The assembly can be placed in direct contact with the device while the device is operating and/or experiencing time-varying magnetic fields that cause the device to operate.
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公开(公告)号：US20210147088A1
公开(公告)日：2021-05-20
申请号：US16685563
申请日：2019-11-15
Applicant: General Electric Company
Inventor： Nicholas William Rathay , Brian Magann Rush , Gregory Alexander Natsui
Abstract: A hypersonic aircraft includes one or more leading edge assemblies that are designed to cool the leading edge of certain portions of the hypersonic aircraft that are exposed to high thermal loads, such as extremely high temperatures and/or thermal gradients. Specifically, the leading edge assemblies may include an outer wall tapered to a leading edge or stagnation point. A coolant supply may be in fluid communication with at least one fluid passageway that passes through the outer wall to deliver a flow of cooling fluid to the stagnation point. In addition, a nose cover is positioned at least partially over or within the at least one fluid passageway and is formed from a material that ablates or melts when the leading edge is exposed to a predetermined critical temperature, the nose cover being configured for restricting the flow of coolant until the nose cover is ablated or melted away.
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公开(公告)号：US11006549B2
公开(公告)日：2021-05-11
申请号：US16271259
申请日：2019-02-08
Applicant: General Electric Company
Inventor： Brian Magann Rush , Corey Bourassa , Lana Osusky , Karthik Bodla , Hendrik Pieter Jacobus de Bock , Naveenan Thiagarajan
Abstract: A cooling assembly includes a body configured to be placed into thermal contact with a heat source and one or more non-planar, hermetic walls disposed within the body. The one or more non-planar hermetic walls extending around, enclosing, and defining a cooling channel configured to carry cooling fluid through the body such that the cooling fluid contacts internal surfaces of the cooling channel inside the body. The assembly including one or more enhancement structures disposed within the body and coupled with the one or more non-planar hermetic walls. The one or more enhancement structures shaped to change a flow path of the cooling fluid as the cooling fluid moves within the cooling channel and shaped to increase a surface area contacted by the cooling fluid within the cooling channel.
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Patent Agency Ranking
46.发明申请公开(公告)号：US20200333084A1
公开(公告)日：2020-10-22
申请号：US16923080
申请日：2020-07-08
Applicant: General Electric Company
Inventor： Brian Magann Rush , Daniel Jason Erno , Thomas Adcock , Stefano Angelo Mario Lassini
IPC: F28D15/04 , B33Y80/00 , B64G1/50 , H01L23/427
Abstract: A cooling assembly includes walls extending around and defining an enclosed vapor chamber that holds a working fluid. An interior porous wick structure is disposed inside the chamber and lines interior surfaces of the walls. The wick structure includes pores that hold a liquid phase of the working fluid. The cooling assembly also includes an exterior porous wick structure lining exterior surfaces of the walls outside of the vapor chamber. The exterior wick structure includes pores that hold a liquid phase of a cooling fluid outside the vapor chamber. The interior wick structure holds the liquid working fluid until heat from an external heat source vaporizes the working fluid inside the vapor chamber. The exterior wick structure holds the liquid fluid outside the vapor chamber until heat from inside the vapor chamber vaporizes the liquid cooling fluid in the exterior wick structure for transferring heat away from the heat source.
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47.发明申请公开(公告)号：US20190249929A1
公开(公告)日：2019-08-15
申请号：US16034050
申请日：2018-07-12
Applicant: General Electric Company
Inventor： Brian Magann Rush , Daniel Jason Erno , Thomas Adcock , Stefano Angelo Mario Lassini
Abstract: A cooling assembly includes walls extending around and defining an enclosed vapor chamber that holds a working fluid. An interior porous wick structure is disposed inside the chamber and lines interior surfaces of the walls. The wick structure includes pores that hold a liquid phase of the working fluid. The cooling assembly also includes an exterior porous wick structure lining exterior surfaces of the walls outside of the vapor chamber. The exterior wick structure includes pores that hold a liquid phase of a cooling fluid outside the vapor chamber. The interior wick structure holds the liquid working fluid until heat from an external heat source vaporizes the working fluid inside the vapor chamber. The exterior wick structure holds the liquid fluid outside the vapor chamber until heat from inside the vapor chamber vaporizes the liquid cooling fluid in the exterior wick structure for transferring heat away from the heat source.
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公开(公告)号：US10383261B2
公开(公告)日：2019-08-13
申请号：US15222478
申请日：2016-07-28
Applicant: General Electric Company
Inventor： Andrew Louis Krivonak , Theodore Clark Brown , Shreenath Shekar Perlaguri , Brian Magann Rush , Rajendra Yammanuru , Naveenan Thiagarajan , Arunpandi Radhakrishnan
IPC: H05K7/20 , H01L23/467 , H01L23/473
Abstract: A system includes a front plate, first and second side plates extending from the front plate, a bridge heat sink coupled to and extending from the front plate between the side plates, and a heat pipe coupled to the front plate. The front plate defines a slot therethrough between the front and back sides. The first side plate includes a fin bank mounted on an outer side thereof. The bridge heat sink defines a fluid channel that is fluidly connected to the slot of the front plate. The fluid channel is configured to receive a first cooling fluid therein to dissipate heat from electronics packages that engage the bridge heat sink. The heat pipe extends to and at least partially through the fin bank. The heat pipe contains a second cooling fluid therein that transfers heat absorbed from the front plate to the fin bank for dissipating heat.
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公开(公告)号：US09974157B2
公开(公告)日：2018-05-15
申请号：US15237054
申请日：2016-08-15
Applicant: General Electric Company
CPC classification number: H05K1/0203 , H05K5/0256 , H05K7/20309 , H05K7/2039 , H05K7/20672
Abstract: An electronic system includes a chassis. The chassis includes a first endwall, a second endwall, and a sidewall. The electronic system also includes at least one circuit card cartridge coupled to the chassis. The at least one circuit card cartridge is positioned between the first endwall and the second endwall. The at least one circuit card cartridge includes a printed circuit board including a first surface and at least one electronic component. The at least one electronic component is mounted on the first surface. The at least one circuit card cartridge further includes at least one heat transfer assembly coupled to the printed circuit board. The at least one heat transfer assembly is configured to contact the at least one electronic component and extend adjacent the printed circuit board across the first surface.
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公开(公告)号：US20170112018A1
公开(公告)日：2017-04-20
申请号：US15222478
申请日：2016-07-28
Applicant: General Electric Company
Inventor： Andrew Louis Krivonak , Theodore Clark Brown , Shreenath Shekar Perlaguri , Brian Magann Rush , Rajendra Yammanuru , Naveenan Thiagarajan , Arunpandi Radhakrishnan
IPC: H05K7/20
CPC classification number: H05K7/20927 , H01L23/467 , H01L23/473 , H05K7/20263 , H05K7/20336 , H05K7/20881
Abstract: A system includes a front plate, first and second side plates extending from the front plate, a bridge heat sink coupled to and extending from the front plate between the side plates, and a heat pipe coupled to the front plate. The front plate defines a slot therethrough between the front and back sides. The first side plate includes a fin bank mounted on an outer side thereof. The bridge heat sink defines a fluid channel that is fluidly connected to the slot of the front plate. The fluid channel is configured to receive a first cooling fluid therein to dissipate heat from electronics packages that engage the bridge heat sink. The heat pipe extends to and at least partially through the fin bank. The heat pipe contains a second cooling fluid therein that transfers heat absorbed from the front plate to the fin bank for dissipating heat.
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