公开(公告)号：US20240250811A1

公开(公告)日：2024-07-25

申请号：US18492277

申请日：2023-10-23

Applicant: Cisco Technology, Inc.

Inventor： Santanu Ganguly ,  D. Brice Achkir

IPC: H04L9/08 ,  H04L9/30 ,  H04L9/32

CPC classification number: H04L9/0852 ,  H04L9/3073 ,  H04L9/3226

Abstract: Disclosed are a system and method of establishing secure communications between nodes in a cloud environment. The method includes receiving a registration of a first user at a quantum processor service provider, receiving at the quantum processor service provider a request for authentication of the first registered user, the request comprising at least the password and the registration number, when the password and registration number match stored data at the quantum processor service provider for the first registered user, generating an EPR entangled pair and transmitting the EPR entangled pair to a first computing device of the first registered user, wherein the first registered user utilizes the EPR entangled pair in order to communicate with a second computing device associated with a second registered user. The quantum processor service provider can include a quantum EPR (Einstein Podoslky and Rosen) processor (QEP) and a logically co-located computer server.

公开(公告)号：US11916324B2

公开(公告)日：2024-02-27

申请号：US17644999

申请日：2021-12-17

Applicant: Cisco Technology, Inc.

Inventor： Mark C. Nowell ,  D. Brice Achkir ,  Joel R. Goergen ,  Giovanni Giobbio ,  Mary K. Laue

IPC: H01R12/72 ,  H01R13/6594

CPC classification number: H01R12/721 ,  H01R13/6594

Abstract: An electrical connector for connecting to an array of surface contacts includes a connector body and a plurality of cable terminators. The connector body defines an interior volume and includes an external surface defining a plurality of cable openings each configured to receive a respective multi-conductor cable therethrough and a plurality of passageways. The plurality of cable terminators are each configured to couple with a respective multi-conductor cable exiting the second section of a respective passageway. Each cable terminator includes a plurality of pins each configured to couple with a respective conductor of the multi-conductor cable and to extend to a respective contact surface. The contact surfaces of the plurality of cable terminators extend to a second plane. The first plane and the second plane are coplanar when the array is in the connection position.

公开(公告)号：US20230397343A1

公开(公告)日：2023-12-07

申请号：US17942711

申请日：2022-09-12

Applicant: Cisco Technology, Inc.

Inventor： Mike Sapozhnikov ,  Sayed Ashraf Mamun ,  D. Brice Achkir ,  David Nozadze ,  Amendra Koul ,  Upen Reddy Kareti

IPC: H05K3/46 ,  H05K3/00

CPC classification number: H05K3/4697 ,  H05K3/0047

Abstract: The techniques described herein relate to an apparatus including: a support structure of an integrated circuit device; and an elongated cavity formed in the support structure of the integrated circuit device, wherein an interior of the elongated cavity is plated with a conductive material separated into a first power connection portion and a first ground connection portion.

公开(公告)号：US20230269873A1

公开(公告)日：2023-08-24

申请号：US18305489

申请日：2023-04-24

Applicant: Cisco Technology, Inc.

Inventor： Joel Goergen ,  Jessica Kiefer ,  Alpesh Umakant Bhobe ,  Kameron Rose Hurst ,  D. Brice Achkir ,  Amendra Koul ,  Scott Hinaga ,  David Nozadze

IPC: H05K1/09 ,  H05K3/46

CPC classification number: H05K1/09 ,  H05K3/4644 ,  H05K2203/1545 ,  H05K2201/0323 ,  H05K2201/0338

Abstract: A structure includes a first copper layer and a first carbon layer applied directly to a surface of the first copper layer, a second copper layer and a second carbon layer applied directly to a surface of the second copper layer, and an insulating core disposed between the first and second copper layers. Each of the first carbon layer and the second carbon layer faces toward and directly contacts the insulating core. The structure provides electrical power to a component of an electronic device.

公开(公告)号：US20230071476A1

公开(公告)日：2023-03-09

申请号：US17702892

申请日：2022-03-24

Applicant: Cisco Technology, Inc.

Inventor： D. Brice Achkir ,  Shobhana Ram Punjabi ,  Jie Xue

IPC: H01L23/498

Abstract: A multi-layer substrate stacking a plurality of insulating substrates supports one or more devices. Each substrate includes a face supporting conductive traces and edges surrounding the face at a substantially perpendicular angle. The multi-layer substrate includes a ground plane on a first substrate and a power plane on a second substrate. The ground plane is connected to at least one ground pad disposed on a first edge of the first substrate, which provides a low inductance ground path to the ground plane. The power plane is connected to at least one power pad disposed on a second edge of the second substrate, which provides a low inductance power path to the power plane.

公开(公告)号：US20220228820A1

公开(公告)日：2022-07-21

申请号：US17154785

申请日：2021-01-21

Applicant: CISCO TECHNOLOGY, INC.

Inventor： M. Baris Dogruoz ,  Mehmet Onder Cap ,  D. Brice Achkir ,  Joel Richard Goergen

IPC: F28F21/02 ,  F28F3/04 ,  F28D21/00

Abstract: In one embodiment, a thermal management device includes a heat sink base and heat sink fins comprising a single element formed from a plurality of graphene layers with carbon nanotubes interposed between the graphene layers. A method is also disclosed herein.

公开(公告)号：US20220217837A1

公开(公告)日：2022-07-07

申请号：US17703051

申请日：2022-03-24

Applicant: Cisco Technology, Inc.

Inventor： Joel Goergen ,  Scott Hinaga ,  Jessica Kiefer ,  Alpesh Umakant Bhobe ,  D. Brice Achkir ,  David Nozadze ,  Amendra Koul ,  Mehmet Onder Cap ,  Madeline Marie Roemer

IPC: H05K1/02

Abstract: A conductive signal transmission structure for an electronic device (e.g., a printed circuit board of an electronic device) includes a copper material and a graphene layer disposed within the copper material at a depth below a surface of the structure. The depth of the graphene layer is further within a skin depth region of the structure when a transmission signal applied to the conductive signal transmission structure has a signal speed of at least 112 Gbps.

公开(公告)号：US20220039257A1

公开(公告)日：2022-02-03

申请号：US17503690

申请日：2021-10-18

Applicant: Cisco Technology, Inc.

Inventor： Joel Goergen ,  Jessica Kiefer ,  Alpesh Umakant Bhobe ,  Kameron Rose Hurst ,  D. Brice Achkir ,  Amendra Koul ,  Scott Hinaga ,  David Nozadze

IPC: H05K1/09 ,  H05K3/46

Abstract: A structure includes a first copper layer and a first carbon layer applied directly to a surface of the first copper layer, a second copper layer and a second carbon layer applied directly to a surface of the second copper layer, and an insulating core disposed between the first and second copper layers. Each of the first carbon layer and the second carbon layer faces toward and directly contacts the insulating core. The structure provides electrical power to a component of an electronic device.

公开(公告)号：US20220038189A1

公开(公告)日：2022-02-03

申请号：US17502848

申请日：2021-10-15

Applicant: Cisco Technology, Inc.

Inventor： Joel Richard Goergen ,  Charles Calvin Byers ,  Robert Gregory Twiss ,  D. Brice Achkir ,  Chad M. Jones

IPC: H04B10/80 ,  G02B6/42 ,  H04L12/40 ,  H04M19/08 ,  H04L12/12 ,  H04L12/10 ,  H02J50/80 ,  H02J50/30

Abstract: In one embodiment, a method includes receiving power delivered over a data fiber cable at an optical transceiver installed at a network communications device and transmitting data and the power from the optical transceiver to the network communications device. The network communications device is powered by the power received from the optical transceiver. An apparatus is also disclosed herein.

公开(公告)号：US11202368B2

公开(公告)日：2021-12-14

申请号：US17006016

申请日：2020-08-28

Applicant: Cisco Technology, Inc.

Inventor： Joel Goergen ,  Jessica Kiefer ,  Alpesh Umakant Bhobe ,  Kameron Rose Hurst ,  D. Brice Achkir ,  Amendra Koul ,  Scott Hinaga ,  David Nozadze

IPC: H05K3/46 ,  H05K1/09

Abstract: A power plane structure for a printed circuit board includes a copper layer, and a carbon layer applied directly to a surface of the copper layer. The carbon layer can include graphite or graphene. In additional embodiments, a duplicate power plane structure for a printed circuit board includes two power planes separated by an insulating core, each power plane including a copper layer and a carbon layer applied directly to a surface of the copper layer.