公开(公告)号：US11001523B2

公开(公告)日：2021-05-11

申请号：US15906225

申请日：2018-02-27

Applicant: CORNING INCORPORATED

Inventor： Johannes Moll ,  James Joseph Price ,  Alranzo Boh Ruffin ,  Sergio Tsuda ,  Robert Stephen Wagner ,  James Joseph Watkins

IPC: C03C23/00 ,  C03C21/00 ,  B44C1/22 ,  B41M5/24

Abstract: Strengthened glass articles having laser etched features, electronic devices, and methods of fabricating etched features in strengthened glass articles are disclosed. In one embodiment, a strengthened glass article includes a first strengthened surface layer and a second strengthened surface layer under a compressive stress and extending from a first surface and a second surface, respectively, of the strengthened glass article to a depth of layer, and a central region between the first strengthened surface layer and the second strengthened surface layer that is under tensile stress. The strengthened glass article further includes at least one etched feature formed by laser ablation within the first surface or the second surface having a depth that is less than the depth of layer and a surface roughness that is greater than a surface roughness of the first surface or second surface outside of the at least one etched feature.

公开(公告)号：US10597321B2

公开(公告)日：2020-03-24

申请号：US15114236

申请日：2015-01-27

Applicant: Corning Incorporated

Inventor： Sasha Marjanovic ,  David Andrew Pastel ,  Garrett Andrew Piech ,  Jose Mario Quintal ,  Helmut Schillinger ,  Sergio Tsuda ,  Robert Stephen Wagner ,  Andrea Nichole Yeary

IPC: B23K26/40 ,  C03B33/02 ,  B23K26/08 ,  C03B33/09 ,  C03B33/08 ,  B23K26/53 ,  B24B9/10 ,  B23K26/02 ,  B23K26/04 ,  B23K26/035 ,  B23K26/361 ,  B23K26/0622 ,  B23K26/362 ,  B23K26/402 ,  C03C21/00 ,  B23K103/00

Abstract: Processes of chamfering and/or beveling an edge of a glass substrate of arbitrary shape using lasers are described herein. Two general methods to produce chamfers on glass substrates are the first method involves cutting the edge with the desired chamfer shape utilizing an ultra-short pulse laser to create perforations within the glass; followed by an ion exchange.

公开(公告)号：US10442719B2

公开(公告)日：2019-10-15

申请号：US14530410

申请日：2014-10-31

Applicant: Corning Incorporated

Inventor： Sasha Marjanovic ,  Albert Roth Nieber ,  Garrett Andrew Piech ,  Helmut Schillinger ,  Sergio Tsuda ,  Robert Stephen Wagner

IPC: B23K26/02 ,  B23K26/08 ,  C03B33/02 ,  C03B33/08 ,  C03B33/09 ,  B23K26/53 ,  B24B9/10 ,  B23K26/04 ,  B23K26/035 ,  B23K26/361 ,  B23K26/0622 ,  B23K26/362 ,  B23K26/402 ,  C03C21/00 ,  B23K103/00

Abstract: Processes of chamfering and/or beveling an edge of a glass or other substrate of arbitrary shape using lasers are described herein. Three general methods to produce chamfers on glass substrates are disclosed. The first method involves cutting the edge with the desired chamfer shape utilizing an ultra-short pulse laser. Treatment with the ultra-short laser may be optionally followed by a CO2 laser for fully automated separation. The second method is based on thermal stress peeling of a sharp edge corner, and it has been demonstrated to work with different combination of an ultrashort pulse and/or CO2 lasers. A third method relies on stresses induced by ion exchange to effect separation of material along a fault line produced by an ultra-short laser to form a chamfered edge of desired shape.

公开(公告)号：US10293436B2

公开(公告)日：2019-05-21

申请号：US14535800

申请日：2014-11-07

Applicant: Corning Incorporated

Inventor： Sasha Marjanovic ,  Garrett Andrew Piech ,  Shyamala Shanmugam ,  Sergio Tsuda ,  Robert Stephen Wagner

IPC: B23K26/04 ,  B23K26/06 ,  B23K26/38 ,  B23K26/53 ,  B23K26/55 ,  B32B17/06 ,  C03B33/02 ,  C03B33/09 ,  C03C15/00 ,  C03C17/00 ,  B23K26/384 ,  B23K26/402 ,  B23K26/0622 ,  C09K13/00 ,  B23K103/00

Abstract: Forming holes in a material includes focusing a pulsed laser beam into a laser beam focal line oriented along the beam propagation direction and directed into the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a defect line along the laser beam focal line within the material, and translating the material and the laser beam relative to each other, thereby forming a plurality of defect lines in the material, and etching the material in an acid solution to produce holes greater than 1 micron in diameter by enlarging the defect lines in the material. A glass article includes a stack of glass substrates with formed holes of 1-100 micron diameter extending through the stack.

公开(公告)号：US10233112B2

公开(公告)日：2019-03-19

申请号：US15251605

申请日：2016-08-30

Applicant: Corning Incorporated

Inventor： Thomas Hackert ,  Sasha Marjanovic ,  Garrett Andrew Piech ,  Sergio Tsuda ,  Robert Stephen Wagner

IPC: C03B33/08 ,  B23K26/00 ,  B23K26/06 ,  B23K26/0622 ,  B23K26/53 ,  C03B33/02 ,  C03B33/04 ,  C03B33/09 ,  B23K26/382 ,  B23K26/55 ,  B23K26/359 ,  B23K103/00

Abstract: The present invention relates to a process for cutting and separating interior contours in thin substrates of transparent materials, in particular glass. The method involves the utilization of an ultra-short pulse laser to form perforation or holes in the substrate, that may be followed by use of a CO2 laser beam to promote full separation about the perforated line.

公开(公告)号：US10183885B2

公开(公告)日：2019-01-22

申请号：US15496393

申请日：2017-04-25

Applicant: Corning Incorporated

Inventor： Dana Craig Bookbinder ,  Stephan Lvovich Logunov ,  Sasha Marjanovic ,  Albert Roth Nieber ,  Garrett Andrew Piech ,  Kamjula Pattabhirami Reddy ,  Pushkar Tandon ,  Sergio Tsuda ,  Natesan Venkataraman ,  Robert Stephen Wagner

IPC: C03B33/02 ,  C03B25/087 ,  C03B33/07 ,  B23K26/53 ,  B23K26/0622 ,  B23K26/402 ,  C03B17/06 ,  C03B33/09 ,  B23K26/359 ,  B23K103/00 ,  B23K103/16

Abstract: The present disclosure relates to a process for cutting and separating arbitrary shapes of thin substrates of transparent materials, particularly tailored composite fusion drawn glass sheets, and the disclosure also relates to a glass article prepared by the method. The developed laser method can be tailored for manual separation of the parts from the panel or full laser separation by thermally stressing the desired profile. The self-separation method involves the utilization of an ultra-short pulse laser that can be followed by a CO2 laser (coupled with high pressure air flow) for fully automated separation.

公开(公告)号：US20180057390A1

公开(公告)日：2018-03-01

申请号：US15560390

申请日：2016-03-23

Applicant: Corning Incorporated

Inventor： Thomas Hackert ,  Xinghua Li ,  Sasha Marjanovic ,  Moussa N'Gom ,  David Andrew Pastel ,  Garrett Andrew Piech ,  Daniel Schnitzler ,  Robert Stephen Wagner ,  James Joseph Watkins

IPC: C03B33/02 ,  B23K26/364 ,  C03C3/093

CPC classification number: C03B33/0222 ,  B23K26/364 ,  B23K26/53 ,  B23K2103/54 ,  C03B33/0215 ,  C03C3/093 ,  Y02P40/57

Abstract: The present invention relates to a laser cutting technology for cutting and separating thin substrates of transparent materials, for example to cutting of display glass compositions mainly used for production of Thin Film Transistors (TFT) devices. The described laser process can be used to make straight cuts, for example at a speed of >0.25 m/sec, to cut sharp radii outer corners (

公开(公告)号：US09815730B2

公开(公告)日：2017-11-14

申请号：US14530379

申请日：2014-10-31

Applicant: Corning Incorporated

Inventor： Sasha Marjanovic ,  Albert Roth Nieber ,  Garrett Andrew Piech ,  Sergio Tsuda ,  Robert Stephen Wagner

IPC: C03B33/09 ,  C03B33/02 ,  C03B33/08 ,  C03B33/10 ,  C03B23/02 ,  C03B33/033 ,  C03B23/023 ,  C03B23/025 ,  B23K26/00 ,  B23K26/402 ,  B23K26/0622 ,  B23K26/53 ,  B23K26/08 ,  C03B33/023 ,  C03B33/04 ,  B23K103/16 ,  B23K103/00

CPC classification number: C03B33/091 ,  B23K26/0622 ,  B23K26/0624 ,  B23K26/0884 ,  B23K26/359 ,  B23K26/402 ,  B23K26/53 ,  B23K2103/172 ,  B23K2103/50 ,  B23K2103/54 ,  B65G2249/04 ,  C03B23/02 ,  C03B23/023 ,  C03B23/025 ,  C03B33/0222 ,  C03B33/023 ,  C03B33/033 ,  C03B33/04 ,  C03B33/082 ,  C03B33/102 ,  Y02P40/57 ,  Y10T428/15 ,  Y10T428/24777

Abstract: Methods are provided for laser processing arbitrary shapes of molded 3D thin transparent brittle parts from substrates with particular interest in substrates formed from strengthened or non-strengthened Corning Gorilla® glass (all codes). The developed laser methods can be tailored for manual separation of the parts from the panel or full laser separation by thermal stressing the desired profile. Methods can be used to form 3D surfaces with small radii of curvature. The method involves the utilization of an ultra-short pulse laser that may be optionally followed by a CO2 laser for fully automated separation.

公开(公告)号：US20170291844A1

公开(公告)日：2017-10-12

申请号：US15585305

申请日：2017-05-03

Applicant: Corning Incorporated

Inventor： Sasha Marjanovic ,  Garrett Andrew Piech ,  Sergio Tsuda ,  Robert Stephen Wagner

IPC: C03B33/02 ,  B32B17/06 ,  B23K26/0622 ,  B23K26/40 ,  B23K26/00 ,  B23K26/073

CPC classification number: C03B33/0222 ,  B23K26/0006 ,  B23K26/0613 ,  B23K26/0624 ,  B23K26/0738 ,  B23K26/40 ,  B23K26/53 ,  B23K26/55 ,  B23K2103/50 ,  B32B17/06 ,  B32B2250/02 ,  B32B2315/02 ,  Y02P40/57 ,  Y10T428/21 ,  Y10T428/24273 ,  Y10T428/24355

Abstract: A method of laser processing a material to form a separated part. The method includes focusing a pulsed laser beam into a laser beam focal line, viewed along the beam propagation direction, directed into the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a hole or fault line along the laser beam focal line within the material, and directing a defocused carbon dioxide (CO2) laser from a distal edge of the material over the plurality of holes to a proximal edge of the material.

公开(公告)号：US09687936B2

公开(公告)日：2017-06-27

申请号：US14529801

申请日：2014-10-31

Applicant: Corning Incorporated

Inventor： Sasha Marjanovic ,  Garrett Andrew Piech ,  Sergio Tsuda ,  Robert Stephen Wagner

IPC: C03B33/02 ,  B23K26/00 ,  B23K26/382 ,  B23K26/0622

CPC classification number: B23K26/53 ,  B23K26/0624 ,  B23K26/382 ,  C03B33/0222 ,  Y02P40/57

Abstract: A system for laser drilling of a material includes a pulsed laser configured to produce a pulsed laser beam having a wavelength less than or equal to about 850 nm, the wavelength selected such that the material is substantially transparent at this wavelength. The system further includes an optical assembly positioned in the beam path of the laser, configured to transform the laser beam into a laser beam focal line oriented along the beam propagation direction, on a beam emergence side of the optical assembly.