Abstract:
Provided are a washing method and washing machine. In the washing method, an eco-rinsing process where a drum rotates in a state where at least a portion of laundry is pressed against the inner wall of the drum and wash water is sprayed into the drum is performed. A spinning process where the spraying of the wash water is stopped and the wash water is removed from the laundry by accelerating the drum is performed. Here, at least a portion of the laundry remains pressed against the wall of the drum in the eco-rinsing process and the spinning process.
Abstract:
Provided are a washing method and washing machine. In the washing method, an eco-rinsing process where a drum rotates in a state where at least a portion of laundry is pressed against the inner wall of the drum and wash water is sprayed into the drum is performed. A spinning process where the spraying of the wash water is stopped and the wash water is removed from the laundry by accelerating the drum is performed. Here, at least a portion of the laundry remains pressed against the wall of the drum in the eco-rinsing process and the spinning process.
Abstract:
Provided are a washing method and washing machine. According to an aspect of the present invention, there is provided a washing method including: performing a balancing process where washing water is sprayed to a laundry loaded in the drum and the laundry is evenly distributed by repeatedly accelerating the drum, constantly maintaining a constant RPM of the drum, and reducing the RPM of the drum; and performing a laundry treating process where the drum rotates such that at least a portion of the laundry is pressed against an inner wall of the drum and the wash water is sprayed into the drum.
Abstract:
Provided is a method for washing laundry in a washing machine, wherein the washing machine includes a tub and a drum disposed inside the tub, the method comprising: supplying wash water into the tub; rotating the drum such that the laundry is attached the drum and spraying the wash water changed to whirling water into the drum; and draining the wash water from the tub.
Abstract:
A method for forming a feature in an etch layer is provided. A photoresist layer is formed over the etch layer. The photoresist layer is patterned to form photoresist features with photoresist sidewalls. A control layer is formed over the photoresist layer and bottoms of the photoresist features. A conformal layer is deposited over the sidewalls of the photoresist features and control layer to reduce the critical dimensions of the photoresist features. Openings in the control layer are opened with a control layer breakthrough chemistry. Features are etched into the etch layer with an etch chemistry, which is different from the control layer break through chemistry, wherein the control layer is more etch resistant to the etch with the etch chemistry than the conformal layer.
Abstract:
A method providing features in a dielectric layer is provided. A sacrificial layer is formed over the dielectric layer. A set of sacrificial layer features is etched into the sacrificial layer. A first set of dielectric layer features is etched into the dielectric layer through the sacrificial layer. The first set of dielectric layer features and the set of sacrificial layer features are filled with a filler material. The sacrificial layer is removed. The widths of the spaces between the parts of the filler material are shrunk with a shrink sidewall deposition. A second set of dielectric layer features is etched into the dielectric layer through the shrink sidewall deposition. The filler material and shrink sidewall deposition are removed.
Abstract:
A method for etching a feature in a low-k dielectric layer through a photoresist etch mask over a substrate. A gas-modulated cyclic stripping process is performed for more than three cycles for stripping a single photoresist mask. Each cycle of the gas-modulated cyclic stripping process comprises performing a protective layer formation phase and a stripping phase. The protective layer forming phase using first gas chemistry with a deposition gas chemistry, wherein the protective layer forming phase is performed in about 0.005 to 10 seconds for each cycle. The performing the stripping phase for stripping the photoresist mask using a second gas chemistry using a stripping gas chemistry, where the first gas chemistry is different than the second gas chemistry, wherein the etching phase is performed in about 0.005 to 10 seconds for each cycle.
Abstract:
A method providing features in a dielectric layer is provided. A sacrificial layer is formed over the dielectric layer. A set of sacrificial layer features is etched into the sacrificial layer. A first set of dielectric layer features is etched into the dielectric layer through the sacrificial layer. The first set of dielectric layer features and the set of sacrificial layer features are filled with a filler material. The sacrificial layer is removed. The widths of the spaces between the parts of the filler material are shrunk with a shrink sidewall deposition. A second set of dielectric layer features is etched into the dielectric layer through the shrink sidewall deposition. The filler material and shrink sidewall deposition are removed.
Abstract:
A method for providing features in an etch layer with a memory region and a peripheral region is provided. A memory patterned mask is formed over a first sacrificial layer. A first set of sacrificial layer features is etched into the first sacrificial layer and a second sacrificial layer. Features of the first set of sacrificial layer features are filled with filler material. The first sacrificial layer is removed. The spaces are shrunk with a shrink sidewall deposition. A second set of sacrificial layer features is etched into the second sacrificial layer. The filler material and shrink sidewall deposition are removed. A peripheral patterned mask is formed over the memory region and peripheral region. The second sacrificial layer is etched through the peripheral patterned mask. The peripheral patterned mask is removed. Features are etched into the etch layer from the second sacrificial layer.
Abstract:
A method for forming damascene features in a dielectric layer over a barrier layer over a substrate is provided. A plurality of vias are etched in the dielectric layer to the barrier layer with a plasma etching process in the plasma processing chamber. A patterned photoresist layer is formed with a trench pattern. Within a single plasma process chamber a combination via plug deposition to form plugs in the vias over the barrier layer and trench etch is provided.