摘要:
A protruding portion 100 having a sloped surface 100b sloped against a ceiling surface is provided on the ceiling side of a cooking chamber 20. Superheated steam from a steam temperature-raising device 50 is blown off from first ceiling steam blowoff openings 101 provided in a flat surface 100a of the protruding portion 100 toward a bottom face within the cooking chamber 20, while the superheated steam is blown off from second ceiling steam blowoff openings 102 provided in a sloped surface 100b of the protruding portion 100 toward the side face within the cooking chamber 20. The superheated steam blown off from these steam blowoff openings 101 and 102 is effectively supplied to upper-and-back surface of a heating object 90 rested in the cooking chamber 20 so as to be spaced from the bottom face of the cooking chamber 20.
摘要:
A domestic appliance combination comprising at least a first domestic appliance and a second domestic appliance arranged thereabove is disclosed, these being connected to one another for installation into a common built-in housing, with the second domestic appliance being connected to the first domestic appliance by means of a clamp-connection. A method for connecting at least two domestic appliances one above the other is also disclosed, which comprises a step involving fastening the second domestic appliance by means of a clamp-connection.
摘要:
A conveying device A is disposed inside a vacuum chamber B, includes a fixation base 1; a swivel base which is held rotatably with respect to the fixation base 1; linear movement mechanisms 3A, 3B supported by the swivel base 2; and hands 4A, 4B supported by the linear movement mechanisms 3A, 3B; and a transports work W placed on the hands 4A, 4B by operation of the linear movement mechanism 3A, 3B. Radiation plates 62, 63, 65 are provided at appropriate locations on a lower surface side of the swivel base or of the linear movement mechanisms 3A, 3B. The vacuum chamber is provided with heat absorption plates 61, 66 on a wall which faces the lower surface side of the swivel base 2.
摘要:
The invention relates to a temperature probe for an oven, comprising in one embodiment a longitudinal housing in the form of a spit. A temperature sensor and an electronic unit are arranged in a tip and are connected at the other end to emitting means. The temperature probe comprises a thermogenerator for producing energy. The thermogenerator uses a temperature difference between a higher temperature inside the oven and a lower core temperature in a food product, such as roast, in which the temperature probe is inserted, for producing energy for operating the emitting means.
摘要:
A heating cooking appliance includes a heating chamber for items to be cooked, a circulation duct connecting an inlet port and an outlet port both of which open into the heating chamber, an air blower located in the circulation duct, and a heating device in the upper part of the heating chamber. Gas in the heating chamber is taken into the circulation duct from the inlet port by the blower. The gas temperature is raised by the heating device, and subsequently, the gas is blown into the heating chamber from the inlet port. The circulation duct is provided with first and second paths which branch off upstream of the heating device. The first and second paths guide gas to the area upstream and downstream of the heating device, respectively.
摘要:
A cooking appliance has a cabinet including a front portion, opposing side panels, a base portion, a back panel and a top surface. First and second oven cavities are disposed within the cabinet. Each of the first and second oven cavities include respective sidewall portions maintained in a spaced apart relationship from the opposing side panels. A first airflow passageway provides combustion air to the first oven cavity and cooling air within the cabinet and a second airflow passageway provides combustion air to the lower cavity. The second airflow passageway is separated from the first airflow passageway.
摘要:
A compact conveyor oven is disclosed comprising a cooking chamber, thermal heating source, conveyor means and independent top and bottom airflow within the cooking chamber wherein substantially equal pressurization of the top and bottom airflows is achieved within the compact footprint.
摘要:
The invention relates to a device for storing, treating and dispensing items of food, especially baked products, which device comprises at least two sections (2, 3). The inventive device is characterized by a plurality of supports (12) for receiving the items of food (9, 10) and a transport device (17, 20, 21, 22) that configures a closed transport cycle of the supports (12) between the sections (2, 3).
摘要:
A heating apparatus includes a oven. The oven includes a box, a motor, a fan chamber, an air duct and a heater. The box defines a cavity. The motor includes a fan. The motor is attached to the box. The fan chamber is fixed in the cavity and defines a inlet and a outlet. The air duct includes a first air hole and a second air hole. The first air hole communicates with the outlet, and the second air hole communicates with the cavity. The heater is received in the air duct. The motor drives the fan to absorb air from the inlet of the fan chamber and blow the air into the air duct. The air is heated by the heater and flows from the second air hole.
摘要:
In photo-irradiation heating with a total photo-irradiation time of one second or less, after initial photo-irradiation of a semiconductor wafer is performed while increasing an emission output to a target value, succeeding photo-irradiation of the semiconductor wafer is performed while maintaining the emission output within a range of plus or minus 20% from the target value. The photo-irradiation time for the initial photo-irradiation ranges from 0.1 to 10 milliseconds, and the photo-irradiation time for the succeeding photo-irradiation ranges from 5 milliseconds to less than one second. This allows the temperature of the semiconductor wafer even at a somewhat greater depth below the surface to be raised to some extent while allowing the surface temperature to be maintained at a generally constant processing temperature, thus achieving both the activation of implanted ions and the repair of introduced defects without any thermal damage to the semiconductor wafer.