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    Device and method for identifying status of external electronic device
    31.
    发明授权
    Device and method for identifying status of external electronic device 有权

    公开(公告)号：US12003035B2

    公开(公告)日：2024-06-04

    申请号：US17259416

    申请日：2019-07-08

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Ilpyo Hong ,  Jihee Kang ,  Jiyong Kim ,  Jihoon Kim ,  Jongin Lee

    IPC: H01Q3/24 ,  H01Q21/30 ,  H04B17/12 ,  H04B17/17 ,  H04B17/318

    CPC classification number: H01Q21/30 ,  H01Q3/24 ,  H04B17/12 ,  H04B17/17 ,  H04B17/318

    Abstract: An electronic device for identifying a status of a wireless communication device of various embodiments of the present disclosure can include an antenna configured to receive wireless signals outputted from a first antenna and a second antenna included in an external electronic device, a communication circuit electrically connected to the antenna, and a control circuit. The control circuit can be configured to control the external electronic device wherein the external electronic device outputs specified wireless signals at a first specified phase by using the first antenna and at a second specified phase by using the second antenna, receive the specified wireless signals by using the antenna, identify a signal intensity corresponding to the specified wireless signals by using the communication circuit, and determine a status related to the external electronic device at least on the basis of a difference value between the specified signal intensity and a reference signal intensity.

    Apparatus and method for amplifying transmission signals in wireless communication system
    36.
    发明授权
    Apparatus and method for amplifying transmission signals in wireless communication system 有权

    公开(公告)号：US11362690B2

    公开(公告)日：2022-06-14

    申请号：US17262961

    申请日：2019-07-25

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Byungjoon Park ,  Daehyun Kang ,  Jihoon Kim ,  Hyunchul Park ,  Juho Son

    IPC: H04B1/04 ,  H03F3/24 ,  H03F1/02 ,  H03F3/19

    Abstract: The present disclosure relates to a 5th generation (5G) or pre-5G communication system for supporting a data transmission rate higher than that of a 4th generation (4G) communication system such as long term evolution (LTE). The present disclosure is to amplify transmission signals in a wireless communication system, and a transmitting device may include an antenna array including a plurality of antenna elements, a plurality of amplification chains for amplifying signals transmitted through the plurality of the antenna elements, and a power supply line for supplying powers to the plurality of the amplification chains. Herein, the powers used by power amplifiers included in at least one amplification chain of the plurality of the amplification chains may be divided by filtering or by independent pads and branch-lines.

    Semiconductor package
    37.
    发明授权
    Semiconductor package 有权

    公开(公告)号：US11171082B2

    公开(公告)日：2021-11-09

    申请号：US16661345

    申请日：2019-10-23

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Jihoon Kim ,  Mijin Park ,  Jinwon Lee

    IPC: H01L23/495 ,  H01L23/498 ,  H01L23/31 ,  H01L25/16 ,  H01L23/13 ,  H01L23/00

    Abstract: A semiconductor package includes: a connection structure including a plurality of insulating layers and redistribution layers respectively disposed on the plurality of insulating layers; a semiconductor chip having connection pads connected to the redistribution layer; an encapsulant encapsulating the semiconductor chip; first and second pads arranged on at least one surface of the connection structure and each having a plurality of through-holes; a surface mount component disposed on the at least one surface of the connection structure and including first and second external electrodes positioned, respectively, in regions of the first and second pads; first and second connection vias arranged in the plurality of insulating layers and connecting the first and second pads to the redistribution layers, respectively; and first and second connection metals connecting the first and second pads and the first and second external electrodes to each other, respectively.

    Antenna module supporting dual bands and electronic device including the same
    38.
    发明授权
    Antenna module supporting dual bands and electronic device including the same 有权

    公开(公告)号：US11018412B2

    公开(公告)日：2021-05-25

    申请号：US16804805

    申请日：2020-02-28

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Jihoon Kim ,  Junghwan Son ,  Chaejun Lee

    IPC: H01Q1/24 ,  H01Q5/30 ,  H01Q1/38 ,  H01Q1/27

    Abstract: An electronic device including a housing; a display; a wireless communication circuit comprising a first port, a second port, a third port, and a fourth port, wherein the wireless communication circuit is configured to transmit a first signal having a first frequency via the first port; receive a second signal having the first frequency via the second port; transmit a third signal having a second frequency different from the first frequency via the third port; and receive a fourth signal having the second frequency via the fourth port; and an antenna structure disposed inside the housing, wherein the antenna structure comprises: a conductive pattern; a first node, a second node, and a third node electrically connected to the conductive pattern; a first electrical path; a second electrical path; a third electrical path; a fourth electrical path; a fifth electrical path; a sixth electrical path; and a seventh electrical path.

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