Timestamp calibration of the 3D camera with epipolar line laser point scanning

    公开(公告)号:US10447958B2

    公开(公告)日:2019-10-15

    申请号:US16149023

    申请日:2018-10-01

    Abstract: Using the same image sensor to capture a two-dimensional (2D) image and three-dimensional (3D) depth measurements for a 3D object. A laser point-scans the surface of the object with light spots, which are detected by a pixel array in the image sensor to generate the 3D depth profile of the object using triangulation. Each row of pixels in the pixel array forms an epipolar line of the corresponding laser scan line. Timestamping provides a correspondence between the pixel location of a captured light spot and the respective scan angle of the laser to remove any ambiguity in triangulation. An Analog-to-Digital Converter (ADC) in the image sensor operates as a Time-to-Digital (TDC) converter to generate timestamps. A timestamp calibration circuit is provided on-board to record the propagation delay of each column of pixels in the pixel array and to provide necessary corrections to the timestamp values generated during 3D depth measurements.

    MQW devices and methods for semiconductor patterning systems

    公开(公告)号:US09703208B2

    公开(公告)日:2017-07-11

    申请号:US14714245

    申请日:2015-05-15

    CPC classification number: G03F7/70291 G02F1/0121 G02F1/017

    Abstract: MQW devices, IC chips and methods may be used in semiconductor lithography patterning systems. An MQW device includes an array of pixels that have transmission elements and associated support circuits. The support circuits have preliminary memory cells and final memory cells. The final memory cells store transmittance values that control transmittances of the associated transmission elements. This way, exposure of a target with a lithography system for purposes of patterning the target may be performed through the transmission elements according to the controlled transmittances, while subsequent transmittance values are being received by the preliminary memory cells from memory banks. The exposure of the target therefore needs to pause for less time, in order to wait for the MQW device to be refreshed with the subsequent transmittance values. Accordingly the whole semiconductor lithography patterning system may operate faster and thus have more throughput.

    Unit pixel of stacked image sensor and stacked image sensor including the same
    33.
    发明授权
    Unit pixel of stacked image sensor and stacked image sensor including the same 有权
    堆叠图像传感器的单位像素和包括其的堆叠图像传感器

    公开(公告)号:US09350930B2

    公开(公告)日:2016-05-24

    申请号:US14453124

    申请日:2014-08-06

    Abstract: A unit pixel of a stacked image sensor includes a stacked photoelectric conversion unit, a first and second signal generating units. The stacked photoelectric conversion unit includes first, second and third photoelectric conversion elements that are stacked on each other. The first, second and third photoelectric conversion elements collect first, second and third photocharges based on first, second and third components of incident light. The first signal generating unit generates a first pixel signal based on the first photocharges and a first signal node and generates a second pixel signal based on the second photocharges and the first signal node. The second signal generating unit generates a third pixel signal based on the third photocharges and a second signal node. At least a portion of the second signal generating unit is shared by the first signal generating unit.

    Abstract translation: 层叠图像传感器的单位像素包括层叠光电转换单元,第一和第二信号生成单元。 叠层光电转换单元包括彼此堆叠的第一,第二和第三光电转换元件。 第一,第二和第三光电转换元件基于入射光的第一,第二和第三分量收集第一,第二和第三光电荷。 第一信号产生单元基于第一光电荷产生第一像素信号和第一信号节点,并且基于第二光电荷和第一信号节点生成第二像素信号。 第二信号生成单元基于第三光电荷产生第三像素信号和第二信号节点。 第二信号生成单元的至少一部分由第一信号生成单元共享。

    LWIR sensor with capacitive microbolometer and hybrid visible/LWIR sensor

    公开(公告)号:US12192670B2

    公开(公告)日:2025-01-07

    申请号:US17950083

    申请日:2022-09-21

    Abstract: A pixel for an image sensor includes a microbolometer sensor portion, a visible image sensor portion and an output path. The microbolometer sensor portion outputs a signal corresponding to an infrared (IR) image sensed by the microbolometer sensor portion. The visible image sensor portion outputs a signal corresponding to a visible image sensed by the visible image sensor portion. The output path is shared by the microbolometer and the visible image sensor portions, and is controlled to selectively output the signal corresponding to the IR image or the signal corresponding to the visible image. The output path may be further shared with a visible image sensor portion of an additional pixel, in which case the output path may be controlled to selectively to also output the signal corresponding to a visible image of the additional pixel.

    Concurrent RGBZ sensor and system
    36.
    发明授权

    公开(公告)号:US11924545B2

    公开(公告)日:2024-03-05

    申请号:US17941000

    申请日:2022-09-08

    CPC classification number: H04N23/667 G06T7/521 H04N2213/003

    Abstract: Two-dimensional (2D) color information and 3D-depth information are concurrently obtained from a 2D pixel array. The 2D pixel array is arranged in a first group of a plurality of rows. A second group of rows of the array are operable to generate 2D-color information and pixels of a third group of the array are operable to generate 3D-depth information. The first group of rows comprises a first number of rows, the second group of rows comprises a second number of rows that is equal to or less than the first number of rows, and the third group of rows comprises a third number of rows that is equal to or less than the second number of rows. In an alternating manner, 2D-color information is received from a row selected from the second group of rows and 3D-depth information is received from a row selected from the third group of rows.

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