ELECTRONIC APPARATUS AND METHOD FOR CONTROLLING THEREOF

    公开(公告)号:US20210181349A1

    公开(公告)日:2021-06-17

    申请号:US17119370

    申请日:2020-12-11

    Abstract: An electronic apparatus is provided. The electronic apparatus according to the disclosure includes: a light emitter; a light receiver; a memory; and a processor, wherein the processor is configured to: acquire a first depth image based on first reflected light acquired during a first time period and store the first depth image in the memory, acquire a second depth image based on second reflected light acquired during a second time period following the first time period, and acquire distance information between the electronic apparatus and the object included in the second depth image by subtracting a first depth value of each pixel of the first depth image from a second depth value of each pixel of the second depth image, and correct the distance information by using a compensation value acquired based corresponding to time information on the second time period.

    ELECTRONIC DEVICE INCLUDING A SENSOR WHICH IS DISPOSED BELOW A DISPLAY

    公开(公告)号:US20210097253A1

    公开(公告)日:2021-04-01

    申请号:US17029570

    申请日:2020-09-23

    Abstract: An portable communication device may include a display, a back panel that is disposed below the display, a support member that is disposed below the back panel, a sensor that is disposed such that at least a portion of the sensor faces a back surface of the display through a sensor hole formed at the support member, a first adhesive member that adheres at least a portion of the sensor on one side of the support member, and a second adhesive member that is disposed between the sensor (or a sensor structure including the sensor) and the sensor hole.

    METHODS OF MANUFACTURING SEMICONDUCTOR PACKAGES

    公开(公告)号:US20180108644A1

    公开(公告)日:2018-04-19

    申请号:US15627536

    申请日:2017-06-20

    CPC classification number: H01L25/50 H01L21/4857 H01L21/56

    Abstract: A method of manufacturing a semiconductor package, the method including forming a hole that penetrates an interconnect substrate; providing a first carrier substrate below the interconnect substrate; providing a semiconductor chip in the hole; forming a molding layer by coating a molding composition on the semiconductor chip and the interconnect substrate; adhering a second carrier substrate onto the molding layer with an adhesive layer; removing the first carrier substrate to expose a bottom surface of the semiconductor chip and a bottom surface of the interconnect substrate; forming a redistribution substrate below the semiconductor chip and the interconnect substrate; detaching the second carrier substrate from the adhesive layer; and removing the adhesive layer.

    ELECTRONIC DEVICE FOR SELECTION AND CONTROL OF OBJECT ON BASIS OF CLASSIFICATION, AND METHOD THEREOF

    公开(公告)号:US20250095305A1

    公开(公告)日:2025-03-20

    申请号:US18962983

    申请日:2024-11-27

    Abstract: A wearable device includes: a display; and at least one processor, wherein the at least one processor is configured to: receive an input indicating selection of a first external electronic device and a second external electronic device among a plurality of external electronic devices viewable through the display; based on the input, identify third external electronic devices in a category including both the first external electronic device and the second external electronic device, and identify the first external electronic device and the second external electronic device along with the third external electronic devices; display a first visual object and a second visual object respectively indicating that the first external electronic device and the second external electronic device are selected; and display at least one third visual object guiding selection of at least one fourth external electronic device among the third external electronic devices.

    SENSOR ASSEMBLY INCLUDING LIGHT CONTROL MEMBER AND ELECTRONIC DEVICE INCLUDING THE SAME

    公开(公告)号:US20230209173A1

    公开(公告)日:2023-06-29

    申请号:US17961131

    申请日:2022-10-06

    CPC classification number: H04N5/23218 H04N5/2252 H04N5/22541 H04N5/232121

    Abstract: A sensor assembly is provided. The sensor assembly includes a housing including an opening, a circuit substrate disposed in the inside of the housing, an image sensor electrically connected to the circuit substrate, a light-control member configured to change light transmittance from a light transmission state capable of transmitting external light to a light reflection state capable of reflecting light according to application of power, and a contact member disposed adjacent to the opening and allowing light to pass therethrough. wherein, when viewed from a lateral side, the light-control member is disposed such that a longitudinal extension line of the light-control member and a longitudinal extension line of the contact member may form a predetermined angle therebetween, when the light-control member is in the light transmission state, the image sensor is disposed to obtain an image over the light-control member, and when the light-control member is in the light reflection state, the image sensor is disposed to receive light reflected by the light-control member and light directly incident through the contact member.

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