公开(公告)号：US11502227B2

公开(公告)日：2022-11-15

申请号：US17006128

申请日：2020-08-28

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Romain Coffy ,  Remi Brechignac ,  Jean-Michel Riviere

IPC: H01L33/52 ,  H01L31/0203 ,  H01L31/0216 ,  H01L33/44 ,  H01L33/62

Abstract: An electronic device includes a first electronic component and a second electronic. Each electronic component includes a carrier substrate having a back side and a front side, an electronic chip including an integrated optical element, an overmolded transparent block encapsulating the electronic chip above the carrier substrate, and electrical connections between the electronic chip and electrical contacts of the carrier substrate. An overmolded grid encapsulates and holds the first and second electronic components. The grid is configured so that sides of the first and second electronic components are at least partially exposed.

公开(公告)号：US11437527B2

公开(公告)日：2022-09-06

申请号：US16896780

申请日：2020-06-09

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Karine Saxod ,  Veronique Ferre ,  Agnes Baffert ,  Jean-Michel Riviere

IPC: H01L31/0203 ,  H01L21/56 ,  H01L31/0232 ,  H01L31/18 ,  H01L31/16 ,  H01L31/12 ,  H01L33/48

Abstract: An encapsulation cover for an electronic package includes a frontal wall with a through-passage extending between faces. The frontal wall includes an optical element that allows light to pass through the through-passage. A cover body and a metal insert that is embedded in the cover body, with the cover body being overmolded over the metal insert, defines at least part of the frontal wall.

公开(公告)号：US11322666B2

公开(公告)日：2022-05-03

申请号：US17071603

申请日：2020-10-15

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Romain Coffy ,  Remi Brechignac ,  Jean-Michel Riviere

IPC: H01L33/54 ,  H01L33/00

Abstract: An optoelectronic device includes an emitter of light rays and a receiver of light rays. The emitter is encapsulated within a first encapsulation layer, and the receiver is encapsulated within a second encapsulation layer. An opaque layer covers the first encapsulation layer (encapsulating the receiver) and covers the second encapsulation layer (encapsulating the emitter). The first and second encapsulation layers are separated by a region of opaque material. This opaque material may be provided by the opaque layer or an opaque fill.

公开(公告)号：US11139255B2

公开(公告)日：2021-10-05

申请号：US16411960

申请日：2019-05-14

Applicant: STMicroelectronics (Rousset) SAS ,  STMicroelectronics (Grenoble 2) SAS

Inventor： Denis Farison ,  Romain Coffy ,  Jean-Michel Riviere

IPC: H01L23/52 ,  H01L23/00 ,  H01L21/56 ,  H01L23/528 ,  H01L25/065 ,  H04L9/00

Abstract: A first integrated circuit chip is assembled to a second integrated circuit chip with a back-to-back surface relationship. The back surfaces of the integrated circuit chips are attached to each other using one or more of an adhesive, solder or molecular bonding. The back surface of at least one the integrated circuit chips is processed to include at least one of a trench, a cavity or a saw cut.

公开(公告)号：US10996412B2

公开(公告)日：2021-05-04

申请号：US16701355

申请日：2019-12-03

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Florian Perminjat ,  Romain Coffy ,  Jean-Michel Riviere

IPC: G02B6/43 ,  H05K1/02 ,  G02B6/12 ,  G02B6/42

Abstract: A carrier substrate includes a first network of electrical connections and recess. An electronic chip is mounted to the carrier substrate within the recess. The electronic chip includes an integrated guide of optical waves and a second network of electrical connections. A end section of an elongate optical cable is mounted on one side of the electronic chip with a longitudinal guide of optical waves optically coupled to the integrated guide of optical waves. Electrical connection elements are interposed between a face of the electronic chip and a bottom wall of the recess, such that first connect pads of the first electrical connection network are connected to second connect pads of the second electrical connection network through the electrical connection elements.

公开(公告)号：US10748883B2

公开(公告)日：2020-08-18

申请号：US16182315

申请日：2018-11-06

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Karine Saxod ,  Jean-Michel Riviere

IPC: H01L21/00 ,  H01L25/16 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/02 ,  H01L31/167 ,  H01L33/48 ,  H01L33/58 ,  H01L33/62 ,  H01L33/00 ,  B29C45/14 ,  B29C69/00 ,  H01L31/18 ,  G01S7/481 ,  B29L31/34 ,  G01S17/04

Abstract: An encapsulation cover for an electronic package includes a cover body having a frontal wall provided with at least one optical element allowing light to pass through. The optical element is inserted into the encapsulation cover by overmolding into a through-passage of the frontal wall. A front face of the optical element is set back with respect to a front face of the frontal wall. The process for fabricating the encapsulation cover includes forming a stack of a sacrificial spacer on top of an optical element, with the stack placed into a cavity of a mold.

公开(公告)号：US20170317059A1

公开(公告)日：2017-11-02

申请号：US15364452

申请日：2016-11-30

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Benoit Besancon ,  Norbert Chevrier ,  Jean-Michel Riviere

IPC: H01L25/065 ,  H01L23/367

CPC classification number: H01L25/0657 ,  H01L23/3128 ,  H01L23/367 ,  H01L23/4334 ,  H01L23/49833 ,  H01L2224/04105 ,  H01L2224/16227 ,  H01L2224/18 ,  H01L2224/73259 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06558 ,  H01L2225/06575 ,  H01L2225/06582 ,  H01L2225/06589

Abstract: An electronic device includes a first support platelet and a second support platelet that is disposed opposite and at a distance from the first support platelet. At least one first electronic chip is mounted on the first support platelet on a side facing the second support platelet. A second electronic chip is mounted on the second support platelet on a side facing the first support platelet. A heat sink that includes at least one interposition plate is interposed between the first and second electronic chips.

公开(公告)号：US20130155620A1

公开(公告)日：2013-06-20

申请号：US13722282

申请日：2012-12-20

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Jean-Michel Riviere ,  Karine Saxod

IPC: H05K7/20

CPC classification number: H05K7/20 ,  G01F1/20 ,  H01L23/34 ,  H01L23/4334 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/15311 ,  H05K1/0209 ,  H05K3/284 ,  H05K7/20436 ,  H05K2201/10378 ,  H05K2201/10734 ,  H05K2203/1316 ,  H01L2924/00

Abstract: An electronic component package includes a support and heat conductor. The heat conductor has a protuberance and the support has a socket arranged to be able to receive the protuberance so that the movement of heat conductor relative to the support during the assembly process is reduced.

Abstract translation: 电子部件封装包括支撑件和导热体。 热导体具有突起，并且支撑件具有布置成能够容纳突起的插座，使得在组装过程期间热导体相对于支撑件的移动减小。