Abstract:
Ink jet printhead comprising a driving and encoding circuit (20) having a grid-like structure, including a plurality of inputs (24), a plurality of selecting elements (12), a plurality of actuating elements (IC) and at least one identifying element (21) of said printhead. Each identifying element (21) is associated with a corresponding selecting element (12) and corresponds to nodes arranged along a row or column of said grid-like structure, and is scanned, together with said actuating elements (11), during a preliminary checking step.
Abstract:
In an ink jet printhead, the ink feeding duct (2), passing through the thickness of the silicon substrate, and in hydraulic communication with the ejection cells (8) through an outlet area (2a) on the front surface (5) of the substrate (3), is built in three successive stages of erosion of the substrate (3), the first of which is performed on the rear surface (6) of the substrate, to produce a first cavity (24) having a depth (P1), and a further cavity (26) communicating and having a depth (P2), extending in the direction of the front surface (5), and presenting a back wall (28) separated from the front surface (5) by a diaphragm (30); the second stage is performed on the opposite front surface (5) to cut a channel (40) in the direction of the diaphragm (30), of depth (P4) and defining the contour of the outlet area (2a) on the front surface (5), and the third stage is performed from said rear surface (6) as a continuation of the erosion performed in the first stage, to remove the diaphragm (30) and open the duct (2) between the rear (6) and front (5) surfaces.
Abstract:
Ink jet printhead comprising one or more ejection module, each with a silicon chip, a plurality of ejector nozzles arranged adjacent to a front of the module, ejection cells for the nozzles and delivery channels for the ink of the cells. The module or modules each include a distribution channel adjacent to the front and in fluid communication with the delivery channels and a nozzle layer integrated with the relative chip and in which the ejector nozzles parallel to the front are made. The head also comprises a support on which the module or modules are mounted and which defines a feeding duct for the ink in fluid communication with the delivery channels and sealing means between the module or modules and the support to guarantee fluid tightness between the feeding duct and the ejection cells.
Abstract:
A monolithic thermal ink jet printhead (40) comprising a groove (45), a plurality of chambers (74) and nozzles (56) is manufactured by means of steps of: (203, 205) partially etching the groove (45) by means of a “dry” process and a “wet” process; (210) depositing a plurality of sacrificial layers (54); (212) obtaining a plurality of casts (156); (216) completing the etching of the groove (45) by means of an electrochemical process; and (220) removing the casts (156) and the sacrificial layers (54) in such a way as to obtain a plurality of nozzles (56) and chambers (74).
Abstract:
A method for manufacturing an ejection head (10) or ejector suitable for ejecting in the form of droplets (16) a liquid (14) conveyed inside the ejection head (10), comprising a step of producing, from a silicon wafer, a nozzle plate (12) having at least one ejection nozzle (13); a step of producing, from another silicon wafer, a substrate (11) having at least one actuator (15) for activating the ejection of the droplets of liquid through the nozzle (13); and a step of joining the nozzle plate (12) and the substrate (11) together to form the ejection head, wherein this joining step comprises the production of a junction (25), made by means of the anodic bonding technology, between the substrate (11) and the nozzle plate (12), in such a way that, in the area of this junction (25), the ejection head (10) does not present structural discontinuities, and also possesses a resistance to chemical corrosion by the liquid (14) contained in the ejection head (10) at least equal to that of the silicon constituting both the substrate (11) and the nozzle plate (12). The method of the invention may be applied for manufacturing an ink jet printhead (110), having one or more nozzles (113a, 113b, etc.), which has the advantage, with respect to the known printheads, of also being suitable for working with special inks characterized by high level chemical aggressiveness. In general, the ejection head of the invention, thanks to its structure which is globally highly robust and also chemically inert in the area of the junction (25), can be used advantageously with various types of liquids, even with marked chemical aggressiveness, in different sectors of the art, for example for ejecting paints on various types of media, generally not paper, in the industrial marking sector; or for ejecting in a controlled way droplets of fuel, such as petrol, in an internal combustion engine.
Abstract:
On a die that has etchings on a surface, firstly a sheet of negative photoresist is laid down which, by means of an exposure and subsequent development, is left only above the etchings; then, upon the negative photoresist, a positive photoresist is applied, which is subjected to exposure and development to produce functional geometries deposited in thin film; subsequently the positive photoresist is removed in a “lift-off” operation, and the negative photoresist is taken off in a plasma operation, thus revealing the etchings.
Abstract:
A process for manufacturing a monolithic thermal ink jet printhead (40) comprising a plurality of chambers (74) and of nozzles (56), comprises steps of (206) depositing a plurality of sacrificial layers (31), of obtaining, by means of exposure and development operations, a plurality of casts (156), of (215) applying a structural layer (107), and subsequently steps of (225) removing the casts (156) and of (226) removing the sacrificial layers (31), in order to produce a plurality of chambers (74) and nozzles (56).
Abstract:
The single heads (40) mounted on a single print carriage of an ink jet printer comprise a column (50) of phototransistors (51-i), built directly into the chip of each head in the same process steps as used for the circuits for selecting and driving the actuating resistors; an illuminating device (43) on board the printer focuses a light spot (70) on the column (50) of phototransistors (51-i) which, scanned in sequence, provide the electronic controller of the printer a video output (57); from the output (57), processing and computing means produce a measurement of the vertical and horizontal misalignment of each head (40), a measurement used subsequently to automatically compensate this misalignment.
Abstract:
The individual monochromatic printheads mounted simultaneously on the scanning carriage of an ink jet printer are provided with an opto-electronic position detector of the four-quadrant type, which is integrated directly in the chip of each head by means of the same MOS technology used for the circuits for selection and driving of the emission resistors; an illumination device fixed onto the printer focuses a light spot on the position detector which thus provides the electronic control unit of the printer with a measurement of both the vertical and horizontal misalignment of each head, a measurement which is subsequently used in order to compensate automatically for the misalignment thereof.
Abstract:
An optical transducer for determining the angular position of a rotating member relative to a fixed structure, comprises a notched disc 13 rotatable inside a support housing 12, a light emitter 18 and a plurality of photovoltaic cells 19 for detecting the passage of light through the disc notches. The active and passive elements of an electronic circuit connected to the photovoltaic cells are carried by a single ceramic plate 21, which also acts as a support for the cells 19. The circuit comprises trimming resistors in the form of films deposited on the ceramic plate and connected to the amplifiers by the photovoltaic cells. In order for the signals generated by the amplifiers to have constant, predetermined peak values, the values of the resistors are trimmed during the production stage by means of a laser which selectively burns away parts thereof. The ceramic plate 21 is cemented on to the transducer housing 12, which is then positioned on the laser apparatus. The operations involved in presetting the resistors is carried out with the transducer in operation, and the laser need only be focused and pre-positioned once for the entire circuit.