公开(公告)号：US20230007785A1

公开(公告)日：2023-01-05

申请号：US17779890

申请日：2020-11-05

Applicant: NITTO DENKO CORPORATION

Inventor： Kenya TAKIMOTO ,  Naoki SHIBATA ,  Hayato TAKAKURA

IPC: H05K3/28

Abstract: A method for producing a wiring circuit board includes a first step, a second step, and a third step. In the first step, while a work film which is a long metal substrate having a first surface and a second surface opposite to the first surface is fed and wound by a roll-to-roll method, a composition containing a photosensitive resin is applied onto the first surface to form an insulating film, and a protective film is interposed between the second surface and the insulating film of the work film in being wound. In the second step, while the work film having undergone the first step is fed and wound by the roll-to-roll method, the protective film is peeled from the insulating film, and the insulating film is subjected to light exposure treatment to be formed with a latent image pattern. In a third step, the insulating film having undergone the second step is subjected to development treatment to be patterned.

公开(公告)号：US20230007783A1

公开(公告)日：2023-01-05

申请号：US17783206

申请日：2020-11-27

Applicant: NITTO DENKO CORPORATION

Inventor： Masaki ITO ,  Hayato TAKAKURA ,  Kenya TAKIMOTO

IPC: H05K3/06

Abstract: A method for producing a wiring circuit board includes first forming a base insulating layer, and second forming a first wiring and a second wiring having different thicknesses from each other in order. The second step includes, in order, forming a seed film, forming a first resist in a reversed pattern of the first wiring on one surface in a thickness direction of the seed film, forming the first wiring on one surface in the thickness direction of the seed film by plating, removing the first resist, of forming a second resist in a reversed pattern of the second wiring on one surface in the thickness direction of the seed film to cover the first wiring, forming the second wiring on one surface in the thickness direction of the seed film by plating, removing the second resist, and removing the seed film.

公开(公告)号：US20210243900A1

公开(公告)日：2021-08-05

申请号：US17237616

申请日：2021-04-22

Applicant: NITTO DENKO CORPORATION

Inventor： Shusaku SHIBATA ,  Takahiro TAKANO ,  Hayato TAKAKURA ,  Yoshihiro KAWAMURA ,  Shuichi WAKAKI

IPC: H05K3/10 ,  H05K1/02

Abstract: An elongated wired circuit board including a plurality of wires arranged in parallel, wherein the plurality of wires each includes a first linear portion extending in a first linear direction, a second linear portion extending in a second linear direction, and a connection portion, the connection portion includes a first side, a second side, a third side, and a fourth side, length y1 and length S satisfy 0

公开(公告)号：US20200288575A1

公开(公告)日：2020-09-10

申请号：US16649825

申请日：2018-09-06

Applicant: NITTO DENKO CORPORATION

Inventor： Shusaku SHIBATA ,  Hayato TAKAKURA ,  Masaki ITO ,  Yoshihiro KAWAMURA ,  Shuichi WAKAKI

IPC: H05K1/18 ,  H05K1/11 ,  H05K3/42 ,  H05K3/00 ,  H05K3/46

Abstract: A method for producing a wired circuit board, the method including the steps of: a first step of providing an insulating layer having an opening penetrating in the thickness direction at one side surface in the thickness direction of the metal plate, a second step of providing a first barrier layer at one side surface in the thickness direction of the metal plate exposed from the opening by plating, a third step of providing a second barrier layer continuously at one side in the thickness direction of the first barrier layer and an inner surface of the insulating layer facing the opening, a fourth step of providing a conductor layer so as to contact the second barrier layer, and a fifth step of removing the metal plate by etching.