公开(公告)号：US20210020370A1

公开(公告)日：2021-01-21

申请号：US16924411

申请日：2020-07-09

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kazuki YOSHINO ,  Makoto OGAWA ,  Yasuhiro NISHISAKA

IPC: H01G4/232 ,  H01G4/30 ,  H01G4/008

Abstract: An electronic component includes a body portion and an external electrode. The external electrode is provided on a surface of the body portion. The external electrode includes a base electrode layer, a first Ni plated layer, and an upper plated layer. The first Ni plated layer is provided on the base electrode layer. The upper plated layer is provided above the first Ni plated layer. The first Ni plated layer includes Ni particles having an average particle size of not more than about 52 nm.

公开(公告)号：US20190051467A1

公开(公告)日：2019-02-14

申请号：US16158331

申请日：2018-10-12

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Masato KIMURA ,  Yasuhiro NISHISAKA

IPC: H01G13/00 ,  H01G4/30 ,  H01G4/008 ,  H01G4/232 ,  H01G4/12

Abstract: A multilayer ceramic capacitor includes a multilayer body that includes ceramic layers and inner conductor layers arranged in a stacking direction and that includes a first surface in which the inner conductor layers are exposed, and an outer electrode on the first surface of the multilayer body. The inner conductor layers contain Ni. The outer electrode includes a base layer that directly covers at least a portion of the first surface and is connected to the inner conductor layers. The base layer contains a metal and glass and includes a Ni diffusion portion connected to the inner conductor layers, the Ni diffusion portion containing Ni. A ratio of a diffusion depth of the Ni diffusion portion to a thickness of the base layer is smaller on two of the inner conductor layers that are located outermost than on other inner conductor layers.

公开(公告)号：US20170178809A1

公开(公告)日：2017-06-22

申请号：US15447284

申请日：2017-03-02

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yasuhiro NISHISAKA ,  Takehisa SASABAYASHI ,  Satoshi MURAMATSU

IPC: H01G4/248 ,  H01G4/12 ,  H01G4/30

CPC classification number: H01G4/248 ,  H01G4/12 ,  H01G4/2325 ,  H01G4/30

Abstract: A multilayer ceramic capacitor includes an external electrode that is unlikely to be peeled. First and second external electrodes each include base layers provided over a ceramic body and including a metal and glass, and Cu plated layers provided over the base layers. The multilayer ceramic capacitor includes a reactive layer. The reactive layer contains about 5 atomic % to about 15 atomic % of Ti, about 5 atomic % to about 15 atomic % of Si, and about 2 atomic % to about 10 atomic % of V.

公开(公告)号：US20170018359A1

公开(公告)日：2017-01-19

申请号：US15209919

申请日：2016-07-14

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Masato KIMURA ,  Yasuhiro NISHISAKA

IPC: H01G4/248 ,  H01G4/008 ,  H01G13/00 ,  H01G4/30

CPC classification number: H01G13/006 ,  H01G4/0085 ,  H01G4/12 ,  H01G4/2325 ,  H01G4/30

Abstract: A multilayer ceramic capacitor includes a multilayer body that includes ceramic layers and inner conductor layers arranged in a stacking direction and that includes a first surface in which the inner conductor layers are exposed, and an outer electrode on the first surface of the multilayer body. The inner conductor layers contain Ni. The outer electrode includes a base layer that directly covers at least a portion of the first surface and is connected to the inner conductor layers. The base layer contains a metal and glass and includes a Ni diffusion portion connected to the inner conductor layers, the Ni diffusion portion containing Ni. A ratio of a diffusion depth of the Ni diffusion portion to a thickness of the base layer is smaller on two of the inner conductor layers that are located outermost than on other inner conductor layers.

Abstract translation: 多层陶瓷电容器包括：层叠体，其包括层叠方向配置的陶瓷层和内部导体层，其包括内部导体层露出的第一表面和多层体的第一表面上的外部电极。 内导体层含有Ni。 外电极包括直接覆盖第一表面的至少一部分并连接到内导体层的基层。 基层包含金属和玻璃，并且包括连接到内导体层的Ni扩散部分，Ni扩散部分含有Ni。 两个位于最外层的内部导电体层之间，与其他内部导体层相比，Ni扩散部分的扩散深度与基底层的厚度的比值较小。

公开(公告)号：US20160268046A1

公开(公告)日：2016-09-15

申请号：US15067459

申请日：2016-03-11

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yasuhiro NISHISAKA ,  Yoshito SAITO

IPC: H01G4/232 ,  H01G4/008 ,  H01G4/248 ,  H01G4/30

CPC classification number: H01G4/2325 ,  H01G4/0085 ,  H01G4/12 ,  H01G4/232 ,  H01G4/30

Abstract: A multilayer ceramic capacitor contains Ni in internal electrodes, and includes a sintered metal layer containing Cu in external electrodes. At a joined portion between each internal electrode and each external electrode, mutual diffusion layers of Cu and Ni extend across the internal and external electrodes. On each internal electrode, a mutual diffusion layer is present with a thickness t1, which is defined by a dimension from a first end surface or a second end surface to an interior end in a longitudinal direction, not smaller than about 0.5 μm and not greater than about 5 μm. On each external electrode, a mutual diffusion layer is present with a thickness t2, which is defined by a dimension from the first end surface or the second end surface to an exterior end in the longitudinal direction, not smaller than about 2.5% and not greater than about 33.3% of a thickness t0 of a sintered metal layer.

Abstract translation: 多层陶瓷电容器在内部电极中含有Ni，并且包括在外部电极中含有Cu的烧结金属层。 在每个内部电极和每个外部电极之间的接合部分，Cu和Ni的相互扩散层延伸穿过内部和外部电极。 在每个内部电极上，存在相互扩散层，其厚度t1由从第一端面或第二端面到纵向方向内端的尺寸限定，不小于约0.5μm且不大于 比约5μm。 在每个外部电极上，存在相互扩散层，其厚度t2由从第一端面或第二端面到纵向方向的外端的尺寸限定，不小于约2.5％且不大于 比烧结金属层的厚度t0的约33.3％。

公开(公告)号：US20150016018A1

公开(公告)日：2015-01-15

申请号：US14324397

申请日：2014-07-07

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kosuke ONISHI ,  Tomohiro SASAKI ,  Yasuhiro NISHISAKA ,  Akira ISHIZUKA ,  Akihiro YOSHIDA

IPC: H01G4/005 ,  H01L41/047 ,  H01C7/00 ,  H01G4/30 ,  H01F27/29

CPC classification number: H01G4/30 ,  H01C7/008 ,  H01F27/2804 ,  H01F27/29 ,  H01F2027/2809 ,  H01G4/005 ,  H01G4/008 ,  H01G4/12 ,  H01G4/248 ,  H01L41/0472 ,  H01L41/293

Abstract: External electrodes, electrically connected to exposed portions of internal electrodes, are arranged on end surfaces of a ceramic main body of a laminated ceramic capacitor. Alloy layers of a metal contained in internal electrodes, and a metal contained in external electrodes, are arranged at the boundaries between external electrodes, and the ceramic main body and internal electrodes. Plating layers are provided on surfaces of external electrodes. A ceramic electronic component having a reduced ESR is thus provided.

Abstract translation: 电连接到内部电极的露出部分的外部电极设置在层叠陶瓷电容器的陶瓷主体的端面上。 包含在内部电极中的金属和外部电极中包含的金属的合金层被布置在外部电极和陶瓷主体和内部电极之间的边界处。 电镀层设置在外部电极的表面上。 因此提供了具有减小的ESR的陶瓷电子部件。

公开(公告)号：US20140312743A1

公开(公告)日：2014-10-23

申请号：US14320770

申请日：2014-07-01

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Koji SATO ,  Yukio SANADA ,  Yasuhiro NISHISAKA ,  Masaki HIROTA

IPC: H01C7/00 ,  H01G4/12 ,  H01G4/012 ,  H01C7/13 ,  H01L41/083 ,  H01F17/00

CPC classification number: H01C7/008 ,  H01C7/13 ,  H01F17/0013 ,  H01G4/012 ,  H01G4/12 ,  H01G4/232 ,  H01G4/30 ,  H01L41/083

Abstract: A ceramic electronic component includes a ceramic base, first and second internal electrodes, and first and second external electrodes. The first external electrode is disposed at a first end portion of a first major surface in the longitudinal direction. The second external electrode is disposed at a second end portion of the first major surface in the longitudinal direction. A portion of each of the first and second external electrodes is opposed in the thickness direction to a region where the first and second internal electrodes are opposed to each other in the thickness direction. A condition ( 1/10)t0≦t1 ≦(⅖)t0 is satisfied, where to is the thickness of each of the first and second external electrodes and t1 is the thickness of a portion in which each of the first and second external electrodes is embedded in the first major surface.

Abstract translation: 陶瓷电子部件包括陶瓷基体，第一和第二内部电极以及第一和第二外部电极。 第一外部电极设置在纵向方向上的第一主表面的第一端部处。 第二外部电极设置在第一主表面的纵向方向的第二端部处。 第一外部电极和第二外部电极的一部分在厚度方向上与第一和第二内部电极在厚度方向上彼此相对的区域相对。 满足条件（1/10）t0＆nlE; t1＆nlE;（⅖）t0，其中，第一外部电极和第二外部电极中的每一个的厚度为哪里，并且t1是其中第一和第二外部电极 电极嵌入第一主表面。

公开(公告)号：US20140292142A1

公开(公告)日：2014-10-02

申请号：US14191481

申请日：2014-02-27

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yasuhiro NISHISAKA ,  Satoshi MATSUNO ,  Tetsuya KISUMI ,  Yoko OKABE

IPC: C03C8/18 ,  H01L41/083 ,  H01C7/00 ,  H01G4/30 ,  H01F27/28

CPC classification number: C03C8/18 ,  H01C7/008 ,  H01G4/228 ,  H01G4/232 ,  H01G4/30 ,  H01L41/0471 ,  H01L41/0533

Abstract: A ceramic electronic component includes a ceramic body, a glass coating layer, and terminal electrodes. End portions of inner electrodes are exposed at a surface of the ceramic body. The glass coating layer covers portions of the ceramic body in which the inner electrodes are exposed. The terminal electrodes are disposed directly above the glass coating layer and are each constituted by a plating film. The glass coating layer includes a glass medium and metal powder particles that are dispersed in the glass medium and define conductive paths which electrically connect the inner electrodes and the terminal electrodes. The metal powder particles include first metal powder particles and second metal powder particles. The first metal powder particles are flat or substantially flat powder particles. The second metal powder particles are spherical or substantially spherical powder particles.

Abstract translation: 陶瓷电子部件包括陶瓷体，玻璃涂层和端子电极。 内部电极的端部在陶瓷体的表面露出。 玻璃涂层覆盖内部电极露出的陶瓷体的部分。 端子电极直接设置在玻璃涂层的上方，并且各自由镀膜构成。 玻璃涂层包括玻璃介质和分散在玻璃介质中的金属粉末颗粒，并且限定电连接内部电极和端子电极的导电路径。 金属粉末颗粒包括第一金属粉末颗粒和第二金属粉末颗粒。 第一金属粉末颗粒是平坦或基本平坦的粉末颗粒。 第二金属粉末颗粒是球形或基本上球形的粉末颗粒。

公开(公告)号：US20140291000A1

公开(公告)日：2014-10-02

申请号：US14223258

申请日：2014-03-24

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yasuhiro NISHISAKA ,  Satoshi MATSUNO ,  Akihiro YOSHIDA ,  Yasunori TASEDA

IPC: H01G4/01 ,  H05K1/18 ,  H01G4/008

CPC classification number: H05K1/0306 ,  H01G4/2325 ,  H05K1/185 ,  H05K2201/10636 ,  H05K2203/107 ,  H05K2203/1469 ,  Y02P70/611

Abstract: A ceramic electronic component includes a ceramic body and an outer electrode. The ceramic body includes first and second principal surfaces, first and second lateral surfaces, and first and second end surfaces. The outer electrode is provided on the first principal surface. The outer electrode includes an underlying electrode layer containing Cu and glass, and a Cu plating layer. The underlying electrode layer is disposed on the first principal surface. The Cu plating layer is disposed on the underlying electrode layer. The Cu plating layer is thicker than the underlying electrode layer.

Abstract translation: 陶瓷电子部件包括陶瓷体和外部电极。 陶瓷体包括第一和第二主表面，第一和第二侧表面以及第一和第二端面。 外电极设置在第一主表面上。 外电极包括含有Cu和玻璃的底层电极层和Cu镀层。 底层电极层设置在第一主表面上。 Cu镀层设置在下面的电极层上。 Cu镀层比下面的电极层厚。

公开(公告)号：US20130201600A1

公开(公告)日：2013-08-08

申请号：US13755224

申请日：2013-01-31

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yasuhiro NISHISAKA ,  Yukio SANADA ,  Tetsuya KISUMI ,  Akira ISHIZUKA

IPC: H01G13/00 ,  H01G4/005

CPC classification number: H01G13/006 ,  H01G4/005 ,  H01G4/2325 ,  H01G4/30

Abstract: A ceramic electronic component includes a ceramic body, a plurality of internal electrodes provided in the ceramic body and including ends exposed on a surface of the ceramic body; a glass coating layer covering a portion of the surface of the ceramic body on which the internal electrodes are exposed; and an electrode terminal provided directly on the glass coating layer and including a plating film. The glass coating layer is made of a glass medium in which metal powder particles are dispersed. The internal electrodes project from the surface of the ceramic body into the glass coating layer without passing through the glass coating layer. The metal powder particles define conduction paths electrically connecting the internal electrodes with the electrode terminal.

Abstract translation: 陶瓷电子部件包括陶瓷体，设置在陶瓷体中的多个内部电极，其包括暴露在陶瓷体的表面上的端部; 覆盖所述内部电极露出的所述陶瓷体的表面的一部分的玻璃涂层; 以及直接设置在玻璃涂层上并包括镀膜的电极端子。 玻璃涂层由金属粉末颗粒分散的玻璃介质制成。 内部电极从陶瓷体的表面突出到不经过玻璃涂层的玻璃涂层中。 金属粉末颗粒限定将内部电极与电极端子电连接的传导路径。