公开(公告)号：US20130112853A1

公开(公告)日：2013-05-09

申请号：US13666098

申请日：2012-11-01

Applicant: Hamamatsu Photonics K.K.

Inventor： Motohiro SUYAMA ,  Akiomi UJIMA ,  Kentaro MAETA ,  Hisanori SUZUKI ,  Masaharu MURAMATSU ,  Fumio IWASE

IPC: H01L27/148

CPC classification number: H01L27/14843 ,  H04N3/1525 ,  H04N3/1537 ,  H04N5/3722

Abstract: A solid-state imaging device 1A includes a CCD-type solid-state imaging element 10 having an imaging plane 12 formed of M×N pixels that are two-dimensionally arrayed in M rows and N columns, N signal readout circuits 20 arranged on one end side in the column direction for each of the columns with respect to the imaging plane 12, and N signal readout circuits 30 arranged on the other end side in the column direction for each of the columns with respect to the imaging plane 12, a semiconductor element 50 for digital-converting and then sequentially outputting as serial signals electrical signals output from the signal readout circuits 20 for each of the columns, and a semiconductor element 60 for digital-converting and then sequentially outputting as serial signals electrical signals output from the signal readout circuits 30 for each of the columns.

Abstract translation: 固态成像装置1A包括CCD型固体摄像元件10，其具有由M×N个像素形成的成像面12，二维排列成M行N列，N个信号读出电路20配置在一个 相对于成像面12的各列的列方向的端侧，以及相对于摄像面12对于列的列方向配置在另一端侧的N个信号读出电路30，半导体 元件50，用于数字转换，然后顺序地输出作为串行信号从每个列的信号读出电路20输出的电信号;以及半导体元件60，用于数字转换，然后顺序地输出作为串行信号从信号输出的电信号 每列的读出电路30。