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公开(公告)号：US20250006615A1
公开(公告)日：2025-01-02
申请号：US18276476
申请日：2022-07-14
Inventor： Yifan WU , Yue LI , Yuelei XIAO , Xiaodong LI , Jingshu ZHANG , Kidong HAN , Yulin FENG , Qichang AN , Yingwei LIU , Zijian WANG , Rui MA , Quanyue LI , Song CHEN , Qianyu GUO , Biqi LI
IPC: H01L23/498 , H01L21/48 , H01L23/00 , H01L23/15 , H05K1/18
Abstract: A composite substrate, a method for manufacturing a composite substrate, and an electronic device are provided. The composite substrate includes a package substrate and an interposer which are stacked; the interposer includes: a first dielectric substrate including a first connection via penetrating therethrough, and a first surface and a second surface opposite to each other; a first connection electrode in the first connection via; and a first connection structure and a second connection structure respectively on the first surface and the second surface and both connected to the first connection electrode; the package substrate includes: a second dielectric substrate on a side of the second connection structure away from the first dielectric substrate; a third connection structure and a fourth connection structure which are on the second dielectric substrate and electrically connected; the third connection structure being electrically connected to the first connection electrode through the second connection structure.
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32.发明公开公开(公告)号：US20240347541A1
公开(公告)日：2024-10-17
申请号：US18749666
申请日：2024-06-21
Applicant: BOE Technology Group Co., Ltd.
Inventor： Jianhua DU , Jinxiang XUE , Xinhong LU , Yingwei LIU , Meng ZHAO , Hao WU , Feng GUAN , Yang LV , Chaolu WANG
IPC: H01L27/12 , H01L25/075 , H01L25/16 , H01L33/62
CPC classification number: H01L27/1218 , H01L25/0753 , H01L25/167 , H01L27/1244 , H01L27/1262 , H01L33/62
Abstract: A driving backplane, a display device and preparation methods therefor are provided. The method includes: providing a base substrate with first, second surfaces and a side surface connected therebetween; forming a flexible film layer on the first surface, and patterning the flexible film layer to form a first opening portion including first, second and third parts sequentially connected; bending partial flexible film layer to the second surface, such that first, second and third parts are opposite to the first, side and second surfaces; forming a conductive layer on a side of the flexible film layer away from the base substrate by using the flexible film layer as a mask, the conductive layer being formed in at least a part of the first opening portion to form a conductive strip; and at least removing the flexible film layer and the conductive layer around the conductive strip.
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公开(公告)号：US20230060979A1
公开(公告)日：2023-03-02
申请号：US17800236
申请日：2021-05-14
Applicant: BOE Technology Group Co., Ltd.
Inventor： Zhiwei LIANG , Zhanfeng CAO , Ke WANG , Yingwei LIU , Shunyu YAO , Shuang LIANG , Muxin DI
Abstract: A method for manufacturing an array substrate and an array substrate are provided. The method includes: providing a base substrate; forming a driving circuit layer at a side of the base substrate; and forming a functional device layer at a side of the driving circuit layer. Forming the driving circuit layer includes forming at least one first lead layer. Forming the first lead layer includes: forming a conductive seed layer at the side of the base substrate; forming a removable pattern-defining layer on a surface of the conductive seed layer, the removable pattern-defining layer being provided with a lead opening exposing a part of the conductive seed layer; forming, in the lead opening, a metal plating layer on the surface of the conductive seed layer; removing the removable pattern-defining layer; and removing a part of the conductive seed layer not covered by the metal plating layer.
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公开(公告)号：US20220302177A1
公开(公告)日：2022-09-22
申请号：US17550244
申请日：2021-12-14
Applicant: BOE Technology Group Co., Ltd.
Inventor： Yingwei LIU , Zhanfeng CAO , Ke WANG , Guocai ZHANG , Junwei YAN
IPC: H01L27/12 , H01L25/075 , H01L33/62
Abstract: A substrate includes: a base substrate; an organic layer on the base substrate with openings defined through the organic layer; a first metal layer including first metal patterns, where the first metal pattern is in the opening, and includes a first portion parallel to a bottom of the opening and a second portion parallel to a lateral wall of the opening; a second metal layer having a thickness greater than a thickness of the first metal layer; where the second metal layer includes second metal patterns, the second metal pattern is located in the opening and is in contact with the first metal layer; and, a distance from a surface of the first metal layer away from the base substrate to a plane where the base substrate is located is smaller than a distance from a surface of the organic layer away from the base substrate to the plane.
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公开(公告)号：US20220123024A1
公开(公告)日：2022-04-21
申请号：US17281015
申请日：2020-01-03
Applicant: BOE Technology Group Co., Ltd.
Inventor： Zhanfeng CAO , Yingwei LIU , Ke WANG , Guocai ZHANG , Jianguo WANG , Zhiwei LIANG , Haixu LI , Muxin DI
Abstract: An array substrate, a method for preparing the array substrate, and a backlight module are disclosed. Before electroplating a first metal layer on a pattern of a seed layer, the method further includes: forming a pattern of a compensation electrode wire electrically connected with a lead electrode on a side, where the lead electrode is formed, of a base substrate. The compensation electrode wire is at least on a second side of a wiring region, the pattern of the lead electrode is formed at a first side of the wiring region, and the first side and the second side are different sides. In the electroplating process, the lead electrode is connected with a negative pole of a power supply, the compensation electrode wire is electrically connected with the lead electrode, thus an area of an electroplating negative pole generating electric field lines is increased by utilizing the compensation electrode wire.
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Patent Agency Ranking
公开(公告)号：US20210264852A1
公开(公告)日：2021-08-26
申请号：US17254088
申请日：2020-03-20
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Renquan GU , Qi YAO , Jaiil RYU , Yingwei LIU , Zhiwei LIANG , Muxin DI , Wusheng LI
IPC: G09G3/3225 , H01L51/56 , H01L27/32
Abstract: A display substrate, a manufacturing method thereof and a display apparatus are provided. The display substrate includes a base substrate structure and a display structure on the base substrate structure, the display structure includes a plurality of light emitting units and is divided into multiple light-transmissive regions and multiple opaque regions; and a driving circuit for driving the display structure to display and comprising a pixel driving circuit between the base substrate structure and the display structure, and a peripheral circuit driving the pixel driving circuit and arranged on a side of the base substrate structure distal to the display structure and in the opaque regions, and the peripheral circuit is coupled to the pixel driving circuit through at least one through hole formed in the base substrate structure. The display substrate can realize frameless display, which is beneficial to realize seamless splicing display of a plurality of display substrates.
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37.发明申请公开(公告)号：US20210223035A1
公开(公告)日：2021-07-22
申请号：US16304435
申请日：2018-05-17
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Zhiwei LIANG , Yingwei LIU
Abstract: The present disclosure discloses a flexible substrate and a fabrication method thereof, a method for detecting a bend, and a flexible display device. A flexible substrate includes a flexible base, and a surface acoustic wave generating element and a surface acoustic wave detecting element positioned on the flexible base. The surface acoustic wave generating element and the surface acoustic wave detecting element are configured to detect a bend of the flexible substrate.
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公开(公告)号：US20210210522A1
公开(公告)日：2021-07-08
申请号：US16650690
申请日：2019-10-08
Applicant: BOE Technology Group Co., Ltd.
Inventor： Yingwei LIU , Shuang LIANG , Zhiwei LIANG , Muxin DI , Ke WANG , Zhanfeng CAO
IPC: H01L27/12 , H01L25/16 , H01L25/065
Abstract: The disclosure relates to the technical field of display devices and discloses a display substrate, a splicing screen and a manufacturing method thereof. The display substrate includes a flexible substrate; a plurality of signal lines located at one side of the flexible substrate; a plurality of plating electrodes located at one side of the signal lines toward the flexible substrate and electrically connected to the signal lines in one-to-one correspondence; a plurality of first through holes in one-to-one correspondence to the plating electrodes and penetrating the flexible substrate and exposing the plating electrodes, the first through roles being filled with a conductive material inside; and a plurality of binding electrodes located at one side of the flexible substrate away from the signal lines and in one-to-one correspondence to the first through holes, the binding electrodes being electrically connected to corresponding plating electrode through conductive material in corresponding first through hole.
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公开(公告)号：US20210091057A1
公开(公告)日：2021-03-25
申请号：US17010575
申请日：2020-09-02
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Zhiwei LIANG , Wenqian LUO , Guoqiang WANG , Yingwei LIU
Abstract: The present disclosure provides a driving substrate and a manufacturing method thereof, and a micro LED bonding method. The driving substrate includes: a base substrate; a driving function layer provided on the base substrate, and including a plurality of driving thin film transistors and a plurality of common electrode lines; a pad layer including a plurality of pads provided on a side of the driving function layer away from the base substrate, each pad including a pad body and a microstructure of hard conductive material provided on a side of the pad body away from the base substrate; and a plurality of buffer structures provided on the side of the driving function layer away from the base substrate, each buffer structure surrounding a portion of a corresponding microstructure close to the base substrate, and a height of the buffer structure being lower than a height of the microstructure.
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公开(公告)号：US20210066425A1
公开(公告)日：2021-03-04
申请号：US16641560
申请日：2019-08-26
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Muxin DI , Yingwei LIU , Zhiwei LIANG , Haixu LI , Zhanfeng CAO
IPC: H01L27/32 , H01L51/56 , G09G3/3225
Abstract: An Organic Light-emitting Diode (OLED) display substrate, a method of forming the same and a display device are provided. The OLED display substrate includes: a driving thin film transistor located on a base substrate and configured to drive an OLED light-emitting unit to emit light; and a photosensitive thin film transistor located on the base substrate and configured to be capable of detecting light emitted by the OLED light-emitting unit and generating an electrical signal, at least a part of film layers of the photosensitive thin film transistor and at least a part of film layers of the driving thin film transistor are disposed at a same layer and made of a same material.
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