公开(公告)号：US20210225956A1

公开(公告)日：2021-07-22

申请号：US16755777

申请日：2019-10-18

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Yong Yu ,  Yang Yue ,  Jiangnan Lu ,  Shi Shu ,  Chuanxiang Xu ,  Haitao Huang ,  Xiang Li ,  Min Huang

IPC: H01L27/32 ,  H01L51/56 ,  H01L51/52 ,  H01L51/50 ,  C09K11/06

Abstract: The present disclosure is related to an array substrate. The array substrate may include a substrate; and a plurality of sub-pixels emitting different colors of light on the substrate. Each of the plurality of sub-pixels may include a green electroluminescence component, and each of the plurality of the sub-pixels other than green sub-pixels further may include a color conversion layer on a light-exiting side of the green electroluminescence component.

公开(公告)号：US10923508B2

公开(公告)日：2021-02-16

申请号：US16398488

申请日：2019-04-30

Applicant: BOE Technology Group Co., Ltd.

Inventor： Renquan Gu ,  Qi Yao ,  Wusheng Li ,  Dongsheng Li ,  Huili Wu ,  Shipei Li ,  Dongsheng Yin ,  Fang He ,  Yang Yue

IPC: H01L27/12 ,  H01L23/48 ,  H01L23/522 ,  H01L33/38 ,  H01L23/482 ,  H01L23/532

Abstract: The disclosure relates to an array substrate and a manufacturing method therefor, a display panel, and a display device. The array substrate comprises a base substrate, and a lead-out line and an inorganic insulating layer which are located on one side of the base substrate; the base substrate is provided with a plurality of connection vias penetrating the base substrate and filled with a first conductive material; the inorganic insulating layer is provided with a first via and a second via, the first via penetrating to the first conductive material, and the second via penetrating to the lead-out line; a second conductive layer is disposed on the side, away from the base substrate, of the first via, the second via and the inorganic insulating layer, such that the first conductive material and the lead-out line are electrically connected through the second conductive layer.