-
公开(公告)号:US20230144770A1
公开(公告)日:2023-05-11
申请号:US17521578
申请日:2021-11-08
Applicant: Advanced Micro Devices, Inc.
Inventor: Eric J. Chapman , Stephen Victor Kosonocky , Kaushik Mazumdar , Vydhyanathan Kalyanasundharam , Samuel Naffziger , Eric M. Scott
IPC: G06F1/30
CPC classification number: G06F1/30
Abstract: A method for controlling a data processing system includes detecting a droop in a power supply voltage of a functional circuit of the data processing system greater than a programmable droop threshold. An operation of the data processing system is throttled according to a programmable step size, a programmable assertion time, and a programmable de-assertion time in response to detecting the droop.
-
公开(公告)号:US20220189576A1
公开(公告)日:2022-06-16
申请号:US17121110
申请日:2020-12-14
Applicant: Advanced Micro Devices, Inc.
Inventor: Ashish Jain , Sriram Sundaram , Samuel Naffziger
Abstract: The low end operating voltage of an integrated circuit is adjusted. Oscillations are counted at a ring oscillator on the integrated circuit over a designated period of clock cycles. Based on the number of oscillations, a prediction model associated with a first set of device degradation data and a second set of static random-access memory (SRAM) low end operating voltage data is used to select a low end operating voltage limit for a processor on the integrated circuit. The low end operating voltage of the processor is set based on the selected low end operating voltage limit. These steps are repeated multiple times during operation of the processor. A method of testing integrated circuits to provide the data employed to produce the prediction model is also provided.
-
公开(公告)号:US11189540B2
公开(公告)日:2021-11-30
申请号:US16563138
申请日:2019-09-06
Applicant: Advanced Micro Devices, Inc.
Inventor: John Wuu , Samuel Naffziger , Patrick J. Shyvers , Milind S. Bhagavat , Kaushik Mysore , Brett P. Wilkerson
IPC: H01L23/367 , H01L25/00 , H01L25/065 , H01L23/36 , H01L23/373
Abstract: Various semiconductor chip devices with stacked chips are disclosed. In one aspect, a semiconductor chip device is provided. The semiconductor chip device includes a first semiconductor chip that has a floor plan with a high heat producing area and a low heat producing area. At least one second semiconductor chip is stacked on the low heat producing area. The semiconductor chip device also includes means for transferring heat from the high heat producing area.
-
公开(公告)号:US11054883B2
公开(公告)日:2021-07-06
申请号:US16011476
申请日:2018-06-18
Applicant: Advanced Micro Devices, Inc. , ATI Technologies ULC
Inventor: Leonardo De Paula Rosa Piga , Samuel Naffziger , Ivan Matosevic , Indrani Paul
IPC: G06F1/324
Abstract: A power management algorithm framework proposes: 1) a Quality-of-Service (QoS) metric for throughput-based workloads; 2) heuristics to differentiate between throughput and latency sensitive workloads; and 3) an algorithm that combines the heuristic and QoS metric to determine target frequency for minimizing idle time and improving power efficiency without any performance degradation. A management algorithm framework enables optimizing power efficiency in server-class throughput-based workloads while still providing desired performance for latency sensitive workloads. The power savings are achieved by identifying workloads in which one or more cores can be run at a lower frequency (and consequently lower power) without a significant negative performance impact.
-
-
-