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公开(公告)号：US11700035B2
公开(公告)日：2023-07-11
申请号：US16920297
申请日：2020-07-02
Applicant: Apple Inc.
Inventor： Harish Rajagopalan , Bilgehan Avser , David Garrido Lopez , Forhad Hasnat , Mattia Pascolini , Mikal Askarian Amiri , Rodney A. Gomez Angulo , Thomas W. Yang , Jiechen Wu , Eric N. Nyland , Simone Paulotto , Jennifer M. Edwards , Matthew D. Hill , Ihtesham H. Chowdhury , David A. Hurrell , Siwen Yong , Jiangfeng Wu , Daniel C. Wagman , Soroush Akbarzadeh , Robert Scritzky , Subramanian Ramalingam
CPC classification number: H04B3/52 , G01R31/2822 , H01Q1/2283 , H01Q13/24 , H04B3/54
Abstract: An electronic device may be provided with an antenna module having a substrate. A phased antenna array of dielectric resonator antennas and a radio-frequency integrated circuit for the array may be mounted to one or more surfaces of the substrate. The dielectric resonator antennas may include dielectric columns excited by feed probes. The feed probes may be printed onto sidewalls of the dielectric columns or may be pressed against the sidewalls by biasing structures. A plastic substrate may be molded over each dielectric column and each of the feed probes in the array. The feed probes may cover multiple polarizations. The array may include elements for covering multiple frequency bands. The dielectric columns may be aligned a longitudinal axis and may be rotated at a non-zero and non-perpendicular angle with respect to the longitudinal axis.
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公开(公告)号：US20230198129A1
公开(公告)日：2023-06-22
申请号：US18109168
申请日：2023-02-13
Applicant: Apple Inc.
Inventor： Matthew D. Hill , Michael B. Wittenberg , Shane Bustle , Duy P. Le
CPC classification number: H01Q1/243 , H04M1/0283 , H04M1/0249 , G06F1/1656 , B29C45/14311 , B29C45/14467 , G06F1/1626 , G06F1/1633 , B29L2031/34
Abstract: A housing for an electronic device is disclosed. The housing comprises a first component and a second component separated from the first component by a gap. The housing also includes a first molded element disposed at least partially within the gap and defining at least a portion of an interlock feature, and a second molded element disposed at least partially within the gap and mechanically engaging the interlock feature. The first component, the second component, and the second molded element form a portion of an exterior surface of the housing. A method of forming the housing is also disclosed.
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公开(公告)号：US11581629B2
公开(公告)日：2023-02-14
申请号：US17555920
申请日：2021-12-20
Applicant: Apple Inc.
Inventor： Matthew D. Hill , Michael B. Wittenberg , Shane Bustle , Duy P. Le
Abstract: A housing for an electronic device is disclosed. The housing comprises a first component and a second component separated from the first component by a gap. The housing also includes a first molded element disposed at least partially within the gap and defining at least a portion of an interlock feature, and a second molded element disposed at least partially within the gap and mechanically engaging the interlock feature. The first component, the second component, and the second molded element form a portion of an exterior surface of the housing. A method of forming the housing is also disclosed.
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公开(公告)号：US20220191356A1
公开(公告)日：2022-06-16
申请号：US17687497
申请日：2022-03-04
Applicant: Apple Inc.
Inventor： Scott W. Miller , Brian A. Argyres , Lindsay M. Alanen , Matthew D. Hill , Nicholas D. Smyth , Shujun Tang
Abstract: Various embodiments include a chassis for a multi-camera system and techniques for forming such a chassis. The chassis may comprise multiple chassis portions that define cavities for mounting cameras. Some embodiments include a chassis portion comprising an integrated shield can-chassis that may be formed as a single component. According to some embodiments, subtractive manufacturing may be used to form one or more features of the chassis.
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公开(公告)号：US11070655B2
公开(公告)日：2021-07-20
申请号：US16740668
申请日：2020-01-13
Applicant: Apple Inc.
Inventor： Matthew D. Hill , Derek C. Krass , Benjamin Shane Bustle , Lucy Elizabeth Browning , Michael Benjamin Wittenberg , James B. Smith , Ashutosh Y. Shukla , Scott A. Myers
Abstract: An enclosure and a method for forming an enclosure are disclosed. The enclosure may be formed from metal, such as aluminum, and further include a non-metal portion allowing for transmission and receipt of electromagnetic waves. The non-metal portion may be interlocked to the enclosure and in particular, to a region within the enclosure including a first material having a relatively high strength and stiffness compared to the non-metal portion. Interlocking means may include forming dovetail cuts into the enclosure to receive the non-metal portion, a hole or cavity drilled into the enclosure which includes internal threads, and a rod inserted into the first material to provide a tension to the non-metal portion. Methods of assembling internal components using anodization are also disclosed.
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Patent Agency Ranking
公开(公告)号：US20200153950A1
公开(公告)日：2020-05-14
申请号：US16740668
申请日：2020-01-13
Applicant: Apple Inc.
Inventor： Matthew D. Hill , Derek C. Krass , Benjamin Shane Bustle , Lucy Elizabeth Browning , Michael Benjamin Wittenberg , James B. Smith , Ashutosh Y. Shukla , Scott A. Myers
IPC: H04M1/02
Abstract: An enclosure and a method for forming an enclosure are disclosed. The enclosure may be formed from metal, such as aluminum, and further include a non-metal portion allowing for transmission and receipt of electromagnetic waves. The non-metal portion may be interlocked to the enclosure and in particular, to a region within the enclosure including a first material having a relatively high strength and stiffness compared to the non-metal portion. Interlocking means may include forming dovetail cuts into the enclosure to receive the non-metal portion, a hole or cavity drilled into the enclosure which includes internal threads, and a rod inserted into the first material to provide a tension to the non-metal portion. Methods of assembling internal components using anodization are also disclosed.
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公开(公告)号：US10524372B2
公开(公告)日：2019-12-31
申请号：US16360939
申请日：2019-03-21
Applicant: Apple Inc.
Inventor： James A. Wright , Guangtao Zhang , Raymund W. M. Kwok , Karl Ruben F. Larsson , Christopher S. Graham , Matthew D. Hill , Abhijeet Misra
IPC: H05K5/04 , H02J50/10 , H01Q1/38 , H01Q7/00 , H05K5/03 , G06F1/18 , H04M1/02 , H05K7/14 , G06F1/16
Abstract: An enclosure is formed by coupling an outer cover to a back enclosure piece. The enclosure defines an interior volume for receiving components of an electronic device. The back enclosure piece is formed from a metal frame component and a non-metal outer cover. A metal layer overlaps the metal frame component and the outer cover within the interior volume. The metal layer has a thickness that provides support and shatter resistance to the non-metal outer cover. The metal layer can form an inductor of a wireless power transfer circuit.
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公开(公告)号：US20190223310A1
公开(公告)日：2019-07-18
申请号：US16360939
申请日：2019-03-21
Applicant: Apple Inc.
Inventor： James A. Wright , Guanglao Zhang , Raymund W.M. Kwok , Karl Ruben F. Larsson , Christopher S. Graham , Matthew D. Hill , Abhijeet Misra
CPC classification number: H05K5/04 , G06F1/1656 , G06F1/1658 , G06F1/182 , H01Q1/38 , H01Q7/00 , H02J50/10 , H04M1/0202 , H05K5/03 , H05K7/1427
Abstract: An enclosure is formed by coupling an outer cover to a back enclosure piece. The enclosure defines an interior volume for receiving components of an electronic device. The back enclosure piece is formed from a metal frame component and a non-metal outer cover. A metal layer overlaps the metal frame component and the outer cover within the interior volume. The metal layer has a thickness that provides support and shatter resistance to the non-metal outer cover. The metal layer can form an inductor of a wireless power transfer circuit.
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公开(公告)号：US10218827B2
公开(公告)日：2019-02-26
申请号：US15449797
申请日：2017-03-03
Applicant: Apple Inc.
Inventor： Matthew D. Hill , Derek C. Krass , Benjamin Shane Bustle , Lucy Elizabeth Browning , Michael Benjamin Wittenberg , James B. Smith , Ashutosh Y. Shukla , Scott A. Myers
Abstract: An enclosure and a method for forming an enclosure are disclosed. The enclosure may be formed from metal, such as aluminum, and further include a non-metal portion allowing for transmission and receipt of electromagnetic waves. The non-metal portion may be interlocked to the enclosure and in particular, to a region within the enclosure including a first material having a relatively high strength and stiffness compared to the non-metal portion. Interlocking means may include forming dovetail cuts into the enclosure to receive the non-metal portion, a hole or cavity drilled into the enclosure which includes internal threads, and a rod inserted into the first material to provide a tension to the non-metal portion. Methods of assembling internal components using anodization are also disclosed.
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公开(公告)号：US10095287B2
公开(公告)日：2018-10-09
申请号：US14815278
申请日：2015-07-31
Applicant: Apple Inc.
Inventor： Scott A. Myers , Ihtesham H. Chowdhury , Richard Hung Minh Dinh , Benjamin J. Pope , Matthew D. Hill , Dhaval N. Shah , Martin J. Auclair
Abstract: An electronic device is configured to detect the presence or absence of a case that is positioned over at least one surface of the electronic device. When a case is present, the electronic device is configured to determine one or more characteristics of the case and adjust one or more operations of the electronic device based on at least one characteristic of the case.
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