公开(公告)号：US11128943B2

公开(公告)日：2021-09-21

申请号：US16564804

申请日：2019-09-09

Applicant: Apple Inc.

Inventor： Dustin A. Hatfield ,  Eugene A. Whang ,  Robert A. Boyd ,  Duy P. Le ,  Yi-Fang D. Tsai ,  David J. Feathers ,  Shota Aoyagi ,  Sean S. Corbin

IPC: H04R1/10

Abstract: An earpiece is described that includes a driver housing that encloses an audio driver. The driver housing is oriented so that a first end of the driver housing can be supported by a concha bowl of a user's ear and a second end opposite the first end can tilt outside of the user's ear so that the ear need not accommodate an entirety of the driver housing. The driver housing is held in place by an ear clip that engages an exterior portion of the user's ear and attaches to the driver housing by way of a bridge element that can enclose other electronic components such as a battery, antenna, processor and the like.

公开(公告)号：US20210029435A1

公开(公告)日：2021-01-28

申请号：US17061098

申请日：2020-10-01

Applicant: Apple Inc.

Inventor： Edward Siahaan ,  Daniel R. Bloom ,  Lee M. Panecki ,  Phillip Qian ,  Benjamin A. Shaffer ,  Christopher J. Stringer ,  Eugene A. Whang ,  David H. Narajowski ,  Scott Y. Oshita ,  Dustin A. Hatfield ,  Zachary G. Segraves ,  Sean J. Docherty

IPC: H04R1/10 ,  H04R5/033

Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.

公开(公告)号：US09725198B2

公开(公告)日：2017-08-08

申请号：US14465585

申请日：2014-08-21

Applicant: Apple Inc.

Inventor： Eugene A. Whang ,  Paul E. Newburn ,  Mark E. Doutt ,  Rafael L. Dionello ,  Hsien Y. Pu ,  Michael A. Korinek ,  Evan A. Cernokus ,  Michael S. Long

IPC: B65B53/06 ,  B65B61/18 ,  B65B63/08 ,  B65D75/00 ,  B65D75/58

CPC classification number: B65B53/063 ,  B65B61/18 ,  B65B63/08 ,  B65D75/002 ,  B65D75/5844

Abstract: Shrink wrap films that are customized to have a shape matching a shape of a particular part or parts are disclosed. The shrink wrap films can be formed using unique manufacturing techniques that involve heating the part or parts prior to applying the shrink wrap film. The resultant part or parts will have substantially wrinkle-free and defect-free shrink wrap film applied thereon. In some embodiments, additional functional and cosmetic features are formed in the shrink wrap film. In some embodiments, a laser cutting procedure is used to form the features in the shrink wrap film. Methods can be used to provide visually and tactilely smooth and aesthetically appealing shrink wrapped consumer products.

公开(公告)号：US09176548B2

公开(公告)日：2015-11-03

申请号：US14297572

申请日：2014-06-05

Applicant: Apple Inc.

Inventor： Brett W. Degner ,  David H. Narajowski ,  Eric R. Prather ,  Mark K. Sin ,  Paul A. Baker ,  Eugene A. Whang ,  Christopher J. Stringer ,  Frank F. Liang

IPC: G06F1/20 ,  H05K7/20 ,  G06F1/18 ,  G08B5/36 ,  G08B21/18 ,  H05K5/03 ,  F21V8/00 ,  G06F3/00

CPC classification number: G06F1/181 ,  G02B6/0001 ,  G02B6/0008 ,  G02B6/001 ,  G06F1/182 ,  G06F1/183 ,  G06F1/185 ,  G06F1/188 ,  G06F1/20 ,  G06F1/206 ,  G06F3/00 ,  G08B5/36 ,  G08B21/18 ,  H01L23/4093 ,  H05K1/0203 ,  H05K5/03 ,  H05K7/20009 ,  H05K7/20145 ,  H05K7/20154 ,  H05K7/20163 ,  H05K7/20172 ,  H05K7/20209 ,  H05K7/2039 ,  H05K7/2049

Abstract: A desktop computing system having at least a central core surrounded by housing having a shape that defines a volume in which the central core resides is described. The housing includes a first opening and a second opening axially displaced from the first opening. The first opening having a size and shape in accordance with an amount of airflow used as a heat transfer medium for cooling internal components, the second opening defined by a lip that engages a portion of the airflow in such a way that at least some of the heat transferred to the air flow from the internal components is passed to the housing.

Abstract translation: 描述了至少具有由外壳包围的中心芯片的桌面计算系统，所述外壳具有限定其中心芯所在的卷的形状。 壳体包括从第一开口轴向移位的第一开口和第二开口。 第一开口具有根据用作冷却内部部件的传热介质的气流量的尺寸和形状，第二开口由唇缘限定，该唇缘以一定的方式接合气流的一部分，使得至少一些 传递到来自内部部件的空气流的热量被传递到壳体。

公开(公告)号：US20140362523A1

公开(公告)日：2014-12-11

申请号：US14297582

申请日：2014-06-05

Applicant: Apple Inc.

Inventor： Brett W. Degner ,  Eric R. Prather ,  David H. Narajowski ,  Frank F. Liang ,  Jay S. Nigen ,  Jesse T. Dybenko ,  Connor R. Duke ,  Eugene A. Whang ,  Christopher J. Stringer ,  Joshua D. Banko ,  Caitlin Elizabeth Kalinowski ,  Jonathan L. Berk ,  Matthew P. Casebolt ,  Kevin S. Fetterman ,  Eric J. Weirshauser

IPC: G06F1/20

CPC classification number: G06F1/181 ,  G02B6/0001 ,  G02B6/0008 ,  G02B6/001 ,  G06F1/182 ,  G06F1/183 ,  G06F1/185 ,  G06F1/188 ,  G06F1/20 ,  G06F1/206 ,  G06F3/00 ,  G08B5/36 ,  G08B21/18 ,  H01L23/4093 ,  H05K1/0203 ,  H05K5/03 ,  H05K7/20009 ,  H05K7/20145 ,  H05K7/20154 ,  H05K7/20163 ,  H05K7/20172 ,  H05K7/20209 ,  H05K7/2039 ,  H05K7/2049

Abstract: The present application describes various embodiments regarding systems and methods for providing efficient heat rejection for a lightweight and durable compact computing system having a small form factor. The compact computing system can take the form of a desktop computer. The desktop computer can include a monolithic top case having an integrated support system formed therein, the integrated support system providing structural support that distributes applied loads through the top case preventing warping and bowing. A mixed flow fan is utilized to efficiently pull cooling air through the compact computing system.

Abstract translation: 本申请描述了关于用于为具有小外形尺寸的轻便且耐用的小型计算系统提供有效散热的系统和方法的各种实施例。 紧凑型计算系统可以采用台式计算机的形式。 台式计算机可以包括具有形成在其中的集成支撑系统的整体式顶壳，该集成支撑系统提供结构支撑，其通过顶壳分布施加的载荷，从而防止翘曲和弯曲。 利用混流风扇有效地将冷却空气拉过小型计算系统。