Abstract:
An apparatus and method for dynamically adjusting power limits for processing nodes and other components, such as peripheral interfaces, is disclosed. The apparatus includes multiple processing nodes and other components, and further includes a power management unit configured to set a first frequency limit for at least one of the processing nodes responsive to receiving an indication of a first detected temperature greater than a first temperature threshold. Initial power limits are set below guard-band power limits for components that do not have reliable reporting of power consumption or for cost or power saving reasons. The amount of throttling of processing nodes is used to adjust the power limits for the processing nodes and these components.
Abstract:
Systems, apparatuses, and methods for implementing efficient power optimization in a computing system are disclosed. A system management unit records operating frequencies required for a computing component to execute a first task. The system management unit stores the recorded operating frequencies in a data array or any other predetermined memory location of a computing system. The system management unit uses the recorded operating frequencies to determine operating frequencies for execution of one or more other tasks.
Abstract:
The low end operating voltage of an integrated circuit is adjusted. Oscillations are counted at a ring oscillator on the integrated circuit over a designated period of clock cycles. Based on the number of oscillations, a prediction model associated with a first set of device degradation data and a second set of static random-access memory (SRAM) low end operating voltage data is used to select a low end operating voltage limit for a processor on the integrated circuit. The low end operating voltage of the processor is set based on the selected low end operating voltage limit. These steps are repeated multiple times during operation of the processor. A method of testing integrated circuits to provide the data employed to produce the prediction model is also provided.
Abstract:
A method includes controlling a power limit of a computing system based on a determined skin temperature of at least one location on an outer surface of a device housing the computing system. A processor includes a processing unit and a power management controller to control a power limit of the processing unit based on a determined skin temperature of at least one location on an outer surface of a device housing the processor.
Abstract:
An apparatus and method for dynamically adjusting power limits for processing nodes and other components, such as peripheral interfaces, is disclosed. The apparatus includes multiple processing nodes and other components, and further includes a power management unit configured to set a first frequency limit for at least one of the processing nodes responsive to receiving an indication of a first detected temperature greater than a first temperature threshold. Initial power limits are set below guard-band power limits for components that do not have reliable reporting of power consumption or for cost or power saving reasons. The amount of throttling of processing nodes is used to adjust the power limits for the processing nodes and these components.
Abstract:
A system has a plurality of electronic components including a memory, a PHY coupled to the memory, and one or more other electronic components. Power consumed by the PHY is estimated during operation of the system. Estimating the power consumed by the PHY includes modeling the power consumed by the PHY as a linear function with respect to memory bandwidth. Available power for the PHY is determined based at least in part on the estimated power consumed by the PHY. At least a portion of the available power for the PHY is allocated to at least one of the one or more other components.
Abstract:
An operating point of one or more components in a processing device may be set using a leakage current estimated based on at least one of a rate of temperature overages or a rate of power overages. In some embodiments, a power management controller may be used to set an operating point of one or more components in the processing device based on at least one of a rate of temperature overages or a rate of power overages for the component(s).
Abstract:
An apparatus and method for efficiently managing performance and power consumption among replicated functional blocks of an integrated circuit despite different circuit behavior amongst the functional blocks due to manufacturing variations. An integrated circuit includes multiple replicated functional blocks, each being a semiconductor die with a corresponding communication fabric for routing packets. A second functional block placed between a first functional block and a third functional block routes packets to destinations from at least the first and the third functional blocks, and provides higher performance than the first and the third functional blocks due to semiconductor manufacturing variations. A power manager assigns a single power supply voltage to the replicated functional blocks, and assigns a target clock frequency to the first and the third functional blocks. The power manager assigns another clock frequency greater than the target clock frequency to the second functional block.
Abstract:
Systems, apparatuses, and methods for managing power usage of integrated circuits. One or more processor cores may be powered down when the system is idle. Even if there is no user activity, the processor core(s) may be woken up periodically for background downloads to retrieve the latest status for social media and other applications. Additionally, a power management unit may track the average number of active cores and the average core utilization. If the average number of active cores is less than a first threshold and the average core utilization is less than a second threshold, the power management unit may generate a request to offline one or more cores. Still further, when the processor's skin temperature is above a threshold and all of the cores are operating at the lowest acceptable operating point, one or more cores may be powered down.
Abstract:
The low end operating voltage of an integrated circuit is adjusted. Oscillations are counted at a ring oscillator on the integrated circuit over a designated period of clock cycles. Based on the number of oscillations, a prediction model associated with a first set of device degradation data and a second set of static random-access memory (SRAM) low end operating voltage data is used to select a low end operating voltage limit for a processor on the integrated circuit. The low end operating voltage of the processor is set based on the selected low end operating voltage limit. These steps are repeated multiple times during operation of the processor. A method of testing integrated circuits to provide the data employed to produce the prediction model is also provided.