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公开(公告)号：US09659358B2
公开(公告)日：2017-05-23
申请号：US14653053
申请日：2013-12-03
CPC分类号： G06T7/0004 , G01N21/8806 , G01N21/95 , G01N2021/8472 , H04N5/2256 , H04N7/18
摘要： An apparatus for checking an adherence state of fiber reinforced plastic tape includes an illuminating section having first and second illuminating groups. The main optical axes of illumination light beams of light emitting sections of the first illuminating group are set at a designated inclination angle with respect to a surface of an imaging region and distances on the main optical axes between a surface of a structural object and each of the light emitting sections are set to be the same. The main optical axes of illumination light beams of light emitting sections of the second illuminating group are set at an inclination angle different from the first illuminating group with respect to the surface of the imaging region and distances on the main optical axes between the surface of the structural object and each of the light emitting sections are set to be the same.
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公开(公告)号：US20170005068A1
公开(公告)日：2017-01-05
申请号：US15038963
申请日：2014-11-19
发明人： Koji NISHIMURA , Katsumi TERADA , Mikio KAWAKAMI
IPC分类号： H01L23/00 , H01L25/00 , H01L25/065
CPC分类号： H01L24/81 , H01L24/75 , H01L25/0657 , H01L25/50 , H01L2224/14181 , H01L2224/16145 , H01L2224/16227 , H01L2224/75252 , H01L2224/75753 , H01L2224/75843 , H01L2224/8113 , H01L2224/81132 , H01L2224/81193 , H01L2224/81203 , H01L2225/06513 , H01L2225/06517 , H01L2225/06565 , H01L2225/06593 , H01L2924/00014
摘要： A three-dimensional mounting method for successively laminating N number of upper-layer joining materials includes positioning a first upper-layer joining material relative to a lowermost-layer joining material by recognizing an alignment position of the lowermost-layer joining material and a lower face alignment position of the first upper-layer joining material by a two-field image recognition unit, storing positional coordinates of the alignment position of the lowermost-layer joining material, positioning an (n+1)-th upper-layer joining material relative to an n-th upper-layer joining material by recognizing an upper face alignment position of the n-th upper-layer joining material and a lower face alignment position of the (n+1)-th upper-layer joining material, storing positional coordinates of the upper face alignment position of the n-th upper-layer joining material, recognizing an upper face alignment position of the N-th uppermost-layer joining material, and storing positional coordinates of the upper face alignment position of the N-th uppermost-layer joining material.
摘要翻译： 用于连续层压N个上层接合材料的三维安装方法包括通过识别最下层接合材料的对准位置和相对于最下层接合材料的下表面定位第一上层接合材料相对于最下层接合材料 通过双场图像识别单元对第一上层接合材料的对准位置，存储最下层接合材料的取向位置的位置坐标，定位第（n + 1）个上层接合材料相对于 通过识别第n个上层接合材料的上表面对准位置和第（n + 1）个上层接合材料的下表面对准位置，第n个上层接合材料，存储位置坐标 第n个上层接合材料的上表面对准位置，识别第N个最上层接合材料的上表面对准位置，并且存储位置 第N个最上层接合材料的上表面对准位置的坐标。
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公开(公告)号：US20230360936A1
公开(公告)日：2023-11-09
申请号：US18355484
申请日：2023-07-20
发明人： Koichi KAZAMA , Yoshiyuki ARAI , Jun INAGAKI
IPC分类号： H01L21/67 , B32B43/00 , B23K26/57 , B23K26/067
CPC分类号： H01L21/67144 , B32B43/006 , B23K26/57 , B23K26/067 , B32B2310/0843
摘要： A transfer device is provided that comprises a transfer substrate holding unit, a receiving substrate holding unit, and an active energy ray irradiation unit. The transfer substrate holding unit holds a transfer substrate with an ablation layer on which at least one element is held. The receiving substrate holding unit holds a receiving substrate such that the ablation layer of the transfer substrate is opposite the receiving substrate. The active energy ray irradiation unit irradiates the ablation layer of the transfer substrate with an active energy ray to cause ablation for transferring the at least one element held by the ablation layer from the transfer substrate to the receiving substrate. The active energy ray irradiation unit irradiates the ablation layer with the active energy ray at a plurality of locations in a holding region of the ablation layer that holds one of the at least one element.
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公开(公告)号：US11607871B2
公开(公告)日：2023-03-21
申请号：US16960439
申请日：2019-01-15
发明人： Toshihisa Osaki , Masatoshi Hayakawa , Koki Kamiya , Miharu Kaneko , Hideo Uehara , Katsufumi Araki , Ayumi Konda , Hajime Hirata , Toshiyuki Ura
IPC分类号： B32B27/28 , B32B38/10 , G03F7/11 , G03F7/00 , G03F7/40 , G03F7/095 , B32B38/00 , B32B37/00 , G03F7/42
摘要： Disclosed are a separator for lipid bilayer membrane formation capable of forming a lipid bilayer membrane with excellent properties, wherein the separator for lipid bilayer membrane formation has sufficient mechanical strength and can be easily manufactured in a large scale by using a general-purpose machine without need of using an expensive machine, and a method of producing the separator. The separator for lipid bilayer membrane formation includes a thin film having one or more through holes and made of a resin capable of being wet-etched, and reinforcing layers covering both surfaces of the thin film and made of a resin capable of being wet-etched. The reinforcing layers cover the whole area of the thin film, except for the through holes and the peripheries thereof, and each through hole has a tapered cross-sectional shape.
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公开(公告)号：US20220384657A1
公开(公告)日：2022-12-01
申请号：US17884276
申请日：2022-08-09
IPC分类号： H01L29/786 , H01L29/66 , H01L21/02
摘要： What is provided is a transistor including a gate electrode, a gate insulating film, a semiconductor film, a source electrode, and a drain electrode, in which the gate insulating film is a laminated film in which a SiOx film and a SiCyNz film are alternately formed, the total number of films constituting the laminated film is 3 or more and 18 or less, and the thickness of each film constituting the laminated film is 25 nm or more and 150 nm or less.
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公开(公告)号：US11508950B2
公开(公告)日：2022-11-22
申请号：US16460716
申请日：2019-07-02
IPC分类号： H01M4/04 , H01M4/88 , H01M8/0271 , H01M8/04746 , H01M8/04082
摘要： A method of manufacturing an electrode sheet by using an electrode sheet manufacturing apparatus for manufacturing the electrode sheet includes a feeding step of feeding out a sheet body from a roll on which the sheet body is wound, the sheet body including an active layer containing a catalyst laminated on a support layer, and a cutting step of forming the electrode sheet by punching the sheet body by pressing a cutting blade from a side of the support layer against the sheet body that was fed out in the feeding step.
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公开(公告)号：US11409164B2
公开(公告)日：2022-08-09
申请号：US16464864
申请日：2017-10-31
发明人： Takuya Onji , Masaki Mori
IPC分类号： G02F1/13357 , B32B7/02 , G02F1/1335 , H01L33/50 , G02B5/20
摘要： A light conversion member includes a light conversion film, a first gas barrier, and a first base material. The light conversion film converts color of light from a specific color. The first gas barrier is located on a side of the light conversion film where the light to be converted is incident. The first gas barrier includes one or more gas barrier layers that prevent moisture and gas from entering the light conversion film. The first base material is located on an opposite side of the first gas barrier from a face on which the light conversion film is located. The first base material transmits the light and holds the light conversion film and the first gas barrier. For a light of the specific color, a light transmittance of the first base material combined with the first gas barrier is higher than a light transmittance of the first base material alone.
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公开(公告)号：US20210351057A1
公开(公告)日：2021-11-11
申请号：US17381823
申请日：2021-07-21
发明人： Yasushi TAMURA
摘要： a mounting device and a mounting method is provided with which, after lowering a mounting head holding a chip component in a direction perpendicular to a substrate to bring the chip component into close contact with the substrate subsequent to positioning the chip component and the substrate, a control unit causes a recognition mechanism to start a parallel recognition operation of a chip recognition mark and a substrate recognition mark and recognize the chip recognition mark and the substrate recognition mark through the mounting head in a mounted state in which the chip component is in close contact with the substrate, and calculates mounting position accuracy of the chip component and the substrate.
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公开(公告)号：US10793952B2
公开(公告)日：2020-10-06
申请号：US15510845
申请日：2015-10-29
IPC分类号： C23C16/50 , H01L31/048 , B32B7/02 , C23C16/455 , H01L31/0392 , C23C16/02 , C23C16/54
摘要： A method for forming a sealing film, in which a buffer layer and a barrier layer whose density is higher than that of the buffer layer are alternately formed on a substrate, includes forming a first buffer layer on a surface of the substrate, forming a first barrier layer on a surface of the first buffer layer, and forming a second buffer layer on a surface of the first barrier layer. A ratio of a thickness of a portion of the first buffer layer in a thickness direction of the substrate relative to a thickness of a portion of the first buffer layer in an inclined direction that is inclined with respect to the thickness direction is closer to 1 than a ratio of a thickness of a portion of the second buffer layer in the thickness direction relative to a thickness of a portion of the second buffer layer in the inclined direction.
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公开(公告)号：US20200014017A1
公开(公告)日：2020-01-09
申请号：US16460716
申请日：2019-07-02
IPC分类号： H01M4/04 , H01M4/88 , H01M8/0271 , H01M8/04082 , H01M8/04746
摘要： A method of manufacturing an electrode sheet by using an electrode sheet manufacturing apparatus for manufacturing the electrode sheet includes a feeding step of feeding out a sheet body from a roll on which the sheet body is wound, the sheet body including an active layer containing a catalyst laminated on a support layer, and a cutting step of forming the electrode sheet by punching the sheet body by pressing a cutting blade from a side of the support layer against the sheet body that was fed out in the feeding step.
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