Micro light emitting diode (LED) structure, method for manufacturing the same and display including the same

    公开(公告)号:US11005004B2

    公开(公告)日:2021-05-11

    申请号:US16158783

    申请日:2018-10-12

    Abstract: Provided is a micro light emitting diode (LED) structure including an n-type semiconductor substrate layer, a light emitting structure layer formed on the n-type semiconductor substrate layer, and a p-type semiconductor layer formed on the light emitting structure layer, wherein the light emitting structure layer includes an arrangement of light emitting structures in which active layers including In and Ga are formed on tops thereof, wherein the light emitting structure layer forms at least three distinctive regions each including a single light emitting structure or a plurality of light emitting structures, the distinctive regions configured to emit light of at least two different wavelengths, the distinctive regions are controllable to emit light individually, and the distinctive regions are different in at least one of sizes of base faces, heights, and center-to-center distances of the lighting emitting structures of the regions.

    APPARATUS AND METHOD FOR ENCRYPTION AND DECRYPTION

    公开(公告)号:US20210126770A1

    公开(公告)日:2021-04-29

    申请号:US16664836

    申请日:2019-10-26

    Abstract: A method according to one embodiment includes generating one or more key tables based on a first seed value; generating one or more secret values from a tweak value based on the one or more key tables; and performing encryption or decryption using the one or more secret values. An apparatus according to one embodiment includes a key table generator configured to generate one or more key tables based on a first seed value, a secret value generator configured to generate one or more secret values from a tweak value based on the one or more key tables, and an encryptor/decryptor configured to perform encryption or decryption using the one or more secret values.

    THREE-DIMENSIONAL ELECTROMECHANICAL ADHESIVE SURFACE STRUCTURE CAPABLE OF ADHESIVE FORCE MANIPULATION AND TACTILE SENSING, DESIGN AND MANUFACTURING METHOD THEREOF USING 3D PRINTING

    公开(公告)号:US20210122064A1

    公开(公告)日:2021-04-29

    申请号:US17031888

    申请日:2020-09-24

    Abstract: Disclosed are a design and manufacturing method for a three-dimensional electromechanical adhesive surface structure capable of adhesive force manipulation and tactile sensing by using 3D printing. The three-dimensional electromechanical adhesive surface structure includes: a body; a plurality of three-dimensional micro pillar structures which are attached to the body at a certain angle; and a wire which supplies voltage to the plurality of three-dimensional micro pillar structures. The three-dimensional micro pillar structure includes: a pillar which is attached to the body at a certain angle and is formed integrally with the body; a conductive material which is applied to surround the pillar; and an insulating material coated to surround the conductive material in order to be insulated from an opposite surface. The voltage supplied through the wire is supplied to the conductive material. A passage for providing the wire is formed under the plurality of three-dimensional micro pillar structures of the body. As a result, a technology allowing a robot to recognize, feel, and move an object beyond the human level is implemented, so that it is possible to maximize the convenience and efficiency.

    METHOD AND APPARATUS WITH NEURAL NETWORK DATA QUANTIZING

    公开(公告)号:US20210110270A1

    公开(公告)日:2021-04-15

    申请号:US15931362

    申请日:2020-05-13

    Abstract: A neural network data quantizing method includes: obtaining local quantization data by firstly quantizing, based on a local maximum value for each output channel of a current layer of a neural network, global recovery data obtained by recovering output data of an operation of the current layer based on a global maximum value corresponding to a previous layer of the neural network; storing the local quantization data in a memory to perform an operation of a next layer of the neural network; obtaining global quantization data by secondarily quantizing, based on a global maximum value corresponding to the current layer, local recovery data obtained by recovering the local quantization data based on the local maximum value for each output channel of the current layer; and providing the global quantization data as input data for the operation of the next layer.

    Pincer-type ligand having acridane structure and metal complex using the same

    公开(公告)号:US10974237B2

    公开(公告)日:2021-04-13

    申请号:US16260086

    申请日:2019-01-28

    Abstract: Disclosed are a pincer-type ligand having a structurally rigid acridane structure and a metal complex consisting of the pincer-type ligand and a metal bound to each other, and exhibiting high reactivity and stability during a variety of bonding activation reactions. T-shaped complexes can be prepared from acriPNP(4,5-bis(diisopropylphosphino)-2,7,9,9-tetramethyl-9H-acrid in-10-ide), which is a pincer-type PNP ligand having an acridane structure, and metal complexes, which can be structurally rigid and thus exhibit excellent reactivity and stability based on minimized structural change thereof, can be prepared by introducing an acridane structure into the backbone thereof. The PNP ligand is structurally stable and has novel chemical properties, as compared to conventional similar ligands, and thus can be utilized in a wide range of catalytic reactions and material chemistry.

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