Abstract:
A radio frequency device may be formed which has high power output and high transistor switching speeds. This may be done by providing thicker gate oxides and a higher supply potential to transistors utilized to form the power amplifier and using thinner gate oxides conventionally associated with high switching speed and advanced process technologies for other applications on the same integrated circuit. Thus, high switching speeds can be achieved with some transistors which utilize a lower supply voltage and high power output can be achieved from other transistors which are coupled to a higher supply voltage. The different types of transistors may be made in the same integrated circuit fabrication process on the same integrated circuit.
Abstract:
A capacitor structure for an integrated circuit, the structure including a main capacitor and a parasitic capacitor, comprising: a substrate 2000 of a first conductivity type; a first dielectric layer 2040; a first conductive layer 2010 disposed over the first dielectric layer 2040, said first conductive layer 2010 forming a first plate of the main capacitor and a first plate of the parasitic capacitor; a second dielectric layer 2020 disposed over the first conductive layer 2010; and a second conductive layer 2030 disposed over the second dielectric layer 2020, the second conductive layer 2030 forming a second plate of the main capacitor; characterized in that the capacitor structure further comprises a well 2100 disposed within the substrate 2000 which is of a second conductivity type opposite to said first type, the first dielectric layer 2040 is disposed over the well 2100 and the well 2100 forms a second plate of the parasitic capacitor and a further, junction capacitor with the substrate 2000, the configuration being such that the parasitic and junction capacitors are mutually in series and in series with the main capacitor such as to reduce stray capacitance.
Abstract:
A driving circuit of a display device such as a liquid crystal generates power supply clocks (1 and 2) based on a system clock during the normal display operation which is not a power save mode. The generated power supply clocks are supplied, directly or after inversion, to the switches (SW1 through SW4 (and SW5 through SW8)) in a charge pump type power supply circuit (300) for switching the connection of capacitors (C1 and C2 (and C11 and C12)) in the power supply circuit (300). In this manner, supply voltages VDD2 and VDD3 which function as the driving power supply for a driving circuit (100) and a display panel (200) can be obtained at the power supply circuit (300) by boosting the input voltage Vin. The driving circuit (100) stops supply of the power supply clocks to the power supply circuit (300) when a transition to the power save mode is instructed and a power save control signal generated by a CPU I/F circuit (16) is changed, thereby suspending generation of the supply voltage an consumption of power consumption at the circuit and display panel.
Abstract translation:诸如液晶的显示装置的驱动电路在不是省电模式的正常显示操作期间基于系统时钟产生电源时钟(1和2)。 所产生的电源时钟在电荷泵式电源电路(300)中直接或倒置后供给开关(SW1至SW4(和SW5至SW8)),用于切换电容器(C1和C2(和 C11和C12))。 以这种方式,通过升压输入电压Vin,可以在电源电路(300)获得用作驱动电路(100)和显示面板(200)的驱动电源的电源电压VDD2和VDD3。 驱动电路(100)在指示向省电模式的转变时停止向电源电路(300)供给电源时钟,并且由CPU I / F电路(16)产生的省电控制信号发生变化 从而暂停生成电源电压消耗电路和显示面板的功耗。
Abstract:
A semiconductor integrated circuit device for a magnetic disk apparatus has analog circuits such as a read/write circuit and digital circuits such as an interface driver circuit, a control circuit, and a stepping motor driver circuit, all of these circuits operating on a single supply voltage. The semiconductor integrated circuit device further has a voltage regulator whose output voltage is lower than the supply voltage and variable according to the voltage applied to an output voltage adjustment terminal. The control circuit operates on the output voltage of this regulator.
Abstract:
According to an embodiment of the invention, a method and apparatus for dynamic reference voltage adjustment are described. According to one embodiment, a reference circuit comprises a reference node to provide a reference voltage; a first transistor device to receive a first configuration signal at a gate terminal, a current to flow through the first transistor device when the first configuration signal is a first value; and a second transistor device to receive a first voltage potential at a gate terminal, the current to flow through the second transistor device and the reference voltage to be increased by the first voltage potential when the configuration signal is a second value.
Abstract:
A charge pump circuit has input and output nodes, a first transistor, a second transistor, a third transistor, a first capacitor, and a second capacitor. A drain of the first transistor and a drain of the second transistor are connected to the input node. A source of the second transistor and a drain of the third transistor are connected to the output node. The first capacitor is connected to a gate of the second transistor. The third transistor is connected to a substrate and a source of the second transistor. When the first transistor is turned on, a voltage at the input node will charge the first capacitor. When the second transistor is turned on, the third transistor is turned on simultaneously so that the substrate and the source of the second transistor will reach the same voltage level. Then, voltage at the input node will charge the second capacitor.
Abstract:
A voltage boosting circuit and a method of generating a boosting voltage alleviate deterioration of a driver transistor caused by high voltage stress when the level of an external supply voltage is high. The voltage boosting circuit includes boosting capacitors and switches. The boosting capacitors include a first boosting capacitor connected to a driving node and a last boosting capacitor that outputs the boosting voltage. The switches connect the boosting capacitors in series in response to a control signal. The boosting voltage increases or decreases as the voltage level at the driving node changes according to the logic state of a boosting level control signal. The boosting level control signal is responsive to the external supply voltage level. An external supply voltage detector detects the level of external supply voltage level and generates the boosting level control signal.
Abstract:
An internal power supply circuit for a semiconductor integrated circuit includes two constant voltage generators having identical circuit topologies but generating two different constant voltages from an external power supply voltage. The lower constant voltage is selected when the external power supply voltage is below a predetermined level, the higher constant voltage is selected when the external power supply voltage is above the predetermined level, and an internal power supply voltage is generated from the selected constant voltage. The internal power supply voltage is stable over a wide flat region, but can also be raised to a higher level for stress testing of the semiconductor integrated circuit, and the higher level is also stable.
Abstract:
An electronic device of one embodiment of the invention is disclosed which includes one or more wired interconnection points and a blocking mechanism. The one or more wired interconnection points are to interconnect to other electronic devices. The blocking mechanism is situated at the one or more wired interconnect points to reduce leakage current transferred from the other electronic devices over the one or more wired interconnection points.
Abstract:
In order to solve a problem that during rise of an input voltage Vin, when the input voltage Vin exceeds a level of Vdetnull, but does not yet exceed a level of Vdetnull, no release signal is outputted, there is provided a voltage detecting circuit which is capable of removing a hysteresis voltage during the rise of the voltage Vin to output a release signal even in a case where the voltage Vin exceeds Vdetnull, but does not yet exceed Vdetnull.