公开(公告)号：US5997386A

公开(公告)日：1999-12-07

申请号：US991379

申请日：1997-12-16

Applicant: Harvey Dumond, Jr. ,  Timothy S. Jaspers ,  Douglas William Vanderwell

Inventor： Harvey Dumond, Jr. ,  Timothy S. Jaspers ,  Douglas William Vanderwell

IPC: B24B9/00 ,  B24B21/04 ,  B24B1/00

CPC classification number: B24B9/002 ,  B24B21/04

Abstract: An apparatus for abrading or deburring a workpiece is provided and includes in combination a conveyor for moving the workpiece from a first position to a second position and at least two assemblies intermediate the first and second positions and opposite the conveyor for abrading one side of the workpiece in a plurality of directions. In an alternate embodiment of the invention, a third assembly may be provided which deburrs an opposite side of the workpiece as it is passed through the deburring assembly. The conveyor for moving the workpiece positively fixes the location of the workpiece with respect to the conveyor and translates the workpiece through the deburring assembly.

Abstract translation: 提供了一种用于研磨或去毛刺工件的装置，其组合包括用于将工件从第一位置移动到第二位置的输送器和在第一和第二位置之间的至少两个组件，并且与传送器相对，用于研磨工件的一侧 在多个方向上。 在本发明的替代实施例中，可以提供第三组件，当工件通过去毛刺组件时，第三组件在工件的相对侧去毛刺。 用于移动工件的输送机将相对于输送机的工件的位置确实地固定，并使工件平移通过去毛刺组件。

公开(公告)号：US5957764A

公开(公告)日：1999-09-28

申请号：US964930

申请日：1997-11-05

Applicant: H. Alexander Anderson ,  Linh X. Can ,  Tsungnan Cheng ,  Garry K. Kwong ,  Albert Hu ,  David Chen ,  Shu-Wong S. Lee

Inventor： H. Alexander Anderson ,  Linh X. Can ,  Tsungnan Cheng ,  Garry K. Kwong ,  Albert Hu ,  David Chen ,  Shu-Wong S. Lee

IPC: B24B21/04 ,  B24B37/04 ,  B24B5/00 ,  B24B29/00

CPC classification number: B24B21/04 ,  B24B37/04

Abstract: A wafer polishing apparatus includes a module frame; a continuous belt rotatable with respect to the frame, the belt having at least one vertically-oriented belt transverse portion including a polishing pad assembly; and at least one pivotable wafer-holding head drive within the frame and having a distal end portion movable to a vertical first position parallel and juxtaposed to the belt transverse portion. The head drive includes a wafer carrier for holding a wafer on the distal end portion of the head drive, while a drive moves the distal end portion and a held wafer into a vertical polishing position abutting the belt transverse portion and pressure is applied to the held-wafer against the polishing pad assembly while the wafer-holding distal end portion is rotated and swept side-by-side. After polishing the drive is reversed and the head drive is pivoted away from the belt transverse portion to a horizontal or other orientation and the then polished wafer removed. Multiple modules may be placed end-to-end or side-by-side with a robot pathway therebetween to load unpolished wafers and to unload polished wafers to a buffing station, to a cassette or other processing station.

Abstract translation: 晶片抛光装置包括模块框架; 相对于框架可旋转的连续带，所述带具有包括抛光垫组件的至少一个垂直定向的带横向部分; 以及在所述框架内的至少一个可枢转的晶片保持头驱动器，并且具有可移动到平行并并列到所述带横向部分的垂直第一位置的远端部分。 头驱动器包括用于将晶片保持在头驱动器的远端部分的晶片载体，同时驱动器将远端部分和保持的晶片移动到邻近带横向部分的垂直抛光位置，并且压力施加到保持的 - 在晶片保持前端部分旋转并且并排扫掠的同时，抵靠抛光垫组件。 在抛光之后，驱动器被反转并且头驱动器从带横向部分转动到水平或其它方向，并且然后抛光晶片。 多个模块可以端对端或并排地放置在其间的机器人通路以加载未抛光的晶片并将抛光的晶片卸载到抛光台，到盒或其它处理站。

公开(公告)号：US5885143A

公开(公告)日：1999-03-23

申请号：US896014

申请日：1997-07-17

Applicant: Hisayoshi Ichikawa ,  Takahisa Ishida

Inventor： Hisayoshi Ichikawa ,  Takahisa Ishida

IPC: B24B7/17 ,  B24B19/02 ,  B24B21/04 ,  B24B7/00 ,  B24B9/00

CPC classification number: B24B19/028 ,  B24B21/04 ,  B24B7/17

Abstract: A disk texturing apparatus for texturing surfaces of a magnetic disk or the like with cross-pattern grooves. The texturing apparatus is basically constituted by a rotational drive having a spindle for supporting and rotating a disk, and a tape transport mechanism for moving a texturing tape across and in pressed with a texturing surface of said disk. The spindle of the rotational drive mechanism is arranged to hold a disk in an eccentrically deviated position off the rotational axis of the rotational drive. As a result, the disk is revolved along an eccentrically deflecting orbit around the rotational axis of said rotational drive while being rotated with the spindle, moving in and out in radial directions in a degree commensurate with the amount of deviation from said rotational axis to form cross-pattern grooves on the disk surface.

Abstract translation: 一种用于纹理化具有交叉图案凹槽的磁盘等的表面的盘纹理装置。 纹理装置基本上由具有用于支撑和旋转盘的主轴的旋转驱动器构成，以及用于使纹理带移动并被所述盘的纹理表面按压的带传送机构。 旋转驱动机构的主轴被布置成将盘保持在偏离旋转驱动的旋转轴线的偏心位置。 结果，圆盘绕着所述旋转驱动器的旋转轴线的偏心偏转轨道旋转，同时与心轴一起旋转，以与径向方向一致的程度与与所述旋转轴线的偏离量相对应的程度移动以形成 盘形表面上的交叉图案凹槽。

公开(公告)号：US5692947A

公开(公告)日：1997-12-02

申请号：US759172

申请日：1996-12-03

Applicant: Homayoun Talieh ,  David Edwin Weldon

Inventor： Homayoun Talieh ,  David Edwin Weldon

IPC: B24B21/00 ,  B24B7/22 ,  B24B21/04 ,  B24B35/00 ,  B24B37/04 ,  B24B41/06 ,  B24B53/007 ,  H01L21/304 ,  B24B1/00

CPC classification number: B24B53/017 ,  B24B21/04 ,  B24B35/00 ,  B24B37/04 ,  B24B41/06 ,  B24B7/228

Abstract: A wafer polisher and method for the chemical mechanical planarization of semiconductor wafers. The polisher includes a wafer holder for supporting the semiconductor wafer and a linear polishing assembly having a polishing member positioned to engage the surface of the wafer. The polishing member is movable in a linear direction relative to the wafer surface to uniformly polish the surface of the wafer. A pivotal alignment device may be used to pivotally support one of the wafer holder and the polishing member relative to the other of the wafer holder and the polishing member with the surface of the wafer and the polishing member retained in parallel alignment during operation of the polisher. The polisher optionally includes a conditioning station for conditioning the polishing member.

Abstract translation: 一种用于半导体晶片的化学机械平面化的晶片抛光机和方法。 抛光机包括用于支撑半导体晶片的晶片保持器和具有定位成接合晶片表面的抛光构件的线性抛光组件。 抛光构件可相对于晶片表面在线性方向上移动以均匀地抛光晶片的表面。 枢轴对准装置可以用于相对于晶片保持器和抛光构件中的另一个枢转地支撑晶片保持器和抛光构件中的一个，晶片的表面和抛光构件在抛光机的操作期间保持平行对准 。 抛光机可选地包括用于调节抛光构件的调节台。

公开(公告)号：US5193317A

公开(公告)日：1993-03-16

申请号：US659399

申请日：1991-04-12

Applicant: Tom Nordquist ,  Leo Malinen

Inventor： Tom Nordquist ,  Leo Malinen

IPC: B21B45/00 ,  B22D11/12 ,  B22D11/126 ,  B24B21/04 ,  B24B27/033

CPC classification number: B24B27/033 ,  B22D11/12 ,  B24B21/04 ,  B21B45/00

Abstract: Methods for treating surface faults and impurities on metal stock which has been subjected to hot working are disclosed in which the hot metal stock is subjected to grinding from an endless abrasive belt while the hot metal stock from the hot working step remains at a temperature of between about 500.degree. and 1500.degree. C., and the desired grinding pressure is applied to the hot metal stock during the grinding step by means of a contact device in which the applied pressure is created by a fluid so that the contact device remains in floating contact with the hot metal stock during grinding. Apparatus for treating surface faults and impurities on such hot metal stock are also disclosed.

Abstract translation: PCT No.PCT / SE89 / 00496 Sec。 371日期1991年4月12日 102（e）日期1991年4月12日PCT PCT 1989年9月14日PCT公布。 出版物WO90 / 02631 日期：1990年3月22日。公开了用于处理已经经受热加工的金属原料表面缺陷和杂质的方法，其中热金属原料经受来自无端磨带的研磨，而来自热加工的热金属原料 步骤保持在约500℃至1500℃之间的温度，并且在研磨步骤期间通过接触装置将期望的研磨压力施加到热金属原料，其中施加的压力由流体产生，使得 接触装置在研磨期间保持与热金属原料浮动接触。 还公开了用于处理这种热金属原料上的表面缺陷和杂质的装置。

公开(公告)号：US5028242A

公开(公告)日：1991-07-02

申请号：US369680

申请日：1989-06-21

Applicant: Yasushi Ito ,  Masaaki Imamura ,  Yoshiki Kato ,  Jun Fumioka

Inventor： Yasushi Ito ,  Masaaki Imamura ,  Yoshiki Kato ,  Jun Fumioka

IPC: B24B7/17 ,  B24B21/00 ,  B24B21/04 ,  B24D3/00 ,  B24D3/34 ,  B24D11/00 ,  G11B5/84

CPC classification number: B24B37/08 ,  B24B7/17 ,  B24D11/001 ,  B24D3/00 ,  B24D3/346 ,  G11B5/84 ,  Y10T428/24372 ,  Y10T428/257 ,  Y10T428/259

Abstract: A method of producing a magnetic disk by lapping a magnetic disk medium, comprising the steps of:preparing a lapping tape having an abrasive particle layer provided with abrasive particle clusters and chip pockets formed between adjacent two clusters, each of said clusters having abrasive particles of Al.sub.2 O.sub.3 or SiC and abrasive particles of diamond,lapping the surface of said magnetic disk medium by using the thus prepared lapping tape.

公开(公告)号：US4733500A

公开(公告)日：1988-03-29

申请号：US928790

申请日：1986-11-10

Applicant: Eugene C. David

Inventor： Eugene C. David

IPC: B24B7/12 ,  B24B7/28 ,  B24B21/04 ,  B24B3/36

CPC classification number: B24B29/005 ,  B24B21/04 ,  B24B7/12 ,  B24B7/28

Abstract: A wood surface treatment system comprising a tandemly arranged endless abrasive cross-belt and flexible rotary abrading surface treating apparatus wherein the abrasive cross-belt portion of the system which includes a platen assembly arranged to move in an oscillatory or epicyclic pattern relative to the work surface and wherein the flexible rotary abrading portion of the apparatus includes a pair of angularly disposed rotary abraders, such as cylindrical brushes. The axis of each individual flexible rotary abrader is disposed at an acute angle, preferably 45 degrees, to the axis of the conveyor, with the individual axes being preferably disposed at 90 degrees, one to the other. The cross-belt portion of the apparatus preferably includes means for drivably oscillating the platen.

Abstract translation: 一种木材表面处理系统，包括串列布置的环形磨料交叉皮带和柔性旋转研磨表面处理装置，其中所述系统的磨料交叉皮带部分包括压板组件，所述压板组件布置成相对于工作表面以振荡或周期性图案移动 并且其中所述装置的柔性旋转研磨部分包括一对角度设置的旋转研磨器，例如圆柱形刷。 每个单独的柔性旋转研磨机的轴线相对于输送机的轴线设置成锐角，优选为45度，其中各个轴优选地以相对于另一个90度设置。 装置的交叉皮带部分优选地包括用于可动地摇动压板的装置。

公开(公告)号：US4640056A

公开(公告)日：1987-02-03

申请号：US722117

申请日：1985-04-11

Applicant: Lee E. Stump

Inventor： Lee E. Stump

IPC: B24B21/04

CPC classification number: B24B21/04

Abstract: A belt driven feed assembly having a plurality of floating passive pinch wheels and a plurality of floating drive wheels, staggered and offset from one another, for conveying flat stock having irregular upper and lower surfaces. The drive and pinch wheels coact with one another and the belt to vertically center the flat stock relative to a stationary milling assembly, whereby irregularities in the upper and lower surfaces are removed so as to obtain finished flat stock with relatively smooth and parallel upper and lower surfaces.

Abstract translation: 一种皮带驱动进给组件，具有多个浮动的无源夹紧轮和多个彼此错开并相互偏移的浮动驱动轮，用于输送具有不规则的上表面和下表面的扁平坯料。 驱动和夹紧轮彼此共同作用并且使皮带相对于固定的铣削组件垂直居中，从而去除上表面和下表面中的不规则性，以获得具有相对平滑且平行的上下平面的成品平板坯料 表面。

公开(公告)号：US4407096A

公开(公告)日：1983-10-04

申请号：US341497

申请日：1982-01-21

Applicant: Clarence I. Steinback

Inventor： Clarence I. Steinback

IPC: B24B21/12 ,  B24B21/04 ,  B24B1/00

CPC classification number: B24B21/12

Abstract: A surface grinding method in a first embodiment of which a workpiece supported on a surface (56) is rotated about a vertical axis while being translated along ways (46, 47) past a cutting head (22) comprising an abrasive belt (71) driven about a drum (72) to have a working edge (17) skewed with respect to the direction of the ways. In other embodiments the workpiece (100) is fed axially into the belt (106), which may be oscillated transversely to the direction of feed, and the workpiece may be moved, in the direction of the working edge, out of engagement with the belt while the belt and workpiece are in motion.

Abstract translation: 第一实施例中的表面磨削方法，其中支撑在表面（56）上的工件围绕垂直轴线旋转，同时沿着包括磨带（71）驱动的切割头（22）的方式（46,47）平移 围绕鼓（72）具有相对于路的方向倾斜的工作边缘（17）。 在其它实施例中，工件（100）被轴向地进给到带（106）中，其可以横向于进给方向摆动，并且工件可以在工作边缘的方向上移动与带的接合 而皮带和工件运动。

公开(公告)号：US4399637A

公开(公告)日：1983-08-23

申请号：US227548

申请日：1981-01-23

Applicant: Clarence I. Steinback

Inventor： Clarence I. Steinback

IPC: B24B21/12 ,  B24B21/04

CPC classification number: B24B21/12

Abstract: An abrasive grinding machine (11) is disclosed which comprises workpiece conveying means (14) carried in a horizontal position by a frame (12) with a grinding head (15) disposed in overlying relation thereto. The conveying means (14) includes a flexible endless conveyor belt (22) the upper flight of which passes over a rigid planar backing surface. The grinding head (15) includes an abrasive belt (27) that moves in a direction opposite the conveyor belt (22). A back-up roller (31) is rotatably disposed in a recess (21) in the bed (13) in opposition to a drive roller (28) of the grinding head (15). The back-up roller (31) slightly elevates the conveyor belt (22) from the rigid support surface of the bed (13). The belt (22) is thus able to deflect and conform to a warped or twisted workpiece as it moves through the grinding area, resulting in uniform deslagging of each workpiece.

Abstract translation: 公开了一种磨料研磨机（11），其包括通过框架（12）在水平位置承载的工件输送装置（14），其具有与其相重叠地设置的研磨头（15）。 输送装置（14）包括柔性环形输送带（22），其上部飞行物穿过刚性平面背衬表面。 研磨头（15）包括沿与输送带（22）相反的方向移动的研磨带（27）。 相对于研磨头（15）的驱动辊（28），支撑辊（31）可旋转地设置在床（13）的凹部（21）中。 支撑辊（31）将传送带（22）从床（13）的刚性支撑表面略微升高。 因此，带（22）能够在翘曲或扭曲的工件移动通过研磨区域时偏转并且符合扭曲或扭曲的工件，从而导致每个工件的均匀脱渣。