公开(公告)号：US20080006888A1

公开(公告)日：2008-01-10

申请号：US11263476

申请日：2005-10-31

Applicant: Yong Yun ,  Chil Ah ,  Dong Ha ,  Hyung Park ,  Wan Yun ,  Kwang-Cheol Lee ,  Gwang Park

Inventor： Yong Yun ,  Chil Ah ,  Dong Ha ,  Hyung Park ,  Wan Yun ,  Kwang-Cheol Lee ,  Gwang Park

IPC: H01L21/00

CPC classification number: B81C99/0095 ,  B81B2201/035 ,  B81C2201/0143 ,  Y10S977/883 ,  Y10S977/888

Abstract: Disclosed herein is a method of fabricating nano-components using nanoplates, including the steps of: printing a grid on a substrate using photolithography and Electron Beam Lithography; spraying an aqueous solution dispersed with nanoplates onto the grid portion to position the nanoplates on the substrate; depositing a protective film of a predetermined thickness on the substrate and the nanoplates positioned on the substrate; ion-etching the nanoplates deposited with the protective film by using a Focused Ion Beam (FIB) or Electron Beam Lithography; and eliminating the protective film remaining on the substrate using a protective film remover after the ion-etching of the nanoplates, and a method of manufacturing nanomachines or nanostructures by transporting such nano-components using a nano probe and assembling with other nano-components. The present invention makes it possible to fabricate the high-quality nano-components in a more simple and easier manner at a lower cost, as compared to other conventional methods. Further, the present invention provides a method of implementing nanomachines through combination of such nano-components and biomolecules, etc.

Abstract translation: 本文公开了使用纳米板制造纳米组分的方法，包括以下步骤：使用光刻和电子束光刻在衬底上印刷栅格; 将分散有纳米板的水溶液喷射到栅格部分上以将纳米板定位在基底上; 在衬底和位于衬底上的纳米板上沉积预定厚度的保护膜; 通过使用聚焦离子束（FIB）或电子束光刻法离子蚀刻沉积有保护膜的纳米板; 并且在纳米板的离子蚀刻之后使用保护膜去除剂去除残留在基板上的保护膜，以及通过使用纳米探针传输这种纳米成分并与其他纳米成分组装来制造纳米机械或纳米结构的方法。 与其它常规方法相比，本发明可以以更简单和更容易的方式以更低的成本制造高质量的纳米组分。 此外，本发明提供了通过这些纳米组分和生物分子等的组合来实现纳米机器的方法。

公开(公告)号：US06948245B2

公开(公告)日：2005-09-27

申请号：US10149055

申请日：2000-12-04

Applicant: Takashi Nishi

Inventor： Takashi Nishi

IPC: B23P15/14 ,  B81B1/00 ,  B81B5/00 ,  B81C1/00 ,  B81C99/00 ,  F16H55/17

CPC classification number: F16H55/22 ,  B23P15/14 ,  B81B2201/035 ,  B81C99/0085 ,  Y10T29/49462 ,  Y10T29/49467 ,  Y10T29/49469 ,  Y10T29/4948

Abstract: In order that a worm 1 is rotated, a clearance (a region constituting a clearance portion between bearings and a worm gear) is formed (FIGS. 4(1) to (3)) in an upper surface of a base plate 3. A mold 12 for forming a lower half region of the worm therein is formed (FIG. 4(8)). A material 5 for the worm is deposited (FIG. 4(9)) to a height equal to that of a lower half region plus that of an upper half of the worm. An upper half of the worm is formed (FIGS. 4(10) to (12). Finally, the material 13 in the clearance between the base plate 3 and gear 1 is removed (FIG. 4(13)).

Abstract translation: 为了使蜗杆1旋转，在基板3的上表面形成有间隙（构成轴承和蜗轮之间的间隙部的区域）（图4（1）〜（3））。 形成用于形成蜗杆下半部分的模具12（图4（8））。 将蠕虫的材料5（图4（9））沉积到等于下半部分加上蠕虫上半部的高度的高度。 形成蜗杆的上半部（图4（10）〜（12）），最后移除基板3与齿轮1之间的间隙中的材料13（图4（13））。

公开(公告)号：US06557607B2

公开(公告)日：2003-05-06

申请号：US09791571

申请日：2001-02-26

Applicant: Takayuki Yamada ,  Mutsuya Takahashi ,  Masaki Nagata

Inventor： Takayuki Yamada ,  Mutsuya Takahashi ,  Masaki Nagata

IPC: B32B3100

CPC classification number: B81C99/008 ,  B29C64/00 ,  B33Y10/00 ,  B33Y30/00 ,  B81B2201/035 ,  B81C2201/0197 ,  Y10T156/12 ,  Y10T156/13 ,  Y10T156/14 ,  Y10T428/24355

Abstract: A substrate on which a plurality of thin films having a plurality of cross-sections corresponding to the cross-section of a micro-structure are formed is placed on a substrate holder. The substrate holder is elevated to bond a thin film formed on the substrate to the surface of a stage, and by lowering the substrate holder, the thin film is separated from the substrate and transferred to the stage side. The transfer process is repeated to laminate a plurality of thin films on the stage and to form the micro-structure. Accordingly, there are provided a micro-structure having high dimensional precision, especially high resolution in the lamination direction, which can be manufactured from a metal or an insulator such as ceramics and can be manufactured in the combined form of structural elements together, and a manufacturing method and an apparatus thereof.

Abstract translation: 其上形成有多个与微结构的横截面相对应的多个横截面的薄膜的基板被放置在基板支架上。 衬底保持器被升高以将形成在衬底上的薄膜粘合到台的表面上，并且通过降低衬底保持器，将薄膜与衬底分离并转移到平台侧。 重复转印过程以在台上层压多个薄膜并形成微结构。 因此，提供了可以由诸如陶瓷的金属或绝缘体制造的具有高尺寸精度，特别是层压方向上的高分辨率的微结构，并且可以以结构元件的组合形式一起制造，并且 制造方法及其装置。

公开(公告)号：US06290859B1

公开(公告)日：2001-09-18

申请号：US09439103

申请日：1999-11-12

Applicant: James G. Fleming ,  Seethambal S. Mani ,  Jeffry J. Sniegowski ,  Robert S. Blewer

Inventor： James G. Fleming ,  Seethambal S. Mani ,  Jeffry J. Sniegowski ,  Robert S. Blewer

IPC: H01L2100

CPC classification number: B81C1/0096 ,  B81B3/0005 ,  B81B2201/035 ,  B81C1/00674 ,  B81C2201/0176 ,  B81C2201/112 ,  H01H2001/0057

Abstract: A process is disclosed whereby a 5-50-nanometer-thick conformal tungsten coating can be formed over exposed semiconductor surfaces (e.g. silicon, germanium or silicon carbide) within a microelectromechanical (MEM) device for improved wear resistance and reliability. The tungsten coating is formed after cleaning the semiconductor surfaces to remove any organic material and oxide film from the surface. A final in situ cleaning step is performed by heating a substrate containing the MEM device to a temperature in the range of 200-600 ° C. in the presence of gaseous nitrogen trifluoride (NF3). The tungsten coating can then be formed by a chemical reaction between the semiconductor surfaces and tungsten hexafluoride (WF6) at an elevated temperature, preferably about 450° C. The tungsten deposition process is self-limiting and covers all exposed semiconductor surfaces including surfaces in close contact. The present invention can be applied to many different types of MEM devices including microrelays, micromirrors and microengines. Additionally, the tungsten wear-resistant coating of the present invention can be used to enhance the hardness, wear resistance, electrical conductivity, optical reflectivity and chemical inertness of one or more semiconductor surfaces within a MEM device.

Abstract translation: 公开了一种方法，其中可以在微机电（MEM）装置内的暴露的半导体表面（例如硅，锗或碳化硅）上形成5-50纳米厚的共形钨涂层，以改善耐磨性和可靠性。 在清洁半导体表面之后形成钨涂层，以从表面除去任何有机材料和氧化物膜。 通过在含有气态三氟化氮（NF 3）的存在下，将含有MEM装置的基板加热至200-600℃的温度，进行最终的原位清洗步骤。 钨涂层然后可以通过半导体表面和六氟化钨（WF6）之间的化学反应在升高的温度，优选约450℃下形成。钨沉积工艺是自限制的，并且覆盖所有暴露的半导体表面，包括紧密的表面 联系。 本发明可以应用于许多不同类型的MEM装置，包括微型雷达，微镜和微型引擎。 此外，本发明的钨耐磨涂层可用于提高MEM装置内的一个或多个半导体表面的硬度，耐磨性，导电性，光反射率和化学惰性。

公开(公告)号：US5366587A

公开(公告)日：1994-11-22

申请号：US887749

申请日：1992-05-26

Applicant: Minoru Ueda ,  Michitomo Iiyama

Inventor： Minoru Ueda ,  Michitomo Iiyama

IPC: C04B41/53 ,  C04B41/91 ,  C23C16/40 ,  G03F7/00 ,  H01L21/306

CPC classification number: B81C1/00198 ,  C04B41/009 ,  C04B41/53 ,  C04B41/91 ,  C23C16/408 ,  G03F7/00 ,  B81B2201/034 ,  B81B2201/035 ,  B81B2201/037 ,  B81B2203/056 ,  Y10S505/785

Abstract: A process for manufacturing a micromachine comprising a machine element supported on a substrate, comprising the steps of successively depositing on the substrate machine part layers and removable sacrificial layers made of an oxide ceramic material containing a rare earth, Ba, and Cu, and selectively removing the machine parts layer and the sacrificial layers so as to leave the machine element.

Abstract translation: 一种微机械的制造方法，其特征在于，具有：支撑在基板上的机械元件，其特征在于，包括以下步骤：在所述基板上依次沉积由含有稀土元素Ba，Cu的氧化物陶瓷材料构成的部分层和可除去的牺牲层， 机器部件层和牺牲层，以便离开机器元件。

公开(公告)号：US5344526A

公开(公告)日：1994-09-06

申请号：US123061

申请日：1993-09-16

Applicant: Yoshiki Nishibayashi ,  Shinichi Shikata

Inventor： Yoshiki Nishibayashi ,  Shinichi Shikata

IPC: C23F4/00 ,  B81C99/00 ,  C04B41/53 ,  C04B41/91 ,  H01L21/302 ,  H01L21/3065 ,  H01L21/306 ,  B44C1/22

CPC classification number: H01L21/3065 ,  B81C1/00531 ,  C04B41/5338 ,  C04B41/5346 ,  C04B41/91 ,  B81B2201/035 ,  B81C2201/0132

Abstract: A diamond surface is selectively etched by forming a mask on a surface of diamond, and etching the diamond surface with a mixture of oxygen-containing gas and an inert gas, in which a concentration of oxygen in terms of O.sub.2 is from 0.01 to 20% based on the whole volume of the mixture.

Abstract translation: 通过在金刚石的表面上形成掩模来选择性地蚀刻金刚石表面，并且用含氧气体和惰性气体的混合物蚀刻金刚石表面，其中以O 2计的氧浓度为0.01至20％ 基于混合物的总体积。

公开(公告)号：US20170068218A1

公开(公告)日：2017-03-09

申请号：US15231876

申请日：2016-08-09

Applicant: Nivarox-FAR S.A.

Inventor： PHILIPPE DUBOIS

IPC: G04B31/08 ,  G04D5/00

CPC classification number: G04B31/08 ,  B81B2201/035 ,  B81C1/00674 ,  G04B15/14

Abstract: The invention relates to a micromechanical timepiece part comprising a silicon-based substrate (1) having at least one surface, at least one part of said surface having pores (2) which open out at the external surface of the micromechanical timepiece part and comprise a tribological agent (5).The invention likewise relates to a method for producing a micromechanical timepiece part starting from a silicon-based substrate (1), said silicon-based substrate having at least one surface, at least one part of which is lubricated by a tribological agent (5), said method comprising, in order, the steps of: a) forming pores (2) on the surface of the part of said surface of said silicon-based substrate (1), b) depositing said tribological agent (5) in said pores (2).

公开(公告)号：US20160378064A1

公开(公告)日：2016-12-29

申请号：US15171012

申请日：2016-06-02

Applicant: Nivarox-FAR S.A.

Inventor： Alex GANDELHMAN

IPC: G04D99/00 ,  C23F1/00

CPC classification number: G04D99/00 ,  B81B2201/035 ,  B81B2203/0384 ,  B81C1/00103 ,  B81C2201/0132 ,  B81C2201/0138 ,  B81C2201/014 ,  C23F1/00

Abstract: The invention relates to a silicon-based component with at least one chamfer formed from a method combining at least one oblique side wall etching step with a “Bosch” etching of vertical side walls, thereby enabling aesthetic improvement and improvement in the mechanical strength of components formed by micromachining a silicon-based wafer.

Abstract translation: 本发明涉及一种具有至少一个倒角的硅基组件，该方法将至少一个倾斜侧壁蚀刻步骤与垂直侧壁的“博世”蚀刻相结合，从而使得美观改进和组件的机械强度得到改善 通过微加工硅基晶片形成。

公开(公告)号：US09284654B2

公开(公告)日：2016-03-15

申请号：US12952825

申请日：2010-11-23

Applicant: Clément Saucy

Inventor： Clément Saucy

IPC: C25D1/00 ,  C25D1/20 ,  B81C99/00 ,  G03F7/00

CPC classification number: C25D1/003 ,  B81B2201/035 ,  B81C99/0085 ,  B81C2201/032 ,  C25D1/20 ,  G03F7/00

Abstract: The invention relates to a process for fabricating a monolayer or multilayer metal structure in LIGA technology, in which a photoresist layer is deposited on a flat metal substrate, a photoresist mold is created by irradiation or electron or ion bombardment, a metal or alloy is electroplated in this mold, the electroformed metal structure is detached from the substrate and the photoresist is separated from this metal structure, wherein the metal substrate is used as an agent involved in the forming of at least one surface of the metal structure other than that formed by the plane surface of the substrate.

Abstract translation: 本发明涉及一种在LIGA技术中制造单层或多层金属结构的方法，其中光致抗蚀剂层沉积在平坦的金属基底上，通过照射或电子或离子轰击产生光致抗蚀剂模具，电镀金属或合金 在该模具中，电铸金属结构与基板分离，并且光致抗蚀剂与该金属结构分离，其中金属基板用作形成金属结构的至少一个表面的试剂，而不是由 基板的平面。

公开(公告)号：US20150309474A1

公开(公告)日：2015-10-29

申请号：US14695697

申请日：2015-04-24

Applicant: ROLEX SA

Inventor： Richard Bossart ,  Denis Favez

IPC: G04B1/14 ,  G04B15/14 ,  G04B13/00 ,  G04B31/004 ,  G04B31/06

CPC classification number: G04B1/145 ,  B81B2201/035 ,  B81C1/00682 ,  G04B13/00 ,  G04B15/14 ,  G04B31/004 ,  G04B31/06

Abstract: The manufacturing process produces a part (10), from a micromachinable material, the part (10) forming a blank of the timepiece component and comprising at least one surface having an initial roughness. It comprises a step of mechanical strengthening treatment of the part in an etching fluid intended to decrease the roughness of said surface. For example, a substrate of said micromachinable material is provided; the substrate is at least partially covered with a protective coating containing at least one aperture; the substrate is etched through the aperture in the protective coating and an etched surface is thus obtained; the mechanical strengthening treatment is applied to said etched surface through the aperture in the protective coating; and then the protective coating is removed. The etching fluid may be a plasma or a liquid chemical etchant.

Abstract translation: 该制造工艺从可微加工材料制造零件（10），所述零件（10）形成钟表件的坯件，并且包括具有初始粗糙度的至少一个表面。 它包括在旨在降低所述表面的粗糙度的蚀刻流体中机械强化处理该部件的步骤。 例如，提供所述可微加工材料的基材; 所述基底至少部分地被包含至少一个孔的保护涂层覆盖; 通过保护涂层中的孔蚀刻衬底，从而获得蚀刻表面; 通过保护涂层中的孔将机械强化处理施加到所述蚀刻表面; 然后去除保护涂层。 蚀刻流体可以是等离子体或液体化学蚀刻剂。