Multi-chip stacked devices
    21.
    发明授权

    公开(公告)号:US11004833B1

    公开(公告)日:2021-05-11

    申请号:US16792560

    申请日:2020-02-17

    Applicant: XILINX, INC.

    Abstract: Examples described herein generally relate to multi-chip devices having stacked chips. In an example, a multi-chip device includes a chip stack that includes chips. Neighboring chips are connected to each other. Plural chips of the chips collectively include columns of broken via pillars and bridges. Each of the plural chips has a broken via pillar in each column. The broken via pillar has first and second continuous via pillar portions aligned in a direction normal to a side of a semiconductor substrate of the respective chip. The first continuous via pillar portion is not connected within the broken via pillar to the second continuous via pillar portion. Each of the plural chips has one or more of the bridges. Each bridge connects, within the respective chip, the first continuous via pillar portion in a column and the second continuous via pillar portion in another column.

    Circuit for and method of accessing memory elements in an integrated circuit device

    公开(公告)号:US10396799B1

    公开(公告)日:2019-08-27

    申请号:US15839462

    申请日:2017-12-12

    Applicant: Xilinx, Inc.

    Abstract: A circuit for accessing memory elements in an integrated circuit device is described. The circuit comprises a first plurality of memory elements; first line drivers, each of the first line drivers configured to provide a signal to a memory element of the first plurality of memory elements; first line driver buffers configured to control the signals provided by the first line drivers to the first plurality of memory elements; a second plurality of memory elements; second line drivers, each of the second line drivers configured to provide a signal to a memory element of the second plurality of memory elements; second line driver buffers configured to control the signals provided by the second line drivers to the second plurality of memory elements; and wherein one or both of the first line driver buffers and the second line driver buffers are configured to be selectively disabled.

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