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    STRUCTURE AND METHOD TO FABRICATE TOOLING FOR BUMPING THIN FLEX CIRCUITS
    21.
    发明申请
    STRUCTURE AND METHOD TO FABRICATE TOOLING FOR BUMPING THIN FLEX CIRCUITS 有权
    结构和方法来制作薄膜电路

    公开(公告)号：US20140178644A1

    公开(公告)日：2014-06-26

    申请号：US13721896

    申请日：2012-12-20

    Applicant: XEROX CORPORATION

    Inventor： Peter J. Nystrom ,  Bryan R. Dolan ,  Gary D. Redding

    IPC: B41J29/00

    CPC classification number: H05K3/0014 ,  H05K1/0393 ,  H05K3/3436 ,  H05K2201/09045 ,  H05K2203/0108 ,  Y02P70/613 ,  Y10T29/42 ,  Y10T428/24479

    Abstract: A structure and method for a post plate of a die set that can be used to emboss a plurality of contact pads of a flexible printed circuit during the formation of a printer printhead. In one embodiment, a plurality of post plate posts can be formed, where each post plate post has a flat upper surface, generally straight sides, and a sharp corner where the flat upper surface and the generally straight sides intersect. Each post can be polished using, for example, a pad and an abrasive polishing compound or an electrochemical polishing process, to round the sharp corners to form a post having a rounded contour. In another embodiment, a plurality of post plate posts each having a rounded contour can be formed using a molding process.

    Abstract translation: 一种用于模具的后板的结构和方法，其可用于在形成打印头打印头期间对柔性印刷电路的多个接触垫进行压印。 在一个实施例中，可以形成多个柱板柱，其中每个柱板柱具有平坦的上表面，大致直的侧面，以及平坦的上表面和大致直边相交的尖角。 可以使用例如垫和研磨抛光化合物或电化学抛光工艺来抛光每个柱，以使尖锐的角落圆形以形成具有圆形轮廓的柱。 在另一个实施例中，可以使用成型工艺形成各具有圆形轮廓的多个柱板柱。

    Method of fabricating a plurality of linear arrays with submicron y-axis alignment
    24.
    发明授权
    Method of fabricating a plurality of linear arrays with submicron y-axis alignment 有权

    公开(公告)号：US10943895B2

    公开(公告)日：2021-03-09

    申请号：US16247016

    申请日：2019-01-14

    Applicant: Xerox Corporation

    Inventor： Gary D. Redding ,  Joseph F. Casey

    IPC: H01L25/00 ,  H01L23/00 ,  H01L33/62 ,  H01L27/15 ,  H01L27/144 ,  H01L25/065 ,  H01L31/02

    Abstract: A method of assembling a plurality of linear arrays from a silicon wafer having a first surface and a second surface opposite the first surface, the first surface having at least a first linear array of sensor/emitter elements and a second linear array of sensor/emitter elements, each arranged parallel relative to a first direction, and a sacrificial portion positioned between the first linear array of sensor/emitter elements and the second linear array of sensor/emitter elements. The method includes: forming a first cavity in the second surface positioned opposite the sacrificial portion and parallel relative to the first direction; forming at least a first through cut, a second through cut, a third through cut and a fourth through cut in the silicon wafer, the first and second through cuts are parallel to the first direction, the third and fourth through cuts are perpendicular to the first direction, the first through cut arranged adjacent to the first linear array of sensor/emitter elements opposite the sacrificial portion, the second through cut arranged adjacent to the second linear array of sensor/emitter elements opposite the sacrificial portion, and the third and fourth through cuts form a first end and a second end, respectively, of a multi-row sensor/emitter chip defined by the first, second, third and fourth through cuts; bonding at least a portion of the multi-row sensor/emitter chip formed by the second surface of the silicon wafer to a mounting substrate; and, removing the sacrificial portion.

    Lead-free piezo printhead using thinned bulk material
    25.
    发明授权
    Lead-free piezo printhead using thinned bulk material 有权

    公开(公告)号：US10421277B2

    公开(公告)日：2019-09-24

    申请号：US16375951

    申请日：2019-04-05

    Applicant: Xerox Corporation ,  Brown University

    Inventor： Peter J. Nystrom ,  Gary D. Redding ,  Angus Ian Kingon ,  Seunghyun Kim ,  Nicholas Mostovych

    IPC: B41J2/16 ,  B41J2/14 ,  C04B35/453 ,  C04B35/475

    Abstract: An apparatus for a lead-free piezoelectric ink-jet printhead is disclosed. Piezoelectric printheads, while more expensive are favored because they use a wider variety of inks. The piezoelectric printhead includes a diaphragm, a plurality of piezoelectric actuators comprising a lead-free piezoelectric material, at least one nozzle, at least one ink chamber, a top electrode, and a drive circuit. The deflection of the diaphragm on the body chamber contributes to a pressure pulse that is used to eject a drop of liquid from the nozzle. According to an exemplary embodiment, a lead-free piezoelectric printhead operated at smaller thicknesses and significantly higher electric fields is disclosed, along with methods of making such printheads.

    Electrostatic actuator with short circuit protection and process
    27.
    发明授权
    Electrostatic actuator with short circuit protection and process 有权
    静电执行器具有短路保护和过程

    公开(公告)号：US09321265B2

    公开(公告)日：2016-04-26

    申请号：US14193631

    申请日：2014-02-28

    Applicant: XEROX CORPORATION

    Inventor： Peter J. Nystrom ,  Mark A. Cellura ,  Gary D. Redding ,  Peter M. Gulvin

    IPC: B41J2/41 ,  G11B3/00 ,  B41J2/14 ,  B41J2/16

    CPC classification number: B41J2/14314 ,  B41J2/16 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1634 ,  B41J2/1642 ,  B41J2/1646 ,  B41J2002/14491

    Abstract: An electrostatic actuator for a printhead. The electrostatic actuator may include a substrate. A dielectric layer may be disposed on the substrate. An electrode layer may be disposed on the dielectric layer. A first standoff layer may be disposed at least partially on the electrode layer. A second standoff layer may be disposed at least partially on the electrode layer and at least partially on the first standoff layer. A portion of the second standoff layer disposed on the electrode layer may be removed to form one or more landing pads. A membrane may be disposed at least partially on the second standoff layer.

    Abstract translation: 用于打印头的静电致动器。 静电致动器可以包括基板。 介电层可以设置在基板上。 可以在电介质层上设置电极层。 第一间隔层可以至少部分地设置在电极层上。 第二间隔层可以至少部分地设置在电极层上，并且至少部分地设置在第一间隔层上。 设置在电极层上的第二间隔层的一部分可以被去除以形成一个或多个着陆焊盘。 膜可以至少部分地设置在第二间隔层上。

    Flex circuit board with topographical structures to facilitate fluid flow through the layer
    28.
    发明授权
    Flex circuit board with topographical structures to facilitate fluid flow through the layer 有权
    具有形状结构的Flex电路板，以促进流体流过层

    公开(公告)号：US09238365B1

    公开(公告)日：2016-01-19

    申请号：US14454186

    申请日：2014-08-07

    Applicant: Xerox Corporation

    Inventor： Peter J. Nystrom ,  Gary D. Redding ,  Mark A. Cellura ,  Jon G. Judge ,  Chad D. Freitag ,  Samuel V. Schultz ,  Chad J. Slenes

    IPC: B41J2/14 ,  B41J2/16 ,  H05K1/02

    CPC classification number: H05K1/028 ,  B41J2/14233

    Abstract: A flex circuit board provides islands of electrically isolated material surrounding openings in the flex circuit board to preserve fluid integrity of passageways passing through an electrically insulating layer of the flex circuit board. The electrically isolated islands surround exits of the passageways through the electrically insulating material and extend the passageways through an electrically conductive layer of the flex circuit board. Consequently, fluid passing through the passageways and electrically isolated islands in the flex circuit board is not subjected to electrical current.

    Abstract translation: 柔性电路板提供围绕柔性电路板中的开口的电隔离材料岛，以保持通过柔性电路板的电绝缘层的通路的流体完整性。 电隔离的岛环绕通过电绝缘材料的通道的出口，并且将通道延伸穿过柔性电路板的导电层。 因此，柔性电路板中通过通道和电隔离岛的流体不受电流的影响。

    Structure and method to fabricate tooling for bumping thin flex circuits
    29.
    发明授权
    Structure and method to fabricate tooling for bumping thin flex circuits 有权
    制造用于冲击薄柔性电路的工具的结构和方法

    公开(公告)号：US08845907B2

    公开(公告)日：2014-09-30

    申请号：US13721896

    申请日：2012-12-20

    Applicant: Xerox Corporation

    Inventor： Peter J. Nystrom ,  Bryan R. Dolan ,  Gary D. Redding

    IPC: C25F3/00 ,  B41J29/00

    CPC classification number: H05K3/0014 ,  H05K1/0393 ,  H05K3/3436 ,  H05K2201/09045 ,  H05K2203/0108 ,  Y02P70/613 ,  Y10T29/42 ,  Y10T428/24479

    Abstract: A structure and method for a post plate of a die set that can be used to emboss a plurality of contact pads of a flexible printed circuit during the formation of a printer printhead. In one embodiment, a plurality of post plate posts can be formed, where each post plate post has a flat upper surface, generally straight sides, and a sharp corner where the flat upper surface and the generally straight sides intersect. Each post can be polished using, for example, a pad and an abrasive polishing compound or an electrochemical polishing process, to round the sharp corners to form a post having a rounded contour. In another embodiment, a plurality of post plate posts each having a rounded contour can be formed using a molding process.

    Abstract translation: 一种用于模具的后板的结构和方法，其可用于在形成打印头打印头期间对柔性印刷电路的多个接触垫进行压印。 在一个实施例中，可以形成多个柱板柱，其中每个柱板柱具有平坦的上表面，大致直的侧面，以及平坦的上表面和大致直边相交的尖角。 可以使用例如垫和研磨抛光化合物或电化学抛光工艺来抛光每个柱，以使尖锐的角落圆形以形成具有圆形轮廓的柱。 在另一个实施例中，可以使用成型工艺形成各具有圆形轮廓的多个柱板柱。

    Method for protecting piezoelectric transducer
    30.
    发明授权
    Method for protecting piezoelectric transducer 有权
    保护压电换能器的方法

    公开(公告)号：US08708465B1

    公开(公告)日：2014-04-29

    申请号：US13743311

    申请日：2013-01-16

    Applicant: Xerox Corporation

    Inventor： Mark A. Cellura ,  Peter J. Nystrom ,  Bryan R. Dolan ,  Gary D. Redding

    IPC: B41J2/045

    CPC classification number: B41J2/1634 ,  B41J2/161 ,  B41J2/1623

    Abstract: Disclosed is a process for preparing an ink jet printhead which comprises: (a) providing a diaphragm plate having a plurality of piezoelectric transducers bonded thereto with an adhesive; (b) placing an encapsulant thin film on the piezoelectric transducers; and (c) applying heat, pressure, or a combination thereof to the encapsulant thin film to a degree sufficient to cause the encapsulant to encapsulate the adhesive.

    Abstract translation: 公开了一种用于制备喷墨打印头的方法，其包括：（a）提供具有多个压电换能器的隔膜板，所述压电换能器用粘合剂粘结在其上; （b）将密封剂薄膜放置在压电换能器上; 和（c）将热量，压力或其组合施加到密封剂薄膜至足以使密封剂封装粘合剂的程度。

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