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公开(公告)号:US20230290904A1
公开(公告)日:2023-09-14
申请号:US18200399
申请日:2023-05-22
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Nakhyun KIM , Junhee Choi , Jinjoo Park , Joohun Han
IPC: H01L33/24 , H01L25/16 , H01L33/32 , H01L25/075 , H01L29/06
CPC classification number: H01L33/24 , H01L25/167 , H01L33/32 , H01L25/0753 , H01L29/0676 , H01L33/44
Abstract: A nanorod semiconductor layer having a flat upper surface, a micro-LED including the nanorod semiconductor layer, a pixel plate including the micro-LED , a display device including the pixel plate, and an electronic device including the pixel plate are provided. The nanorod semiconductor layer includes: a main body; and an upper end formed from the main body, wherein the upper end includes: a first inclined surface; a second inclined surface facing the first inclined surface; and a flat upper surface between the first inclined surface and the second inclined surface, and a width of the upper end becomes narrower in an upward direction, and when a length of the upper end protruded from the main body (a thickness of the upper end) is L1, an inclination angle between a surface extending parallel to a surface selected from the first and second inclined surfaces and the flat upper surface is β, and a width of the main body is D, a width D1 of the flat upper surface satisfies Equation 1.
D1=D−(2×L1×tanβ)-
公开(公告)号:US11705479B2
公开(公告)日:2023-07-18
申请号:US17400354
申请日:2021-08-12
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Junhee Choi , Sungjin Kang , Kiho Kong , Junghun Park , Jinjoo Park , Joohun Han , Kyungwook Hwang
CPC classification number: H01L27/156 , H01L33/0093 , H01L33/145 , H01L33/22 , H01L33/405 , H01L33/42 , H01L33/504 , H01L33/60 , H01L2933/0016 , H01L2933/0041 , H01L2933/0058 , H01L2933/0091
Abstract: Provided are a display apparatus and a method of manufacturing the same. The display apparatus includes a support substrate, a driving layer provided on the support substrate and including a driving element configured to apply power to a pixel electrode, and a light-emitting layer provided on the driving layer.
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公开(公告)号:US20230143907A1
公开(公告)日:2023-05-11
申请号:US17720872
申请日:2022-04-14
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Junhee Choi , Kiho Kong , Nakhyun Kim , Joosung Kim , Younghwan Park , Junghun Park , Dongchul Shin , Eunsung Lee , Joohun Han
CPC classification number: H01L33/04 , H01L27/156 , H01L33/24 , H01L33/44
Abstract: Provided is an epitaxy structure including a substrate having an upper surface, the upper surface having a single crystal structure, a two-dimensional material layer disposed on the upper surface of the substrate, and a plurality of nanorod light emitting devices disposed on an upper surface of the two-dimensional material layer, each of the plurality of nanorod light emitting devices having a nanorod shape extending in a vertical direction, wherein each of the plurality of nanorod light emitting devices includes a light emitting nanorod, and a passivation film disposed adjacent to a sidewall of the light emitting nanorod, the passivation film having insulation.
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24.
公开(公告)号:US20230062456A1
公开(公告)日:2023-03-02
申请号:US17982164
申请日:2022-11-07
Applicant: SAMSUNG ELECTRONICS CO., LTD
Inventor: Jinjoo PARK , Junhee Choi , Kiho Kong , Joohun Han , Nakhyun Kim , Junghun Park
IPC: H01L29/778 , H01L29/66 , H01L27/12 , H01L27/15
Abstract: A semiconductor device includes a substrate including a first region and a second region adjacent to the first region, the first and the second regions being disposed in a first direction parallel to an upper surface of the substrate; an etch-stop layer disposed on the first region and the second region; a separation layer disposed on an upper portion of the etch-stop layer, the separation layer being disposed on the first region; a high-electron-mobility transistor (HEMT) element disposed on an upper portion of the separation layer in a second direction perpendicular to an upper surface of the substrate; a light-emitting element disposed on the second region between the substrate and the etch-stop layer; and a plurality of first insulating patterns covering side surfaces of the HEMT element, the plurality of first insulating patterns extending to the etch-stop layer.
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公开(公告)号:US11508820B2
公开(公告)日:2022-11-22
申请号:US17100340
申请日:2020-11-20
Applicant: SAMSUNG ELECTRONICS CO., LTD. , iBeam Materials, Inc.
Inventor: Junhee Choi , Joohun Han , Vladimir Matias
Abstract: A single crystal semiconductor structure includes: an amorphous substrate; a single crystal semiconductor layer provided on the amorphous substrate; and a thin orienting film provided between the amorphous substrate and the single crystal semiconductor layer, wherein the thin orienting film is a single crystal thin film, and the thin orienting film has a non-zero thickness that is equal to or less than 10 times a critical thickness hc.
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公开(公告)号:US20210375983A1
公开(公告)日:2021-12-02
申请号:US17400354
申请日:2021-08-12
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Junhee CHOI , Sungjin Kang , Kiho Kong , Junghun Park , Jinjoo Park , Joohun Han , Kyungwook Hwang
Abstract: Provided are a display apparatus and a method of manufacturing the same. The display apparatus includes a support substrate, a driving layer provided on the support substrate and including a driving element configured to apply power to a pixel electrode, and a light-emitting layer provided on the driving layer.
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公开(公告)号:US12107186B2
公开(公告)日:2024-10-01
申请号:US18322075
申请日:2023-05-23
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Junhee Choi , Nakhyun Kim , Jinjoo Park , Joohun Han
IPC: H01L33/24 , H01L25/075 , H01L33/00 , H01L33/32
CPC classification number: H01L33/24 , H01L25/0753 , H01L33/32 , H01L33/0075
Abstract: A semiconductor light emitting diode (LED) and a method of manufacturing the same are provided. The LED includes a first semiconductor layer; a plurality of active elements spaced apart on the first semiconductor layer and each having a width less than a width of the first semiconductor layer; and a second semiconductor layer disposed on the plurality of active elements.
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公开(公告)号:US12046700B2
公开(公告)日:2024-07-23
申请号:US18238390
申请日:2023-08-25
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Junhee Choi , Nakhyun Kim , Jinjoo Park , Joohun Han
CPC classification number: H01L33/24 , H01L27/156 , H01L33/0025 , H01L33/0062 , H01L33/06 , H01L33/145 , H01L33/30 , H01L33/40
Abstract: Provided is a nanorod light-emitting device including a first semiconductor layer doped with a first conductive type impurity, an emission layer disposed above the first semiconductor layer, a second semiconductor layer disposed above the emission layer and doped with a second conductive type impurity that is electrically opposite to the first conductive type impurity, a conductive layer disposed between at least one of a center portion of a lower surface of the emission layer and the first semiconductor layer and a center portion of an upper surface of the emission layer and the second semiconductor layer, and a current blocking layer surrounding a sidewall of the conductive layer.
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29.
公开(公告)号:US11990563B2
公开(公告)日:2024-05-21
申请号:US17197326
申请日:2021-03-10
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Joohun Han , Junhee Choi , Nakhyun Kim , Dongho Kim , Jinjoo Park
CPC classification number: H01L33/145 , H01L27/156 , H01L33/0062 , H01L33/0095 , H01L33/30
Abstract: A nanorod light emitting device, a method of manufacturing the same, and a display apparatus including the nanorod light emitting device are provided. The nanorod light emitting device includes a first semiconductor layer doped with a first conductivity type, a light emitting layer disposed on the first semiconductor layer, and a second semiconductor layer disposed on the light emitting layer and doped with a second conductivity type that is electrically opposite to the first conductivity type, wherein a distance between a lower surface of the first semiconductor layer and an upper surface of the second semiconductor layer is in a range of about 2 μm to about 10 μm, wherein a difference between a diameter of the upper surface of the second semiconductor layer and the lower surface of the first semiconductor layer is 10% or less of a diameter of the upper surface of the second semiconductor layer.
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公开(公告)号:US11923195B2
公开(公告)日:2024-03-05
申请号:US17352851
申请日:2021-06-21
Applicant: SAMSUNG ELECTRONICS CO., LTD. , iBeam Materials, Inc.
Inventor: Junhee Choi , Vladmir Matias , Joohun Han
IPC: H01L21/02
CPC classification number: H01L21/02502 , H01L21/02488 , H01L21/02491 , H01L21/02496 , H01L21/02505 , H01L21/02513 , H01L21/02516 , H01L21/02598 , H01L21/02192 , H01L21/02266 , H01L21/02422 , H01L21/02425 , H01L21/02458 , H01L21/02461 , H01L21/02463 , H01L21/0254 , H01L21/02543 , H01L21/02546 , H01L21/02609 , H01L21/0262 , H01L21/02631
Abstract: A single crystal semiconductor includes a strain compensation layer; an amorphous substrate disposed on the strain compensation layer; a lattice matching layer disposed on the amorphous substrate and including two or more single crystal layers; and a single crystal semiconductor layer disposed on the lattice matching layer, the lattice matching layer including a direction control film disposed on the amorphous substrate and including a single crystal structure, and a buffer layer including a material different from that of the direction control film, the buffer layer being disposed on the direction control film and including a single crystal structure.
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