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公开(公告)号：US12015193B2
公开(公告)日：2024-06-18
申请号：US17423724
申请日：2020-01-07
发明人： Dongyeon Kim , Seongjin Park , Sehyun Park , Sumin Yun , Myunghun Jeong , Jehun Jong , Jaehoon Jo
摘要： Disclosed is an electronic device including: a housing including a first plate, a second plate facing away from the first plate, and a side member surrounding a space between the first plate and the second plate, connected to the second plate or integrally formed with the second plate, and including a first portion comprising a conductive material, wherein the first portion of the side member includes a plurality of through-holes aligned in a first direction substantially parallel to the first plate and a non-conductive material inside the through-holes; a structure disposed inside the space to face the through-holes and including at least one conductive path; and a wireless communication circuit electrically connected to the conductive path. Various other embodiments inferred from the specification are also possible.
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公开(公告)号：US11967751B2
公开(公告)日：2024-04-23
申请号：US17335527
申请日：2021-06-01
发明人： Seongjin Park , Dongyeon Kim , Hosaeng Kim , Sumin Yun , Myunghun Jeong , Jehun Jong , Jaehoon Jo
CPC分类号： H01Q1/24 , H01Q9/0421 , H01Q9/16
摘要： An electronic device including a housing, a display, an antenna structure positioned inside the housing, and a wireless communication circuit connected to the antenna structure, is provided. The antenna structure includes a dipole antenna element interposed between s-patch elements not to overlap with s-patch elements.
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公开(公告)号：US11664603B2
公开(公告)日：2023-05-30
申请号：US17859597
申请日：2022-07-07
发明人： Seongjin Park , Dongyeon Kim , Hosaeng Kim , Sumin Yun , Woomin Jang , Myunghun Jeong , Jehun Jong , Jaehoon Jo
CPC分类号： H01Q21/0025 , H01Q1/243 , H01Q5/35 , H01Q9/045 , H01Q21/065 , H01Q21/24
摘要： An electronic device is provided. The electronic devices includes a housing at least partially including a conductive portion, an antenna structure including a printed circuit board including a plurality of insulating layers, at least one first conductive patch including a first feeding point, and a second feeding point, and at least one second conductive patch including a third feeding point, and a fourth feeding point, and an antenna module including a wireless communication circuit configured to transmit or receive a first signal through the at least one first conductive patch and to transmit or receive a second signal of a second frequency band through the at least one second conductive patch.
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公开(公告)号：US11532879B2
公开(公告)日：2022-12-20
申请号：US17691539
申请日：2022-03-10
发明人： Sumin Yun , Dongyeon Kim , Seongjin Park , Woomin Jang , Myunghun Jeong , Jehun Jong , Jaehoon Jo
摘要： An electronic device is provided. The electronic device includes a housing including a first plate, a second plate facing a direction opposite to the first plate, and a lateral member surrounding a space between the first and second plates and connected to or integrally formed with the second plate. The electronic device further includes a display disposed in the space so as to be visible from outside through at least a part of the first plate, and at least one antenna structure disposed in the space, including a first surface and a second surface facing a direction opposite to the first surface, and including a first area and a second area surrounded by the first area when viewed from above the first surface. The antenna structure may also include a plurality of insulating layers disposed between the first and second surfaces, first conductive patches disposed in the first area, when viewed from above the first surface, and disposed on the first surface or on a first insulating layer closer to the first surface than the second surface, a second conductive patch overlapped at least in part with the second area, when viewed from above the first surface, and disposed on a second insulating layer between the first insulating layer and the second surface, a ground layer disposed on a third insulating layer between the second insulating layer and the second surface or on the second surface, and one or more conductive walls formed along at least a portion of an outer periphery of the first area, when viewed from above the first surface, and extended from the first insulating layer to the ground layer. The electronic device includes at least one wireless communication circuit electrically connected to the second conductive patch and configured to at least one of transmit or receive a signal having a frequency between about 3 GHz and about 100 GHz.
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公开(公告)号：US11502393B2
公开(公告)日：2022-11-15
申请号：US17096036
申请日：2020-11-12
发明人： Seongjin Park , Dongyeon Kim , Hosaeng Kim , Sumin Yun , Woomin Jang , Myunghun Jeong , Jehun Jong , Jaehoon Jo
摘要： Provided is an electronic device. The electronic device may include: a housing; and an antenna structure disposed in an internal space of the housing, wherein the antenna structure may include: a printed circuit board including a plurality of insulating layers; and at least one first conductive patch disposed on the printed circuit board, wherein the at least one first conductive patch may include: a first side having a first length; a second side parallel to the first side, spaced apart in a direction perpendicular to the first side, and having a second length shorter than the first length; a third side extending from one end of the first side in a direction perpendicular to the first side, and having a third length shorter than a vertical distance between the first side and the second side; a fourth side extending from an other end of the first side in a direction perpendicular to the first side, and having the third length; a fifth side connecting the third side and one end of the second side in a straight line; a sixth side connecting the fourth side and an other end of the second side in a straight line; a first feeding point disposed on a first virtual line passing through a center in the at least one first conductive patch and configured to transmit and/or receive a first signal of a first polarization; and a second feeding point disposed on a second virtual line passing through the center in the at least one first conductive patch and intersecting the first virtual line at a right angle and configured to transmit and/or receive a second signal of a second polarization perpendicular to the first polarization.
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公开(公告)号：US11450966B2
公开(公告)日：2022-09-20
申请号：US17269798
申请日：2019-08-29
发明人： Myunghun Jeong , Sehyun Park , Sumin Yun , Jehun Jong , Jaehoon Jo , Jinwoo Jung , Jaebong Chun
摘要： According to various embodiments, an electronic device may include a housing, an antenna structure disposed inside the housing and including a first face, a second face facing away from the first face, a first conductive helical pattern which extends between the first face and the second face and is constructed inside the antenna structure, and a second conductive helical pattern which extends between the first face and the second face, overlaps with at least in part with the first conductive helical pattern when viewed from above the first face, and is constructed inside the antenna structure, and at least one wireless communication circuit electrically coupled to a first point of the first conductive helical pattern and a second point of the second conductive helical pattern. The first point may be disposed to be spaced apart from the second point when viewed from above the first face. The at least one wireless communication circuit may be configured to provide the first point with a first signal having a frequency between 3 GHz and 100 GHz, and provide the second point with a second signal having a first phase difference with the first signal and having the frequency. Various other embodiments may also be possible.
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公开(公告)号：US11387569B2
公开(公告)日：2022-07-12
申请号：US16865811
申请日：2020-05-04
发明人： Seongjin Park , Dongyeon Kim , Hosaeng Kim , Sumin Yun , Woomin Jang , Myunghun Jeong , Jehun Jong , Jaehoon Jo
摘要： An electronic device is provided. The electronic devices includes a housing at least partially including a conductive portion, an antenna structure including a printed circuit board including a plurality of insulating layers, at least one first conductive patch including a first feeding point, and a second feeding point, and at least one second conductive patch including a third feeding point, and a fourth feeding point, and an antenna module including a wireless communication circuit configured to transmit or receive a first signal through the at least one first conductive patch and to transmit or receive a second signal of a second frequency band through the at least one second conductive patch.
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公开(公告)号：US11363711B2
公开(公告)日：2022-06-14
申请号：US16200401
申请日：2018-11-26
发明人： Jaehoon Jo , Sehyun Park , Sumin Yun , Myunghun Jeong , Jehun Jong , Jinwoo Jung , Jaebong Chun , Eunseok Hong
摘要： According to various embodiments of the present disclosure, an electronic device may include: a housing including a first plate and a second plate; a printed circuit board having a first surface and a second surface; and a communication circuit arranged inside the housing. The printed circuit board may include: a plurality of insulating layers laminated on each other between the first surface and the second surface; an antenna element arranged in a first region above the second surface of the printed circuit board or between a first pair of insulating layers of the printed circuit board, when seen from above the second surface of the printed circuit board; and a plurality of first electroconductive patterns arranged in a second region that at least surrounds one surface of the first region. Various embodiments may be possible.
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公开(公告)号：US11303021B2
公开(公告)日：2022-04-12
申请号：US16200816
申请日：2018-11-27
发明人： Sumin Yun , Sehyun Park , Myunghun Jeong , Jehun Jong , Jae Hoon Jo , Jinwoo Jung , Jae-Bong Chun
IPC分类号： H01Q5/10 , H01Q1/24 , H01Q1/48 , H01Q21/10 , H01Q9/04 , H05K1/11 , H04B1/40 , H04B1/00 , H05K1/02 , H01Q21/28 , H04B1/3888 , H01Q5/40 , H01Q21/08 , H01Q21/24
摘要： According to an embodiment, an electronic device comprises a housing comprising a first plate and a second plate facing away from to the first plate; and a substrate disposed between the first plate and the second plate and comprising a first side facing the first plate and a second side facing the second plate, wherein the substrate comprises, a first conductive plate disposed on a first insulating layers and facing the second side; a conductive pattern disposed on a second insulating layer, wherein the second conductive layer is between the first conductive layer and the first side; a second conductive plate disposed on a third insulating layer between the second insulating layer and the first side, and when the second plate is viewed from above the second side, the second plate at least partially overlaps with the first conductive plate; a ground plate disposed on a fourth insulating layer, wherein the fourth insulating layer is between the third insulating layer and the first side; a conductive via constructed through the third and fourth insulating layers, and electrically connected with the conductive pattern; and a wireless communication circuit electrically connected with the conductive via, and configured to transmit/receive at least one signal having a frequency band in the range of 20 GHz to 100 GHz.
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