公开(公告)号：US20190157627A1

公开(公告)日：2019-05-23

申请号：US16007788

申请日：2018-06-13

Applicant: Samsung Display Co., Ltd.

Inventor： Joon Hwa BAE ,  Hyun Jin CHO ,  Byoung Kwon CHOO ,  Woo Jin CHO

IPC: H01L51/56 ,  H01L27/32

Abstract: In a method of manufacturing a display device, the method includes: forming a conductive layer on a base; forming an organic layer, with a hole partially exposing the conductive layer, on the conductive layer; polishing an upper surface of the organic layer; and forming a light emitting element on the polished organic layer.

公开(公告)号：US20180114819A1

公开(公告)日：2018-04-26

申请号：US15605431

申请日：2017-05-25

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Byung Hoon KANG ,  Kwang Suk KIM ,  Joon-Hwa BAE ,  Woo Jin CHO ,  Hyun Jin CHO ,  Jun Hyuk CHEON ,  Byoung Kwon CHOO

IPC: H01L27/32

CPC classification number: H01L27/3248 ,  H01L27/3276 ,  H01L2227/323

Abstract: A method of manufacturing a display device includes: forming an active layer on a substrate; forming a first insulation layer covering the active layer; forming a gate metal line on the first insulation layer; forming a third insulation layer covering the gate metal line and including a silicon oxide; forming a fourth insulation layer including a silicon nitride on the third insulation layer; forming a fifth insulation layer including a silicon oxide on the fourth insulation layer; arranging a blocking member over a region in which the active layer and the gate metal line overlap; forming a fifth auxiliary insulation layer by doping nitrogen ions in the fifth insulation layer; and exposing a part of an upper surface of the fourth insulation layer by removing a portion of a fifth main insulation layer of the fifth insulation layer which does not overlap the fifth auxiliary insulation layer.

公开(公告)号：US20180043501A1

公开(公告)日：2018-02-15

申请号：US15664166

申请日：2017-07-31

Applicant: Samsung Display Co., Ltd.

Inventor： Hyun Jin CHO ,  Joon-Hwa BAE ,  Byoung Kwon CHOO ,  Byung Hoon KANG ,  Jun Hyuk CHEON ,  Jeong-Hye CHOI ,  Young Ho JEONG ,  Woo Jin CHO

IPC: B24B37/34 ,  B24B53/017 ,  B24B37/10

CPC classification number: B24B37/345 ,  B24B37/10 ,  B24B53/017

Abstract: A substrate polishing system includes: a polishing machine and a substrate transporter. The polishing machine includes: a lower surface plate to which a substrate is mounted, and an upper surface plate which faces the lower surface plate and polishes the substrate in cooperation with the lower surface plate, the upper surface plate having a larger area than the substrate mounted on the lower surface plate. The substrate transporter is adjacent to the polishing machine and commonly transports the substrate to and from the polishing machine in a first direction, attaches the substrate to the lower surface plate before polishing thereof, and separates from the lower surface plate the substrate after polishing thereof.