CASE IN WHICH ELECTRICAL PARTS ARE ACCOMMODATED AND ELECTRONIC DEVICE HAVING THE SAME
    23.
    发明申请
    CASE IN WHICH ELECTRICAL PARTS ARE ACCOMMODATED AND ELECTRONIC DEVICE HAVING THE SAME 审中-公开
    其中电气部件是具有相同功能的电子设备

    公开(公告)号:US20160113136A1

    公开(公告)日:2016-04-21

    申请号:US14918663

    申请日:2015-10-21

    CPC classification number: G06F1/1656 G06F1/1626 G06F1/1635 H04M1/0214 H04M1/18

    Abstract: Provided is a case accommodating at least one electrical part and including: a first panel and a second panel coupled to each other, a space between the first and the second panels accommodating the at least one electrical part; a first facing surface provided along surrounding edges of an area, the area being exposed when the second panel is separated from the first panel; a second facing surface corresponding to the first facing surface and provided on the second panel; and hydrophobic pattern formed on at least one of the first and the second facing surfaces.

    Abstract translation: 提供容纳至少一个电气部件的壳体,包括:彼此联接的第一面板和第二面板,容纳至少一个电气部件的第一和第二面板之间的空间; 沿着区域的周围边缘设置的第一面向表面,当所述第二面板与所述第一面板分离时,所述区域被暴露; 与所述第一面对面对应的第二面对面,设置在所述第二面板上; 以及形成在第一和第二相对表面中的至少一个上的疏水性图案。

    METHOD OF MANUFACTURING MASTER MOLD
    28.
    发明申请
    METHOD OF MANUFACTURING MASTER MOLD 有权
    制造主模的方法

    公开(公告)号:US20150314488A1

    公开(公告)日:2015-11-05

    申请号:US14557712

    申请日:2014-12-02

    Abstract: A method of manufacturing a master mold includes forming a plurality of replica resin layers using a mold; forming a replica template by bonding the plurality of replica resin layers on a template; forming a replica mold layer having a pattern corresponding to a pattern of the plurality of replica resin layers using the replica template; forming a flexible stamp having a pattern formed on a surface thereof using the replica mold layer; transferring the pattern formed on the surface of the flexible stamp to a mold resin; and forming a large area master mold by etching a surface of a substrate based on a pattern shape of the mold resin.

    Abstract translation: 制造母模的方法包括使用模具形成多个复制树脂层; 通过将多个复制树脂层粘合在模板上来形成复制模板; 使用复制模板形成具有与多个复制树脂层的图案对应的图案的复制模具层; 使用复制模具层形成具有在其表面上形成的图案的柔性印模; 将形成在柔性印模的表面上的图案转印到模制树脂上; 并且通过基于模制树脂的图案形状蚀刻基板的表面来形成大面积的母模。

    SEMICONDUCTOR CHIP DESIGN METHOD AND COMPUTING DEVICE FOR PERFORMING THE SAME

    公开(公告)号:US20220012403A1

    公开(公告)日:2022-01-13

    申请号:US17171267

    申请日:2021-02-09

    Inventor: Sunghoon LEE

    Abstract: A method of designing a semiconductor chip includes: acquiring first data including information about arrangement of a plurality of cells on the semiconductor chip; acquiring second data including information about routing between the plurality of cells and power and signal lines; and outputting a verification result by detecting an error of arrangement of the plurality of cells based on matching of the first data and the second data.

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