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    MULTILAYER CERAMIC CAPACITOR AND METHOD FOR MANUFACTURING THE SAME
    22.
    发明申请
    MULTILAYER CERAMIC CAPACITOR AND METHOD FOR MANUFACTURING THE SAME 审中-公开

    公开(公告)号：US20180096791A1

    公开(公告)日：2018-04-05

    申请号：US15723222

    申请日：2017-10-03

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Yasuhiro NISHISAKA ,  Akito MORI

    IPC: H01G4/232 ,  H01G4/012 ,  H01G4/33

    CPC classification number: H01G4/2325 ,  H01G4/012 ,  H01G4/12 ,  H01G4/232 ,  H01G4/248 ,  H01G4/30 ,  H01G4/33

    Abstract: A multilayer ceramic capacitor includes a laminate in which dielectric layers and internal electrodes are alternately stacked, and a pair of external electrodes provided on the corresponding surfaces of the laminate. The laminate includes first and second principal surfaces facing each other in its thickness direction, first and second end surfaces facing each other in its lengthwise direction, and first and second side surfaces facing each other in its width direction. The external electrodes each include a metal layer covering the internal electrodes extended to the corresponding one of the end surfaces, a baked layer including glass and metal covering the metal layer, and a plated film covering the baked layer.

    MULTILAYER CERAMIC CAPACITOR
    24.
    发明申请
    MULTILAYER CERAMIC CAPACITOR 有权
    多层陶瓷电容器

    公开(公告)号：US20170018361A1

    公开(公告)日：2017-01-19

    申请号：US15191990

    申请日：2016-06-24

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Yasuhiro NISHISAKA

    IPC: H01G4/30 ,  H01G4/12 ,  H01G4/008 ,  H01G4/248

    CPC classification number: H01G4/2325 ,  H01G4/008 ,  H01G4/12 ,  H01G4/232 ,  H01G4/30

    Abstract: In a multilayer ceramic capacitor, each outer electrode includes a first outer electrode layer that contains Ni and that is disposed on each main surface of a multilayer body and a second outer electrode layer that contains a glass component and Cu and that covers one end portion of the first outer electrode layer which is closer to an end surface of the multilayer body, the first and second outer electrode layers are joined together in a region including an edge shared by the main surface and the end surface, the other end portion of the first outer electrode layer is exposed from the second outer electrode layer, and Ni of the first outer electrode layer is diffused in the second outer electrode layer and is dissolved in Cu of the second outer electrode layer to define a solid solution in the region including the edge.

    Abstract translation: 在多层陶瓷电容器中，每个外电极包括含有Ni的第一外电极层，其设置在多层体的每个主表面上，第二外电极层包含玻璃成分和Cu，并覆盖一部分 所述第一外电极层更靠近所述多层体的端面，所述第一外电极层和所述第二外电极层在包括由所述主表面和所述端面共有的边缘的区域中接合在一起，所述第一外电极层的所述第一外电极层的所述第一外电极层的所述第一外电极层 外电极层从第二外电极层露出，第一外电极层的Ni扩散到第二外电极层中，并溶解在第二外电极层的Cu中，以在包括边缘的区域中限定固溶体 。

    MULTILAYER CERAMIC CAPACITOR
    25.
    发明申请
    MULTILAYER CERAMIC CAPACITOR 有权
    多层陶瓷电容器

    公开(公告)号：US20160093440A1

    公开(公告)日：2016-03-31

    申请号：US14867270

    申请日：2015-09-28

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Yasuhiro NISHISAKA ,  Takehisa SASABAYASHI ,  Satoshi MURAMATSU

    IPC: H01G4/232 ,  H01G4/30 ,  H01G4/012 ,  H01G4/12

    CPC classification number: H01G4/248 ,  H01G4/12 ,  H01G4/2325 ,  H01G4/30

    Abstract: A multilayer ceramic capacitor includes an external electrode that is unlikely to be peeled. First and second external electrodes each include base layers provided over a ceramic body and including a metal and glass, and Cu plated layers provided over the base layers. The multilayer ceramic capacitor includes a reactive layer. The reactive layer contains about 5 atomic % to about 15 atomic % of Ti, about 5 atomic % to about 15 atomic % of Si, and about 2 atomic % to about 10 atomic % of V.

    Abstract translation: 多层陶瓷电容器包括不可能剥离的外部电极。 第一外部电极和第二外部电极各自包括设置在陶瓷体上并包括金属和玻璃的基底层，以及设置在基底层上的Cu镀层。 多层陶瓷电容器包括反应层。 反应层含有约5原子％至约15原子％的Ti，约5原子％至约15原子％的Si和约2原子％至约10原子％的V.

    ELECTRONIC COMPONENT
    27.
    发明公开
    ELECTRONIC COMPONENT 审中-公开

    公开(公告)号：US20240105386A1

    公开(公告)日：2024-03-28

    申请号：US18534790

    申请日：2023-12-11

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Mitsuru IKEDA ,  Yasuhiro NISHISAKA

    IPC: H01G2/06 ,  H01G4/008 ,  H01G4/12 ,  H01G4/232 ,  H01G4/248 ,  H01G4/30

    CPC classification number: H01G2/06 ,  H01G4/008 ,  H01G4/1227 ,  H01G4/2325 ,  H01G4/248 ,  H01G4/30

    Abstract: An electronic component includes an electronic element and an interposer board. The electronic element includes a multilayer body and external electrodes at multilayer body end surfaces of the multilayer body and connected to internal electrode layers. The interposer board includes board end surfaces, board side surfaces orthogonal to the board end surfaces, and board main surfaces orthogonal to the board end surfaces and the board side surfaces. One of the board main surfaces is located in a vicinity of the electronic element and joined with one of the multilayer body main surfaces in a vicinity of the interposer board. The interposer board is an alumina board. The board end surfaces include a metal layer including a Pd-containing layer, and an electrolessly-plated layer on an outer periphery of the Pd-containing layer.

    ELECTRONIC COMPONENT
    29.
    发明申请
    ELECTRONIC COMPONENT 有权

    公开(公告)号：US20220013294A1

    公开(公告)日：2022-01-13

    申请号：US17366140

    申请日：2021-07-02

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Yasuhiro NISHISAKA ,  Mitsuru IKEDA

    IPC: H01G4/30 ,  H01G4/12 ,  H01G4/012 ,  H01G4/008

    Abstract: An electronic component includes a multilayer body including a multilayer main body and side gap portions, the multilayer main body including an inner layer portion including alternatively laminated dielectric layers and internal nickel electrode layers, and including end surfaces in a length direction. The internal nickel electrode layers are exposed at the end surfaces. The side gap portions are on both sides of the multilayer main body in a width direction. External nickel layers are on the end surfaces of the multilayer body. A deviation amount in the width direction between ends of two adjacent internal nickel electrode layers on both side surfaces is within about 0.5 μm. The external nickel layers are on the end surface of the multilayer body, in a region other than a region including a rounded ridge portion. A thermosetting resin layer including metal filler is outside the external nickel layer.

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