HEAT SINK FOR OPTICAL MODULE
    21.
    发明公开

    公开(公告)号:US20230258891A1

    公开(公告)日:2023-08-17

    申请号:US18309078

    申请日:2023-04-28

    CPC classification number: G02B6/4269 G02B6/4261 H05K7/20409

    Abstract: In one embodiment, an apparatus includes an optical module, and a heat sink for attachment to an optical module cage configured for receiving the optical module, the heat sink having a surface in which recesses are formed. The optical module includes a thermal interface material attached to a surface of the optical module for thermal contact with the heat sink, and lifting elements extending from the surface. The lifting elements are configured to create a gap between the thermal interface material and the heat sink during insertion of the optical module into the optical module cage or removal of the optical module from the optical module cage, and are positioned for insertion into aligned recesses in the heat sink when the optical module is fully inserted into the optical module cage to eliminate the gap and provide contact between the heat sink and the thermal interface material.

    Heat sink for optical module
    22.
    发明授权

    公开(公告)号:US11678466B2

    公开(公告)日:2023-06-13

    申请号:US17329043

    申请日:2021-05-24

    CPC classification number: H05K7/2039 H01R13/516 G02B6/4269

    Abstract: In one embodiment, an apparatus includes a heat sink for attachment to an optical module cage configured for receiving an optical module, a thermal interface material attached to a surface of the heat sink for thermal contact with the optical module, and a plurality of lifting elements extending from the surface of the heat sink. The lifting elements are configured to create a gap between the thermal interface material and the optical module during insertion of the optical module into the optical module cage or removal of the optical module from the optical module cage, the plurality of lifting elements positioned for insertion into aligned recesses in the optical module when the optical module is fully inserted into the optical module cage to eliminate the gap and provide contact between the optical module and the thermal interface material.

    TEMPERATURE INDICATOR FOR OPTICAL MODULE

    公开(公告)号:US20220262213A1

    公开(公告)日:2022-08-18

    申请号:US17733612

    申请日:2022-04-29

    Abstract: An optical module includes a housing with a first end and a handle extending from the second end. A temperature indicator on the handle is thermally coupled to the housing to improve correlation with an optical module surface temperature. The temperature indicator provides an indication that the optical module surface temperature of the housing exceeds a predefined temperature limit.

    FRONT ACCESSIBLE FAN TRAY WITH FRONT-TO-BACK COOLING IN A MODULAR ELECTRONIC SYSTEM

    公开(公告)号:US20210153387A1

    公开(公告)日:2021-05-20

    申请号:US17157574

    申请日:2021-01-25

    Inventor: Rohit Dev Gupta

    Abstract: In one embodiment, an apparatus includes a fan tray comprising a plurality of fans for cooling modules within a modular electronic system with airflow from a front of the modular electronic system to a back of the modular electronic system, and a hinge member for connecting the fan tray to a front panel of the modular electronic system with the fans positioned in front of the modules. The fan tray is rotatable on the hinge member for movement away from the front panel to allow for replacement of one of the modules.

    ELECTRONIC COOLING FAN WITH AIRFLOW RECIRCULATION PREVENTION DURING FAN FAILURE

    公开(公告)号:US20200154600A1

    公开(公告)日:2020-05-14

    申请号:US16184550

    申请日:2018-11-08

    Abstract: In one embodiment, an apparatus includes a fan for cooling electronics within a chassis, the fan comprising a rotor with a plurality of fan blades connected thereto for generating an axial airflow during operation of the fan, a sensor for detecting failure of the fan, and an airflow blocking device positioned at an exhaust side of the fan and configured to prevent airflow through the fan upon detection of the fan failure, wherein the airflow blocking device is stowed in a position removed from a path of the axial airflow generated by the fan during operation of the fan. A method for preventing airflow recirculation at a failed fan is also disclosed herein.

    Configurable module guides for modular electronic system

    公开(公告)号:US10470335B2

    公开(公告)日:2019-11-05

    申请号:US16022470

    申请日:2018-06-28

    Abstract: In one embodiment, an apparatus includes a frame comprising a top wall, a bottom wall, and sides defining an opening for receiving a plurality of removable electronic modules, a guide slidably insertable into the frame to partition an upper or lower portion of the opening when inserted into the frame, wherein the guide comprises a first edge for slidable engagement with the top wall or the bottom wall, and a lead screw extending from an opening in the guide spaced from a front end of the guide, to a back end of the guide for connecting the guide to the frame.

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