ARRAY SUBSTRATE AND MANUFACTURE METHOD THEREOF, DISPLAY PANEL AND DISPLAY DEVICE

    公开(公告)号:US20190361301A1

    公开(公告)日:2019-11-28

    申请号:US15757492

    申请日:2017-08-02

    Abstract: An array substrate and a manufacture method thereof, a display panel and a display device. The array substrate includes pixel units. Each pixel unit includes a pixel electrode and a common electrode, which are respectively includes first pixel electrode strips and first common electrode strips that are arranged substantially in parallel in parallel in a first direction, each first common electrode strip overlaps at least one first pixel electrode strip. Each pixel unit includes at least one pixel unit sub-area, which has a sub-area symmetry axis, the first pixel electrode strip and the first common electrode strip are respectively arranged with respect to the sub-area symmetry axis symmetrically. On either side of the sub-area symmetry axis, the first common electrode strip is farther away from or closer to the sub-area symmetry axis than the at least one first pixel electrode strip that the each first common electrode strip overlaps.

    ARRAY SUBSTRATE, DISPLAY PANEL AND DISPLAY DEVICE

    公开(公告)号:US20190067330A1

    公开(公告)日:2019-02-28

    申请号:US16004978

    申请日:2018-06-11

    CPC classification number: H01L27/124 H01L27/1218

    Abstract: The disclosure discloses an array substrate, a display panel and a display device. The array substrate includes a peripheral circuit area in which a plurality of first wire grooves, a plurality of second wire grooves, a plurality of first lead wires and a plurality of second lead wires are arranged, wherein each first lead wire is arranged corresponding to one of the first wire grooves, and laid out on a bottom and sidewalls of a corresponding first wire groove; and each second lead wire is arranged corresponding to one of the second wire grooves, and a plurality of recesses and protrusions are arranged alternately on a bottom surface of each second wire groove along an extension direction of the each second wire groove, wherein each second lead wire is laid out on surfaces of recesses and protrusions on a bottom surface of a corresponding second wire groove.

    ARRAY SUBSTRATE, MANUFACTURING METHOD THEREOF AND DISPLAY DEVICE

    公开(公告)号:US20170115534A1

    公开(公告)日:2017-04-27

    申请号:US15253003

    申请日:2016-08-31

    Abstract: An array substrate, a manufacturing method thereof and a display device are provided. The array substrate includes a pattern of pixel electrodes and a pattern of common electrodes. The pattern of pixel electrodes includes a plurality of strip-like pixel electrodes. The pattern of common electrodes includes a plurality of strip-like common electrodes. Projection of one of every two adjacent pixel electrodes on the substrate is located between projections of two adjacent common electrodes on the substrate, and projection of the other pixel electrode of the every two adjacent pixel electrodes on the substrate is located within projection of one of the two adjacent common electrodes on the substrate.

    STROBE DRIVING CIRCUIT, STROBE DRIVING METHOD, ARRAY SUBSTRATE AND DISPLAY APPARATUS
    29.
    发明申请
    STROBE DRIVING CIRCUIT, STROBE DRIVING METHOD, ARRAY SUBSTRATE AND DISPLAY APPARATUS 有权
    结构驱动电路,结构驱动方法,阵列基板和显示设备

    公开(公告)号:US20160035270A1

    公开(公告)日:2016-02-04

    申请号:US14589058

    申请日:2015-01-05

    CPC classification number: G09G3/3677 G09G3/3266 G09G2310/0267

    Abstract: There are provided with a strobe driving circuit, a strobe driving method, an array substrate and a display apparatus. The strobe driving circuit includes: a first driving unit for receiving a timing control signal, generating a first strobe driving signal based on the power signal under the control of the timing control signal; a first energy storing unit, storing energy based on the first strobe driving signal; a second driving unit connected to the first energy storing unit, for generating a second strobe driving signal based on the energy stored by the first energy storing unit under the control of the timing control signal. In the technical solution according to the embodiments of the application, the number of required bonding pads is reduced, so that the complexity of semiconductor manufacturing process and the difficulty of the manufacturing procedure are reduced.

    Abstract translation: 设置有选通驱动电路,选通驱动方法,阵列基板和显示装置。 选通驱动电路包括:第一驱动单元,用于接收定时控制信号,在定时控制信号的控制下,基于功率信号产生第一选通脉冲驱动信号; 第一能量存储单元,基于第一选通驱动信号存储能量; 连接到第一能量存储单元的第二驱动单元,用于在定时控制信号的控制下,基于由第一能量存储单元存储的能量产生第二选通脉冲驱动信号。 在根据本申请的实施例的技术方案中,减少了所需的接合焊盘的数量,从而减小了半导体制造工艺的复杂性和制造过程的难度。

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