公开(公告)号：US20210036196A1

公开(公告)日：2021-02-04

申请号：US16920401

申请日：2020-07-02

Applicant: BOE Technology Group Co., Ltd.

Inventor： Zhiwei LIANG ,  Wenqian LUO ,  Yingwei LIU ,  Ke WANG ,  Shengguang BAN ,  Zhanfeng CAO

IPC: H01L33/62 ,  H01L23/00

Abstract: A preparation method of a backplane includes: forming an insulating structure layer having a groove on a base substrate by a mask exposure process, the groove being used for accommodating a metal trace; and repeating a metal sub-layer forming step including an ashing process and a wet etching process multiple times to form the metal trace positioned in the groove.

公开(公告)号：US20200235127A1

公开(公告)日：2020-07-23

申请号：US16682395

申请日：2019-11-13

Applicant: BOE Technology Group Co., Ltd.

Inventor： Haixu LI ,  Zhanfeng CAO ,  Ke WANG

IPC: H01L27/12 ,  H01L25/075

Abstract: A micro LED display panel and a method for fabricating the same are disclosed, and the micro LED display panel includes a TFT back panel, and a micro LED fixed on the TFT back panel, wherein the TFT back panel includes a substrate, and a first insulation layer and a second insulation layer stacked over the substrate in that order, wherein the first insulation layer includes a groove filled with the second insulation layer, and a normal projection of the groove onto the substrate does not overlap with a normal projection of a TFT area in the TFT back panel onto the substrate, wherein the rigidity of the second insulation layer is lower than the rigidity of the first insulation layer.

公开(公告)号：US20190267409A1

公开(公告)日：2019-08-29

申请号：US16302850

申请日：2018-03-13

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Hehe HU ,  Wei YANG ,  Xinhong LU ,  Ke WANG ,  Yu WEN

IPC: H01L27/12 ,  H01L29/786 ,  H01L29/66

Abstract: Embodiment of the present disclosure provide a thin-film transistor structure, a manufacturing method thereof, a display panel and a display device. The thin-film transistor structure includes: a base substrate; and a first thin-film transistor and a second thin-film transistor formed on the base substrate, wherein a first active layer of the first thin-film transistor is doped with hydrogen; a material of a second active layer of the second thin-film transistor is metal oxide; and a first isolation barrier surrounding the first thin-film transistor and/or a second isolation barrier surrounding the second thin-film transistor are disposed on the base substrate.

公开(公告)号：US20180374954A1

公开(公告)日：2018-12-27

申请号：US15737031

申请日：2017-06-16

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Wei YANG ,  Ce NING ,  Hehe HU ,  Ke WANG

IPC: H01L29/786 ,  H01L29/66 ,  H01L29/417 ,  H01L29/423 ,  H01L21/027

Abstract: The present disclosure provides a thin film transistor, a method for fabricating the same, a display substrate, and a display apparatus, and belongs to the field of display technology. The method includes: forming a metal oxide semiconductor pattern comprising first and second metal oxide semiconductor layers, the second metal oxide semiconductor layer being above the first metal oxide semiconductor layer; depositing a source-drain metal layer on the metal oxide semiconductor pattern; etching the source-drain metal layer and the second metal oxide semiconductor layer to form source and drain electrodes and an active layer of the thin film transistor. The active layer is obtained after removing the second metal oxide semiconductor layer between the source and drain electrodes using a first etchant, and the first etchant has a higher etching rate on the second metal oxide semiconductor layer than on the first metal oxide semiconductor layer.

公开(公告)号：US20250143112A1

公开(公告)日：2025-05-01

申请号：US18692796

申请日：2023-07-31

Applicant: BOE Technology Group Co., Ltd.

Inventor： Dapeng XUE ,  Yingwei LIU ,  Ke WANG ,  Zhanfeng CAO

IPC: H10K59/131 ,  H10K59/12

Abstract: Disclosed are a display substrate. The display substrate of the present disclosure includes a base substrate, a pixel drive circuit, and a connection structure. The base substrate is provided with a connection via hole penetrating in a thickness direction of the base substrate, and the base substrate includes a first surface and a second surface disposed oppositely along the thickness direction of the base substrate; the pixel drive circuit is disposed on the first surface; the signal wiring is disposed on the second surface; and the connection structure is disposed in the connection via hole and electrically connects the signal wiring with the pixel drive circuit. The connection via hole is partially filled by the connection structure.

公开(公告)号：US20250096763A1

公开(公告)日：2025-03-20

申请号：US18576747

申请日：2022-08-25

Applicant: BOE Technology Group Co., Ltd.

Inventor： Yingwei LIU ,  Zhonglan ZHAO ,  Zhanfeng CAO ,  Ke WANG

IPC: H03H1/00 ,  H03H3/00 ,  H03H7/01

Abstract: A filter, a manufacturing method therefor, and an electronic device are provided. The filter includes a first substrate and a second substrate disposed opposite to each other, and a connection substrate disposed therebetween, wherein at least one first substrate electrode is disposed on the first substrate, at least one second substrate electrode is disposed on the second substrate, the connection substrate comprises, at least, a connection base substrate and at least one conductive post penetrating the connection base substrate in a thickness direction, an end of the conductive post close to the first substrate is provided with a first bump structure, an end of the conductive post close to the second substrate is provided with a second bump structure, and the first bump structure is connected with the first substrate electrode, the second bump structure is connected with the second substrate electrode, both in a bonding manner.

公开(公告)号：US20240063360A1

公开(公告)日：2024-02-22

申请号：US18501939

申请日：2023-11-03

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Ke WANG

IPC: H01L33/62 ,  G09G3/32 ,  H01L25/075 ,  H01L33/38

CPC classification number: H01L33/62 ,  G09G3/32 ,  H01L25/0753 ,  H01L33/387 ,  H01L33/0066

Abstract: A drive circuit substrate, LED display panel and method of forming the same and display device are provided, in field of display technologies. The drive circuit substrate includes a base substrate and drive electrodes arranged in an array on a surface of the base substrate, where at least one conductive structure is arranged on a surface of each drive electrode away from the base substrate, the conductive structure is electrically connected to corresponding drive electrode. The driving electrodes include first and second driving electrodes, horizontal height of first driving electrode is greater than horizontal height of second driving electrode. The conductive structure includes first conductive structure on a surface of the first driving electrode away from the base substrate and second conductive structure on a surface of the second driving electrode away from the base substrate, height of second conductive structure is greater than height of first conductive structure.

公开(公告)号：US20230097502A1

公开(公告)日：2023-03-30

申请号：US16982217

申请日：2019-12-19

Applicant: BOE Technology Group Co., Ltd.

Inventor： Zhiwei LIANG ,  Yingwei LIU ,  Zhijun LV ,  Ke WANG ,  Zhanfeng CAO ,  Hsuanwei MAI ,  Guangcai YUAN ,  Muxin DI

IPC: H01L33/62 ,  H01L25/075 ,  H01L23/00

Abstract: A display backboard and a manufacturing method thereof, and a display device are provided. The display backboard includes: a driving substrate; a plurality of driving electrodes on the driving substrate; and a plurality of connection structures respectively on the plurality of driving electrodes. The connection structure includes: at least one conductive component on the driving electrode; and a restriction component on a side of the driving electrodes provided with the at least one conductive component and in at least a part of a peripheral region of the at least one conductive component. The restriction component protrudes from the driving electrode and has a first height in a direction perpendicular to the driving substrate.

公开(公告)号：US20230071948A1

公开(公告)日：2023-03-09

申请号：US17984469

申请日：2022-11-10

Applicant: BOE Technology Group Co., Ltd.

Inventor： Liang CHEN ,  Minghua XUAN ,  Dongni LIU ,  Haoliang ZHENG ,  Li XIAO ,  Zhenyu ZHANG ,  Hao CHEN ,  Ke WANG

IPC: G02F1/1362 ,  H01L27/32

Abstract: The present disclosure discloses a display panel and a display device. The display panel includes: a base substrate, including a plurality of substrate via holes located in a display area of the display panel; and a plurality of driving signal lines and a plurality of bonding terminals, respectively located on different sides of the base substrate. At least one of the plurality of driving signal lines is electrically connected to at least one of the plurality of bonding terminals through the substrate via hole(s).

公开(公告)号：US20220406749A1

公开(公告)日：2022-12-22

申请号：US17638703

申请日：2020-02-28

Applicant: BOE Technology Group Co., Ltd.

Inventor： Zhanfeng CAO ,  Jiushi WANG ,  Ke WANG ,  Guocai ZHANG ,  Junwei YAN ,  Yingwei LIU ,  Haitao HUANG ,  Guangcai YUAN

IPC: H01L23/00 ,  H01L33/62 ,  H01L25/075 ,  H01L25/16

Abstract: Disclosed are an electrical connection method for an electronic element, and a backlight module, a display panel, and a display apparatus which include an electronic element to which the electrical connection method is applied. The electrical connection method comprises: providing a driving back plane, wherein the driving back plane comprises multiple contact electrodes; forming an anti-oxidation protection film on the contact electrodes; coating a position of the anti-oxidation protection film corresponding to each contact electrode with a binding material; and transferring multiple electronic elements to the positions of the corresponding contact electrodes, binding each electronic element to the corresponding contact electrode, and removing the anti-oxidation protection film at the position of each contact electrode before completing the binding of each electronic element to the corresponding contact electrode.