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公开(公告)号：US20180301524A1
公开(公告)日：2018-10-18
申请号：US15841573
申请日：2017-12-14
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Chengyuan LUO , Chang Yen WU , Wei WANG
CPC classification number: H01L27/3297 , H01L27/32 , H01L27/3253 , H01L27/3276 , H01L27/3288 , H01L33/48
Abstract: A display panel includes a first substrate, a second substrate, an OLED device, a first connection structure and a second connection structure. The second substrate is arranged opposite to the first substrate and includes a display area and a peripheral area. The OLED device is arranged between the second substrate and the first substrate. The first connection structure is arranged between the second substrate and the first substrate and is connected with the second substrate and the first substrate, and the first connection structure is located at the peripheral area to surround the OLED device. The second connection structure is arranged between the second substrate and the first substrate and is connected with the second substrate and the first substrate, and the second connection structure is located at the peripheral area and is far away from the display area than the first connection structure.
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公开(公告)号：US20170194594A1
公开(公告)日：2017-07-06
申请号：US15309511
申请日：2016-02-23
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Chengyuan LUO
CPC classification number: H01L51/525 , H01L51/0097 , H01L51/5253 , H01L51/56 , H01L2251/5338
Abstract: The present disclosure provides a packaging assembly and a manufacturing method thereof. The packaging assembly comprising a first substrate, a second substrate arranged opposite to the first substrate, an electronic device located between the first substrate and the second substrate, a protective layer covering the electronic device, and a bonding layer for bonding the first substrate and the second substrate so as to realize surface-to-surface packaging. The packaging assembly further comprising an isolation layer located between the bonding layer and the protective layer and adhered to both them, wherein an adhesion force between the material for forming the isolation layer and that for forming the bonding layer is smaller than an adhesion force between the material for forming the protective layer and that for forming the bonding layer.
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公开(公告)号：US20250095547A1
公开(公告)日：2025-03-20
申请号：US18576548
申请日：2022-12-23
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Ying HAN , Pan XU , Xing ZHANG , Chengyuan LUO , Guangshuang LV , Donghui ZHAO , Cheng XU
IPC: G09G3/32 , G09G3/3233
Abstract: Provided are a display substrate and a display device. The display substrate includes a base substrate and a plurality of sub-pixels, the sub-pixel includes a pixel circuit and a light-emitting element, the pixel circuit is configured to drive the light-emitting element, and the light-emitting element includes a first electrode, a second electrode, and a light-emitting functional layer located therebetween; the pixel circuit includes a driving transistor, and the first electrode of the light-emitting element is electrically connected to a first electrode of the driving transistor; the plurality of sub-pixels include a first sub-pixel and a second sub-pixel, the first sub-pixel is adjacent to the second sub-pixel, and an orthographic projection of the first electrode of the light-emitting element of the first sub-pixel on the base substrate does not overlap an orthographic projection of the pixel circuit of the second sub-pixel on the base substrate.
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公开(公告)号：US20240428731A1
公开(公告)日：2024-12-26
申请号：US18288451
申请日：2023-01-03
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Ying HAN , Pan XU , Mingi CHU , Donghui ZHAO , Xing ZHANG , Chengyuan LUO , Guangshuang LV , Miao LIU , Xing YAO
IPC: G09G3/3233 , G09G3/3266 , G09G3/3291
Abstract: A pixel driving circuit is provided to include: a driving transistor; a data writing circuit configured to write a display data voltage from the data line to a first node in a display driving process, and sequentially write a sensing data voltage and a reset data voltage from the data line to the first node in a threshold voltage sensing process; a threshold compensation circuit configured to write a reference voltage from a reference voltage supply terminal to the first node and write a first compensation voltage to a second node in the display driving process, and write a second compensation voltage to the second node when a voltage at the first node changes from the reference voltage to the display data voltage; a sensing circuit configured to write an initialization voltage from the sensing line to the second node in the threshold voltage sensing process; a light emitting element.
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公开(公告)号：US20220271108A1
公开(公告)日：2022-08-25
申请号：US17512645
申请日：2021-10-27
Applicant: BOE Technology Group Co., Ltd.
Inventor： Chengyuan LUO
Abstract: A display substrate, an ink jet printing method and a display apparatus are provided. The display substrate includes a base substrate and a pixel define layer disposed on the base substrate, wherein the pixel define layer includes first define layers and a second define layer, a printing region is formed on the base substrate between the first define layers, and the second define layer is disposed on the printing region and divides the printing region into at least two sub-pixel regions, and a height of the first define layers is greater than that of the second define layer in a direction perpendicular to the base substrate.
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Patent Agency Ranking
26.发明申请公开(公告)号：US20220231255A1
公开(公告)日：2022-07-21
申请号：US17715270
申请日：2022-04-07
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Li SUN , Wenjun HOU , Chengyuan LUO
Abstract: A substrate and a preparation method thereof, a display panel and a preparation method thereof, and a display device are provided. The substrate includes a display region and a peripheral region positioned in a periphery of the display region and used for sealing, the substrate includes: a base substrate; an insulating layer, arranged on a side of the base substrate and positioned in the display region and the peripheral region for sealing; and a plurality of pixel units, positioned on the insulating layer corresponding to the display region, and in the peripheral region, at least one groove is disposed on a side of the insulating layer which faces away from the base substrate, a side of the groove which is away from the base substrate is open, and a depth direction of the groove is perpendicular to the base substrate.
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公开(公告)号：US20210367208A1
公开(公告)日：2021-11-25
申请号：US17043881
申请日：2020-04-14
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Chengyuan LUO
Abstract: An electroluminescent device, includes: a base substrate; a light emitting unit provided on the base substrate; a first accommodating structure surrounding the light emitting unit and provided on the base substrate; a first color rendering material filled in the first accommodating structure; a first inorganic thin film encapsulation layer covering the light emitting unit and the first color rendering material; a second accommodating structure provided on one side of the first inorganic thin film encapsulation layer distal to the first color rendering material; a second color rendering material filled in the second accommodating structure; and a second inorganic thin film encapsulation layer sealing the second color rendering material in the second accommodating structure; wherein the first color rendering material and the second color rendering material are capable of producing a color development reaction after mixture.
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公开(公告)号：US20210351372A1
公开(公告)日：2021-11-11
申请号：US17271579
申请日：2020-05-20
Applicant: BOE Technology Group Co., Ltd.
Inventor： Chengyuan LUO
Abstract: Disclosed in embodiments of the present disclosure are an OLED packaging structure and packaging method, and a display apparatus. The purpose that the packaging structure does not influence the display performance of an OLED device, while ensuring a uniform cell gap between a display substrate and a packaging cover plate is achieved. The main technical solution of the present disclosure is: a packaging cover plate, wherein a sealant layer is arranged on the edge of a first surface of the packaging cover plate opposite to a display substrate in an annular configuration, a region encircled by the sealant layer is filled with a filling adhesive layer, a plurality of support blocks having preset flexibility are distributed in a region corresponding to the sealant layer, and the thickness of the support block is equal to a preset distance between the packaging cover plate and the display substrate.
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公开(公告)号：US20210226149A1
公开(公告)日：2021-07-22
申请号：US16646477
申请日：2019-07-24
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Chengyuan LUO , Huaiting SHIH
Abstract: A packaging substrate, an packaging method and a pressing mould for the packaging method are disclosed. The packaging substrate includes a cover plate and a substrate which are oppositely arranged; a sealed member positioned between the cover plate and the substrate; a connecting part connecting the cover plate and the substrate and positioned at the periphery of the sealed member; and an inorganic layer located outside the connection part and between the cover plate and the substrate. At least a part of the inorganic layer is formed on the outer side surface of the connection part, and an orthographic projection of the inorganic layer on the substrate is located outside an orthographic projection of the sealed member on the substrate.
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30.发明申请公开(公告)号：US20180315958A1
公开(公告)日：2018-11-01
申请号：US15816896
申请日：2017-11-17
Applicant: BOE Technology Group Co., Ltd.
Inventor： Chang Yen WU , Wei QUAN , Chengyuan LUO , Juanjuan YOU
Abstract: An organic light emitting diode device, includes a substrate, and a first electrode, an organic layer and a second electrode successively arranged on the substrate, wherein the first electrode and the second electrode are both transparent electrodes; the organic light emitting diode device further includes a metal packaging layer, wherein the metal packaging layer is located on a side of the second electrode back to the first electrode, and a surface of the metal packaging layer facing the second electrode is a rough surface.
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