Abstract:
An apparatus comprises a fingerprint sensor having a set of capacitive elements configured for capacitively coupling to a user fingerprint. The fingerprint sensor may be disposed under a control button or display element of an electronic device, for example one or more of a control button and a display component. A responsive element is responsive to proximity of the user fingerprint, for example one or both of a first circuit responsive to motion of the control button, and a second circuit responsive to a coupling between the fingerprint and a surface of the display element. The fingerprint sensor is disposed closer to the fingerprint than the responsive element. The control button or display component may include an anisotropic dielectric material, for example sapphire.
Abstract:
Some embodiments include methods for correcting optical alignment of components in a camera module for a multifunction device. In some embodiments, components of a camera module for use in a multifunction device are assembled on a test station. Some embodiments include a method that includes capturing a single test image, calculating from the spatial frequency response data an optical tilt between the optical axis of a lens and an optical axis of the image sensor of the camera module, and mechanically adjusting an alignment of the lens and the optical axis of the image sensor of the camera module to reduce the optical tilt. In some embodiments, the capturing is performed using the components of the camera module, and the single test image contains visually encoded spatial frequency response data for characterizing the components of the camera module.
Abstract:
An apparatus comprises a fingerprint sensor having a set of capacitive elements configured for capacitively coupling to a user fingerprint. The fingerprint sensor may be disposed under a control button or display element of an electronic device, for example one or more of a control button and a display component. A responsive element is responsive to proximity of the user fingerprint, for example one or both of a first circuit responsive to motion of the control button, and a second circuit responsive to a coupling between the fingerprint and a surface of the display element. The fingerprint sensor is disposed closer to the fingerprint than the responsive element. The control button or display component may include an anisotropic dielectric material, for example sapphire.
Abstract:
An apparatus comprises a fingerprint sensor having a set of capacitive elements configured for capacitively coupling to a user fingerprint. The fingerprint sensor may be disposed under a control button or display element of an electronic device, for example one or more of a control button and a display component. A responsive element is responsive to proximity of the user fingerprint, for example one or both of a first circuit responsive to motion of the control button, and a second circuit responsive to a coupling between the fingerprint and a surface of the display element. The fingerprint sensor is disposed closer to the fingerprint than the responsive element. The control button or display component may include an anisotropic dielectric material, for example sapphire.
Abstract:
Examples can provide extended-range high-speed interconnect by providing microcoax cables in a hybrid flexible circuit board, which can be referred to as a hybrid flex or microcoax flex. This hybrid flex can be used to convey signals an extended distance within an electronic device. Multiple signals can be conveyed using corresponding microcoax cables. The microcoax cables can include a center conductor, an insulating layer, and an outside shield layer. The cables can be held in position in the hybrid flex relative to each other by a polyimide or other insulative layer. Copper layers can be provided on either or both the top and bottom of the polyimide or other insulative layer. Additional conductors can be embedded in the polyimide other insulative layer to convey power and ground. The microcoax and other conductors can be soldered to a flexible circuit board or other substrate using jet soldering.
Abstract:
A hybrid sensor shift platform for an optical image stabilization (OIS) actuator mechanism in compact camera modules includes two or more substrates. A top substrate is composed of an organic material (e.g., a resin) to reduce mass, reduce magnetic interaction with permanent magnets, and improve reliability. One or more lower substrates of the hybrid sensor shift platform are ceramic substrates that provide the benefits of ceramics for connection to the image sensor. The organic substrate is connected via a solder bond process to the lower ceramic substrate(s). The connection between the substrates is reinforced with an under-fill of epoxy that surrounds the solder bonds, thus creating a full interface between the substrates within the overlap.
Abstract:
An apparatus comprises a fingerprint sensor having a set of capacitive elements configured for capacitively coupling to a user fingerprint. The fingerprint sensor may be disposed under a control button or display element of an electronic device, for example one or more of a control button and a display component. A responsive element is responsive to proximity of the user fingerprint, for example one or both of a first circuit responsive to motion of the control button, and a second circuit responsive to a coupling between the fingerprint and a surface of the display element. The fingerprint sensor is disposed closer to the fingerprint than the responsive element. The control button or display component may include an anisotropic dielectric material, for example sapphire.
Abstract:
An apparatus includes a substrate, a first conductive pad and a second conductive pad, both disposed on the substrate, an electrically conductive trace, and a fusible alloy layer. The electrically conductive trace is laid out between the first and second pads, and is configured to conduct electrical current between the first and second pads, and has a serpentine pattern having multiple bends. The fusible alloy layer is disposed on the first pad and over a portion of the trace including no more than a predefined number of the bends.
Abstract:
In some embodiments, a camera includes a lens assembly in a lens carrier, an image sensor for capturing a digital representation of light transiting the lens, and a voice coil motor. In some embodiments, the voice coil motor includes a spring suspension assembly for moveably mounting the lens carrier to an actuator base, a plurality of permanent magnets mounted to the actuator base through a magnet holder assembly and a focusing coil fixedly mounted to the lens carrier and mounted to the actuator base through the suspension assembly. In some embodiments, the permanent magnets each generate a magnetic field of a respective permanent magnet field strength, and the magnet holder assembly generates a holder magnetic field of a holder magnetic field strength.
Abstract:
A camera module includes a lens barrel holder and a substrate. The substrate may include a circuit board embedded in the substrate. The circuit board may include multiple electrical components mounted to a first side of the circuit board, where the electrical components are not exposed outside. The circuit board may also include multiple electrical connections on another side of the circuit board, an image sensor mounted to the electrical connections, and an upper opening in the circuit board for light to pass through. The substrate may include an upper opening configured to receive, at least partially inside the substrate, a lower portion of the lens barrel holder. The substrate may include a lower opening connected to the upper opening and configured to receive the image sensor. The lens barrel holder may include extensions, such as a flange or tabs, and an adhesive bond between the extensions and the substrate.