Abstract:
An organic light-emitting diode display may have thin-film transistor circuitry formed on a substrate. The display and substrate may have rounded corners. A pixel definition layer may be formed on the thin-film transistor circuitry. Openings in the pixel definition layer may be provided with emissive material overlapping respective anodes for organic light-emitting diodes. A cathode layer may cover the array of pixels. A ground power supply path may be used to distribute a ground voltage to the cathode layer. The ground power supply path may be formed from a metal layer that is shorted to the cathode layer using portions of a metal layer that forms anodes for the diodes, may be formed from a mesh shaped metal pattern, may have L-shaped path segments, may include laser-deposited metal on the cathode layer, and may have other structures that facilitate distribution of the ground power supply.
Abstract:
An organic light-emitting diode display may have thin-film transistor circuitry formed on a substrate. The display and substrate may have rounded corners. A pixel definition layer may be formed on the thin-film transistor circuitry. Openings in the pixel definition layer may be provided with emissive material overlapping respective anodes for organic light-emitting diodes. A cathode layer may cover the array of pixels. A ground power supply path may be used to distribute a ground voltage to the cathode layer. The ground power supply path may be formed from a metal layer that is shorted to the cathode layer using portions of a metal layer that forms anodes for the diodes, may be formed from a mesh shaped metal pattern, may have L-shaped path segments, may include laser-deposited metal on the cathode layer, and may have other structures that facilitate distribution of the ground power supply.
Abstract:
A display may have thin-film transistor (TFT) circuitry on a substrate. An array of organic light-emitting diodes may be formed on the thin-film transistor circuitry. The display may include inorganic brittle layers and organic and metal layers that are ductile and mechanically robust. To help prevent propagation of cracks and other defects along the edge of the display, the display may be provided with crack stop structures and crack detection circuitry. The crack detection circuitry may include one or more loops that are formed along the periphery of the display. The crack stop structures may include TFT/OLED structures formed in a staggered configuration. At least some of the brittle layers can be removed from the panel edge. An additional adhesion layer may also be formed directly on the substrate to help prevent inorganic layers from debonding from the surface of the substrate.
Abstract:
Displays such as organic light-emitting diode displays may be provided with touch sensing capabilities. A touch sensor may be formed from electrodes located on a thin-film encapsulation layer or one or more sides of a polarizer. A single-sided or double-sided touch sensor panel may be attached to the upper or lower surface of a polarizer. Control circuitry may be used to provide control signals to light-emitting diodes in the display using a grid of control lines. The control lines and transparent electrode structures such as indium tin oxide structures formed on a thin-film encapsulation layer or polarizer may be used as electrodes for a touch sensor. Displays may have active regions and inactive peripheral portions. The displays may have edge portions that are bent along a bend axis that is within the active region to form a borderless display. Virtual buttons may be formed on the bent edge portions.
Abstract:
Embodiments described herein generally take the form of methods and systems for identifying and/or reducing a parasitic capacitance variation in a capacitive integrated touch-sensing module that may arise from proximity to a nearby electronic display.