公开(公告)号：US20190289382A1

公开(公告)日：2019-09-19

申请号：US16430823

申请日：2019-06-04

Applicant: Apple Inc.

Inventor： Arun D. Chawan ,  Kurt Stiehl ,  Benjamin A. Cousins ,  Jonathan S. Aase ,  Yacine Azmi ,  Paul Choiniere ,  Scott W. Slabaugh

IPC: H04R1/10 ,  A45C11/24 ,  H02J7/02 ,  A45C13/02 ,  H04R1/28 ,  H04R1/34 ,  B65D25/02 ,  B65D43/16 ,  H04R1/02 ,  H04B1/3888 ,  H04B5/00 ,  A45C13/10 ,  A45C13/00 ,  H04R5/033 ,  A45C11/00 ,  H01R13/52 ,  H02J7/00 ,  H04R9/06 ,  H04R9/02

Abstract: An earbud includes a housing that includes a driver assembly positioned within the housing forming a front volume in front of the driver and a back volume behind the driver. An acoustic insert is positioned behind the driver assembly and attached to an interior surface of the housing such that it forms a bass channel that is routed from the back volume to a vent in the housing.

公开(公告)号：US09973845B2

公开(公告)日：2018-05-15

申请号：US15588400

申请日：2017-05-05

Applicant: Apple Inc.

Inventor： Arun D. Chawan ,  Kurt Stiehl ,  Benjamin A. Cousins ,  Jonathan S. Aase ,  Yacine Azmi ,  Paul Choiniere ,  Scott W. Slabaugh

IPC: H04R1/28 ,  H04R1/10 ,  H04R1/34 ,  A45C11/00 ,  A45C13/02 ,  A45C13/10 ,  A45C13/00 ,  H02J7/00 ,  H02J7/02

CPC classification number: H04R1/1016 ,  A45C11/00 ,  A45C11/24 ,  A45C13/005 ,  A45C13/02 ,  A45C13/1069 ,  A45C2011/001 ,  A45C2013/026 ,  B65D25/02 ,  B65D43/16 ,  F16B2001/0035 ,  H01R13/521 ,  H02J7/0044 ,  H02J7/0047 ,  H02J7/025 ,  H02J7/027 ,  H02J2007/0096 ,  H04B1/385 ,  H04B1/3888 ,  H04B5/0037 ,  H04M1/6033 ,  H04R1/02 ,  H04R1/1025 ,  H04R1/1041 ,  H04R1/1058 ,  H04R1/1075 ,  H04R1/2826 ,  H04R1/2857 ,  H04R1/345 ,  H04R5/033 ,  H04R9/025 ,  H04R9/06 ,  H04R2201/105 ,  H04R2420/07 ,  H04R2460/03 ,  H04R2460/09 ,  H04R2460/17

Abstract: An earbud includes a housing that includes a driver assembly positioned within the housing forming a front volume in front of the driver and a back volume behind the driver. An acoustic insert is positioned behind the driver assembly and attached to an interior surface of the housing such that it forms a bass channel that is routed from the back volume to a vent in the housing.

公开(公告)号：US09883281B2

公开(公告)日：2018-01-30

申请号：US15588400

申请日：2017-05-05

Applicant: Apple Inc.

Inventor： Arun D. Chawan ,  Kurt Stiehl ,  Benjamin A. Cousins ,  Jonathan S. Aase ,  Yacine Azmi ,  Paul Choiniere ,  Scott W. Slabaugh

IPC: H04R1/28 ,  H04R1/10 ,  H04R1/34 ,  A45C11/00 ,  A45C13/02 ,  A45C13/10 ,  A45C13/00 ,  H02J7/00 ,  H02J7/02

Abstract: An earbud includes a housing that includes a driver assembly positioned within the housing forming a front volume in front of the driver and a back volume behind the driver. An acoustic insert is positioned behind the driver assembly and attached to an interior surface of the housing such that it forms a bass channel that is routed from the back volume to a vent in the housing.

公开(公告)号：US20130251915A1

公开(公告)日：2013-09-26

申请号：US13901350

申请日：2013-05-23

Applicant: Apple Inc.

Inventor： Rimple Bhatia ,  Paul Choiniere ,  Michael S. Nashner

IPC: H05K13/00

CPC classification number: H05K13/0084 ,  B05D1/32 ,  B05D5/06 ,  B05D7/53 ,  G09F3/00 ,  G09F7/165 ,  H05K5/0243

Abstract: Techniques or processes for providing markings on products are disclosed. The markings provided on products can be textual and/or graphic. The techniques or processes can provide high resolution markings on surfaces that are flat or curved. In one embodiment, the products have housings and the markings are to be provided on the housings. For example, the housing for a particular product can include an outer housing surface and the markings can be provided on the outer housing surface. The markings can be formed using a ultra-violet (UV) curable material that can be selectively cured on a surface (e.g., housing surface) in places where markings, namely text and/or graphics, are to be provided.

Abstract translation: 公开了在产品上提供标记的技术或工艺。 产品上提供的标记可以是文字和/或图形。 这些技术或工艺可以在平坦或弯曲的表面上提供高分辨率的标记。 在一个实施例中，产品具有外壳，并且标记将设置在外壳上。 例如，用于特定产品的壳体可以包括外部壳体表面，并且标记可以设置在外部壳体表面上。 可以使用紫外线（UV）可固化材料形成标记，该材料可以在要提供标记即文本和/或图形的地方在表面（例如，外壳表面）上选择性固化。

公开(公告)号：US11026011B2

公开(公告)日：2021-06-01

申请号：US16882020

申请日：2020-05-22

Applicant: Apple Inc.

Inventor： Arun D. Chawan ,  Kurt Stiehl ,  Benjamin A. Cousins ,  Jonathan S. Aase ,  Yacine Azmi ,  Paul Choiniere ,  Scott W. Slabaugh

IPC: H04R1/10 ,  A45C11/00 ,  H04R5/033 ,  A45C13/02 ,  H02J50/10 ,  H02J7/00 ,  H04R1/28 ,  H04R1/34 ,  B65D25/02 ,  B65D43/16 ,  H04R1/02 ,  H04B1/3888 ,  H04B5/00 ,  A45C11/24 ,  A45C13/10 ,  H04R9/02 ,  H04R9/06 ,  H02J7/02 ,  H01R13/52 ,  A45C13/00 ,  H04B1/3827 ,  H04M1/60 ,  F16B1/00

Abstract: An earbud includes a housing that includes a driver assembly positioned within the housing forming a front volume in front of the driver and a back volume behind the driver. An acoustic insert is positioned behind the driver assembly and attached to an interior surface of the housing such that it forms a bass channel that is routed from the back volume to a vent in the housing.

公开(公告)号：US20210152912A1

公开(公告)日：2021-05-20

申请号：US17131610

申请日：2020-12-22

Applicant: Apple Inc.

Inventor： Arun D. Chawan ,  Kurt Stiehl ,  Benjamin A. Cousins ,  Jonathan S. Aase ,  Yacine Azmi ,  Paul Choiniere ,  Scott W. Slabaugh

IPC: H04R1/10 ,  A45C11/00 ,  H04R5/033 ,  A45C13/02 ,  H02J50/10 ,  H02J7/00 ,  H04R1/28 ,  H04R1/34 ,  B65D25/02 ,  B65D43/16 ,  H04R1/02 ,  H04B1/3888 ,  H04B5/00 ,  A45C11/24 ,  A45C13/10 ,  H04R9/02 ,  H04R9/06 ,  H01R13/52 ,  A45C13/00

Abstract: An earbud includes a housing that includes a driver assembly positioned within the housing forming a front volume in front of the driver and a back volume behind the driver. An acoustic insert is positioned behind the driver assembly and attached to an interior surface of the housing such that it forms a bass channel that is routed from the back volume to a vent in the housing.

公开(公告)号：US10904652B2

公开(公告)日：2021-01-26

申请号：US16430823

申请日：2019-06-04

Applicant: Apple Inc.

Inventor： Arun D. Chawan ,  Kurt Stiehl ,  Benjamin A. Cousins ,  Jonathan S. Aase ,  Yacine Azmi ,  Paul Choiniere ,  Scott W. Slabaugh

IPC: H04R1/10 ,  A45C11/00 ,  H04R5/033 ,  A45C13/02 ,  H02J50/10 ,  H02J7/00 ,  H04R1/28 ,  H04R1/34 ,  B65D25/02 ,  B65D43/16 ,  H04R1/02 ,  H04B1/3888 ,  H04B5/00 ,  A45C11/24 ,  A45C13/10 ,  H04R9/02 ,  H04R9/06 ,  H02J7/02 ,  H01R13/52 ,  A45C13/00 ,  H04B1/3827 ,  H04M1/60 ,  F16B1/00

Abstract: An earbud includes a housing that includes a driver assembly positioned within the housing forming a front volume in front of the driver and a back volume behind the driver. An acoustic insert is positioned behind the driver assembly and attached to an interior surface of the housing such that it forms a bass channel that is routed from the back volume to a vent in the housing.

公开(公告)号：US10681446B2

公开(公告)日：2020-06-09

申请号：US16430773

申请日：2019-06-04

Applicant: Apple Inc.

Inventor： Arun D. Chawan ,  Kurt Stiehl ,  Benjamin A. Cousins ,  Jonathan S. Aase ,  Yacine Azmi ,  Paul Choiniere ,  Scott W. Slabaugh

IPC: H04R25/00 ,  H04R1/10 ,  A45C11/00 ,  H04R5/033 ,  A45C13/02 ,  H04R1/28 ,  H04R1/34 ,  B65D25/02 ,  B65D43/16 ,  H04R1/02 ,  H04B1/3888 ,  H04B5/00 ,  A45C11/24 ,  A45C13/10 ,  H04R9/02 ,  H04R9/06 ,  H02J7/00 ,  H02J7/02 ,  H01R13/52 ,  A45C13/00 ,  H04B1/3827 ,  H04M1/60 ,  F16B1/00

Abstract: An earbud includes a housing that includes a driver assembly positioned within the housing forming a front volume in front of the driver and a back volume behind the driver. An acoustic insert is positioned behind the driver assembly and attached to an interior surface of the housing such that it forms a bass channel that is routed from the back volume to a vent in the housing.

公开(公告)号：US20190289381A1

公开(公告)日：2019-09-19

申请号：US16430773

申请日：2019-06-04

Applicant: Apple Inc.

Inventor： Arun D. Chawan ,  Kurt Stiehl ,  Benjamin A. Cousins ,  Jonathan S. Aase ,  Yacine Azmi ,  Paul Choiniere ,  Scott W. Slabaugh

IPC: H04R1/10 ,  A45C11/24 ,  H02J7/02 ,  A45C13/02 ,  H04R1/28 ,  H04R1/34 ,  B65D25/02 ,  B65D43/16 ,  H04R1/02 ,  H04B1/3888 ,  H04B5/00 ,  A45C13/10 ,  A45C13/00 ,  H04R5/033 ,  A45C11/00 ,  H01R13/52 ,  H02J7/00 ,  H04R9/06 ,  H04R9/02

Abstract: An earbud includes a housing that includes a driver assembly positioned within the housing forming a front volume in front of the driver and a back volume behind the driver. An acoustic insert is positioned behind the driver assembly and attached to an interior surface of the housing such that it forms a bass channel that is routed from the back volume to a vent in the housing.

公开(公告)号：US10397682B2

公开(公告)日：2019-08-27

申请号：US15273683

申请日：2016-09-22

Applicant: Apple Inc.

Inventor： Arun D. Chawan ,  Kurt Stiehl ,  Benjamin A. Cousins ,  Jonathan S. Aase ,  Yacine Azmi ,  Paul Choiniere ,  Scott W. Slabaugh

IPC: H04R1/10 ,  H04R1/28 ,  H04R1/34 ,  B65D25/02 ,  B65D43/16 ,  H04R1/02 ,  H04B1/3888 ,  H04B5/00 ,  A45C11/24 ,  A45C13/10 ,  H04R9/02 ,  H04R9/06 ,  H02J7/00 ,  H02J7/02 ,  H01R13/52 ,  A45C11/00 ,  H04R5/033 ,  A45C13/02 ,  A45C13/00 ,  H04B1/3827 ,  H04M1/60 ,  F16B1/00

Abstract: An earbud includes a housing that includes a driver assembly positioned within the housing forming a front volume in front of the driver and a back volume behind the driver. An acoustic insert is positioned behind the driver assembly and attached to an interior surface of the housing such that it forms a bass channel that is routed from the back volume to a vent in the housing.